Murata-Electronics-DLW21SN181SQ2L
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Reference Only
SpecNo.JEFL243C-0003V-01
P1/9
Chip Common Mode Choke Coil
DLW21SN
□□□
SQ2
□
Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Choke Coil.
2. Part Numbering
(ex.)
DL
(1)
W
21
S
N
371
(6) (7)
(8) (9)
(10)
(6) Impedance (Typ. at 100MHz)
S
Q
2
L
(2) (3)
(4) (5)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L
×
W)
(4) Type
(7) Circuit
(8) Features
(9) Number of Line
(5) Category
(10) Packaging Code
L : Taping / B : Bulk
3. Rating
Common Mode Impedance
Rated Withstanding Rated
DC
Insulation
Customer
Part Number
Murata
Part Number
(at 100MHz,Under Standard Voltage
Voltage
V(DC)
Current Resistance Resistance
Testing Condition)
V(DC)
(mA)
(
Ω
max.) (M
Ω
min.)
(
Ω
)
DLW21SN371SQ2L
DLW21SN371SQ2B
DLW21SN261SQ2L
DLW21SN261SQ2B
DLW21SN181SQ2L
DLW21SN181SQ2B
DLW21SN121SQ2L
DLW21SN121SQ2B
DLW21SN900SQ2L
DLW21SN900SQ2B
DLW21SN670SQ2L
DLW21SN670SQ2B
370 ± 25 %
260 ± 25 %
180 ± 25 %
120 ± 25 %
90 ± 25 %
67 ± 25 %
280
300
330
370
330
400
0.45
0.40
0.35
10
50
125
0.30
0.35
0.25
Operating Temperature : -40 to +85
°
C
Storage Temperature
: -40 to +85
°
C
4. Standard Testing Condition
<
Unless otherwise specified>
<
In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Temperature : Ordinary Temperature
15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
Atmospheric Pressure : 86 to106kPa
5. Style and Dimensions
■
Equivalent Circuits
(2)
(3)
(1)
1.2±0.2
2.0±0.2
(4)
(0.45)
(1)
(0.45)
(2)
No polarity
■
Unit Mass (Typical value)
0.011g
:
Electrode
() : Reference Value
(in mm)
(3)
(4)
6. Marking
No Marking.
7. Electrical Performance
No.
7.1
Item
Common Mode
Impedance (Zc)
Specification
Meet item 3.
Test Method
Measuring Equipment :
KEYSIGHT
4291A or the equivalent
Measuring Frequency : 100±1MHz(ref.item 10,11)
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P2/9
No.
7.2
Item
Withstanding
Voltage
Specification
Products shall not be
damaged.
Test Method
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.
(ref.item 10)
7.3
7.4
Meet item 3.
DC Resistance
(Rdc)
Measuring current : 100mA max.
(ref.item 10)
(
In case of doubt in the above mentioned standard
condition, measure by 4 terminal method.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max.
(ref.item 10)
Insulation
Resistance (I.R.)
8. Mechanical Performance
No.
Item
Specification
Test Method
8.1 Appearance
and Meet
item 5.
Dimensions
Visual Inspection and measured with
Slide Calipers.
8.2 Bonding
Strength No
evidence of coming off
substrate.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Products shall not be
mechanical damaged.
Applying Time : 5±1seconds
Pressure
Substrate
Product
Test board fixture
8.3
Meet Table 1.
Table 1
It shall be soldered on the Glass-epoxy substrate.
Bending Strength
Deflection : 2mm
(t=1.0mm)
Keeping time : 5 seconds
Speed of Applying Force : 0.5mm/s
No damaged
Appearance
Common Mode
Impedance
Change
Pressure jig
R230
F
within
±
20%
Deflection
10M
Ω
min.
I.R.
45
45
Product
Withstanding
Voltage
No damaged
8.4
Drop
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Times : 3 times
8.5 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
Flux:Ethanol solution of rosin,25(wt)% includes
activator equivalent to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C 1minute
Solder : Sn-3.0Ag-0.5Cu
8.6 Solderability
The electrodes shall be at least
90% covered with new solder
coating.
Solder Temperature : 245±3°C
Immersion Time : 4±1 seconds
Immersion and emersion rates : 25mm/s
Stainless tweezers
Please hold product
except these part.
Flux : Ethanol solution of rosin,25(wt)%
includes activator equipment to 0.06 to
0.10(wt)% chlorine
8.7 Resistance
to
Soldering Heat
Meet Table 1.
Pre-Heating : 80 to 120°C, 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 260±5°C
Immersion Time : 5±0.5 seconds
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
9. Environmental Performance
(Products shall be soldered on the substrate.)
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P3/9
No.
9.1
Item
Temperature
Cycle
Specification
Meet Table 1.
Test Method
1 Cycle
Step 1
-40°C(+0°C,-3°C) / 30±3 min
Step 2
Ordinary Temp. / 10 to 15 minutes
Step 3
+85°C(+3°C,-0°C) / 30±3 min
Step 4
Ordinary Temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the
room condition for 4 to 48 hours
9.2
9.3
9.4
Humidity
Temperature : 40±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Heat life
Temperature : 85±2°C
Applying Voltage : 2times for Rated Voltage
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
(ref.item 10)
Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Cold Resistance
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No.
