Murata-Electronics-BLM03HD152FZ1D
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Reference Only
Spec.No.JENF243A-9127E-01
P.1/8
Chip Ferrite Bead BLM03H
□□□□□
Z
1D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM03H_
Z
series based on
AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex.) BL
M
(2)
03
(3)
HG
(4)
601
(5)
S
Z
1
(8)
D
(9)
(1)
(6) (7)
(1)Product ID
(2)Type
(4)Characteristics
(5)Typical Impedance at 100MHz
(7)Category(for Automotive Electronics)
(8)Numbers of Circuit
(3)Dimension (L×W)
(6)Performance(S:general/F:Low Rdc)
(9)Packaging (D:Taping)
3.Rating
DC Resistance
(
Ω
max.)
(refer to below
comment)
Impedance (
Ω
)
Rated
Current
(mA)
ESD Rank
2 :2kV
(Under Standard
Customer
Part Number
MURATA
Part Number
Testing Condition)
Initial
Values
Values After
at100MHz
at1GHz
Testing
1.7
600
±
25
％
1000
±
25
％
1200
±
25
％
1000
±
40%
1800
±
40%
2000
±
40%
BLM03HG601SZ1D
BLM03HG102SZ1D
150
125
1.6
2.6
2.7
BLM03HG122SZ1D
BLM03HB191SZ1D
BLM03HB401SZ1D
BLM03HD331SZ1D
BLM03HD471SZ1D
BLM03HD601SZ1D
BLM03HD102SZ1D
BLM03HD102FZ1D
BLM03HD152FZ1D
BLM03HD182FZ1D
100
150
125
200
175
150
120
135
120
100
3.5
2.0
2.8
1.0
1.3
1.7
2.9
2.4
3.1
3.8
3.6
2.1
2.9
1.1
1.4
1.8
3.0
2.5
3.2
3.9
190
±
25
％
400
±
25
％
330
±
25
％
470
±
25
％
600
±
25
％
1000
±
25
％
1000
±
25
％
1500
±
25
％
1800
±
25
％
1150
±
40%
1850
±
40%
750
±
40%
2
1000
±
40%
1500
±
40%
2300
±
40%
2300
±
40%
2700
±
40%
3000
±
40%
■
Operating Temperature : -55°C to +125°C
■
Storage Temperature : -55°C to +125°C
<
In case of doubt
>
Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Temperature : 20
°
C
±
2
°
C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
4.Style and Dimensions
0.6±0.03
0.3±0.03
■
Equivalent Circuit
Resistance element becomes
dominant at high frequencies.
0.15±0.05
(
)
: Electrode
■
Unit Weight (Typical value)
0.3mg
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.2/8
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No.
Item
Specification
Test Method
6-1-1 Impedance
Meet item 3.
Measuring Frequency : 100MHz±1MHz,1GHz
±
1MHz
Measuring Equipment : KEYSIGHT4291A or the
equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance
of the Substrate and Wire
6-1-2 DC
Resistance
Meet item 3.
6-2.Mechanical Performance
(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
Table A
Appearance No
damage
Impedance
Change
(at 100MHz)
DC
Within ±30%
Meet item 3.
Resistance
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Meet Table A after testing.
Set for 24hours
at room temperature,
then measured.
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
Operational Life
External Visual
1000hours at 85 deg C, 85%RH
Meet Table A after testing.
Apply max rated current.
Meet Table A after testing.
8
9
Apply 125 deg C 1000hours
Set for 24hours at
room temperature,
then measured
Visual inspection
No abnormalities
No defects
10 Physical
Dimension Meet
ITEM 4
（
Style and Dimensions
）
Per MIL-STD-202 Method 215
Not Applicable
12 Resistance
to Solvents
13 Mechanical
Shock
14 Vibration
Per MIL-STD-202 Method 213
Meet Table A after testing.
Condition F:
1500g’s(14.7N)/0.5ms/Half sine
5g’s(0.049N) for 20 minutes
Meet Table A after testing.
12cycles each of 3 oritentations
Test from 10-2000Hz.
15 Resistance
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating: 150C +/-10 deg C, 60s to 90s
Meet Table A after testing.
to Soldering Heat
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.3/8
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Meet Item 3. (Rating)
18 Solderability
Per J-STD-002
Measured : Impedance
Per UL-94
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
No defects
Characterization
20 Flammability
21 Board
Flex
Not Applicable
Epoxy-PCB
(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Murata deviation request: Epoxy-PCB(0.8mm)
Defrection 1mm(min) for BLM03H_FZ
Meet Table A after testing.
22 Terminal
Strength
Per AEC-Q200-006
Per ISO-7637-2
Murata deviation request: 5N
No defects
30 Electrical
Transient
Not Applicable
Conduction
7.Specification of Packaging
7-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
+
0
.1
2.0±0.05
4
.
0±0.1
φ
1
.
5
-0
0
.
55max.
0.36
(Typ.)
Direction of Feed
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within
0.025
% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept..
7-2.Tape Strength
(1)Pull Strength
Cover tape
165 to 180 degree
Cover tape
5N min.
F
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Base tape
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.4/8
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1) , RoHS marking(
∗
2) , Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(
∗
2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
7-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It is depend on a quantity of an
order.
W
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.5/8
8.
！
Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the
product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature
rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains, ships, etc.)
(9) Data-processing equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability
requirements to
the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
•
Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
a
0.25
b
c
0.80
0.30
c
Solder Resist
Pattern
a
b
(in mm)
9-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 150
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
(3) Soldering profile
P.6/8
Temp.
(
℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
9-3. Soldering iron
•
Pre-heating: 150°C, 1 min
•
Tip temperature: 350°C max.
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Soldering time : 3(+1,-0) seconds.
•
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
t
1/3T
≦
t
≦
T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.7/8
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as
possible.
Recommended
Screw Hole
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-9127E-01
P.8/8
9-9.
Cleaning
When cleaning this product, observe the following conditions.
Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product
before use.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature
shall be 40°C max.
(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the
substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always
perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the
products.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner.
When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that
no cleaner is left.
* For other cleaning, please consult our technical department.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 .
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD.