Item
Terminal to be Tested
10.1
Common Mode Impedance
(Measurement Terminal)
Terminal
Terminal
10.2
10.3
Withstanding Voltage
(Measurement Terminal)
Terminal
Terminal
DC Resistance
(Measurement Terminal)
Terminal
Terminal
Terminal
Terminal
10.4
10.5
Insulation Resistance
(Measurement Terminal)
Terminal
Terminal
Heat Life(Supply Terminal)
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go
Bo.
(2) Measure impedance of the fixture(shorted), Rs
Xs.
(3) Measure admittance of the specimen, Gm
Bm.
(4) Calculate corrected impedance
Z
using the formula below.
Z
= (Rx
2
+Xx
2
)
1/2
Where
Gm-Go
Rx =
Xx =
– Rs
– Xs
(Gm-Go)
2
+ (Bm-Bo)
2
-(Bm- Bo)
(Gm-Go)
2
+ (Bm-Bo)
2
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P4/9
specified in item 16 except the case of being specified special condition.
13. Impedance Frequency Characteristics(Typical)
10000
DLW21SN900SQ2
DLW21SN670SQ2
DLW21SN371SQ2
DLW21SN261SQ2
DLW21SN181SQ2
DLW21SN121SQ2
Common Mode
1000
100
10
DLW21SN261SQ2
DLW21SN900SQ2
DLW21SN181SQ2
Differential Mode
1
DLW21SN121SQ2
DLW21SN670SQ2
DLW21SN371SQ2
0.1
1
10
100
1000
f (MHz)
14. Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
Sprocket Hole
1.5±
0.1
0.25±0.05
φ
4.0±0.1
2.0±0.05
0
*
Dimension of the Cavity is measured
at the bottom side.
1.4±0.1
4.0±0.1
Direction of feed
1.45±0.1
Cavity
(in mm)
14.2 Specification of Taping
(1)Packing quantity(Standard quantity)
2000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
Sprocket hole shall be located on the left hand side toward the direction of feed.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous.The specified quantity per reel is kept.
14.3 Pull Strength of Plastic Tape
Plastic Tape
5N min.
Cover Tape
14.4 Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm / min
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P5/9
14.5 Dimensions of Leader-tape, Trailer and Reel
Trailer
Leader
2.0±0.5
160 min.
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
φ
60±
1
φ
0
21.0±0.8
φ
Direction of feed
9±
1
0
13±1.4
180
±
0
φ
3
14.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
∗
1), RoHS
Marking
(
∗
2), Quantity, etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Second digit
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS
Marking
»
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS
Marking
(
∗
2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
Label
W
D
H
186
186
93
5
H
∗
Above Outer Case size is typical. It depends on a quantity of an order.
D
W
!
15.
△
Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
Ｚ
Ｚ
right direction
wrong direction
15.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life, body
or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P6/9
16. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
16.2 Assembling
<Exclusive use of Reflow soldering>
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
16.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
16.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the
resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
16.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［
Products direction
］
a
Products shall be location the sideways
b
Direction (Length : a<b) to the mechanical
Stress.
Poor example
〈
〉
Good example
〈
〉
(2)
Component
s location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
D
A
Slit
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P7/9
(3) Mounting
Component
s Near Screw Holes
When a
component
is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the
component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
Portion of
Perforation
16.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
×
P.C.B. shall be designed so that products are
far from the portion of perforation.
P.C.B.
○
○
Product
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Portion of
Perforation
×
○
×
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
P.C.B.
Product
Hole
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Pic
k
–
u
p nozzle
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
Product
P.C.B.
< P.C.B. Separation >
Support pin
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.7 Standard Land Dimensions (Reflow)
2
∗
1
∗
3
∗
Resist
Copper foil pattern
0.8
2.6
No pattern
(in mm)
∗
1
If the pattern is made with wider than 1.2mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
∗
2
If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred deu to the spread of soldering paste or mount placeing accuracy.
∗
3
If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.
∗
4
Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
P8/9
16.8 Standard Soldering Condition
1.Reflow Soldering
(1)Standard printing pattern of solder paste
•
Standard thickness of the solder paste
should be 100 to 150µm.
•
Use the solder paste printing pattern of the
right pattern.
•
For the resist and copper foil pattern, use
standard land dimensions.
•
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
•
Spread of soldering paste between lines may
cause short circuit of lines.
0.8
2.6
(in mm)
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration
in insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃/10s
230℃
245±3℃
220℃
Limit Profile
180
150
Standard Profile
30～60s
60s max.
90s±30s
Time（ｓ）
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C
、
10s
Peak temperature
Cycle of reflow
2 times
2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
·
Pre-heating: 150°C, 1 min
·
Tip temperature: 350°C max.
·
Soldering time : 3(+1,-0) seconds.
· Soldering iron output: 30W max.
· Tip diameter:
φ
3mm max.
· Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JEFL243C-0003V-01
3. Solder Volume
P9/9
Solder shall be used not to be
exceeded
the upper limits as shown below.
Upper limit
Recommendable
ｔ
T
1/3T t T
(T:Tickness of electrode)
≦≦
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
16.9 Caution for use
tweezer
･
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
･
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
16.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·
Products should be stored in the warehouse on the following conditions.
Temperature
：
-10 ~ +40°C
Humidity
：
15 to 85% relative humidity
No rapid change on temperature and humidity.
·
Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
·
Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
·
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·
Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
17.
△
Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
