Murata-Electronics-DLP0QSN900HP2D
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Reference Only
Spec No. : JEFL243E-0022B
-01
P1/9
Chip Common Mode Choke Coil
DLP0QSN
□□□
HP2
□
1. Scope
Reference Specification
This reference specification applies to Chip Common Mode Choke Coil DLP0QSN_HP Series.
2. Part Numbering
(ex.)
DL
(1)
P
0Q
S
N
900
(6)
H
P
2
D
(2) (3) (4) (5)
(7) (8) (9)
(10)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L
×
W) 0Q : 0.65×0.5mm
(4) Type
(6)
Common Mode
Impedance
(7) Circuit
H : Characteristic Impedance
100
Ω
system
(8) Features
(9) Number of Line
(5) Category
N : General Use
(10) Packaging Code
D :
T
a
ping / B : Bulk
3. Rating
Common Mode
Impedance
(
Ω
)
at 100MHz
(Under Standard
T
e
sting Condition)
DC
Insulation
Resistance Resistance
Rated
Current
(mA)
Rated
Voltage
(V(DC))
Withstanding
Voltage
Customer
MURATA
Part Number
Part Number
(Rdc)
(
Ω
)
(I.R.)
(
Ω
)
(V(DC))
DLP0QSN650HP2D
DLP0QSN650HP2B
DLP0QSN900HP2D
DLP0QSN900HP2B
65±30%
90±30%
2.7±30%
3.0±30%
100M
min.
100
5
12.5
Operating
T
e
mperature : -40 to +85°C
Storage
T
e
mperature
: -40 to +85°C
4. Standard Testing Conditions
<
Unless otherwise specified>
<
In case of doubt>
T
e
mperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
T
e
mperature : Ordinary
T
e
mperature
15 to 35°C
Humidity : Ordinary Humidity
25 to 85%(RH)
Atmospheric Pressure : 86 to106kPa
5.Style and Dimensions
■
Equivalent Circuits
(2)
(3)
(1)
(1)
(2)
(3)
(
T
o
p View)
(4)
(4)
No polarity.
(Side View)
(Bottom View)
■
Unit Mass(Typical value)
0.5mg
6.Marking
No Marking.
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P2/9
7. Electrical Performance
No.
7.1
Item
Common Mode
Impedance
Specification
Meet item 3.
T
e
st Method
Measuring Frequency : 100±1MHz
Measuring Equipment :
KEYSIGHT
4291A or the
equivalents
(ref.item 10.)
(
In case of doubt in standard condition, the heat
treatment(200°C, about 10 minutes)shall be applied.
T
e
st Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
7.2
7.3
Withstanding
Voltage
Products shall not be damaged.
Meet item 3.
Charge Current : 1 mA max.(ref.item 10.)
DC Resistance
(Rdc)
Measuring current : 100mA max.
(ref.item 10.)
7.4
7.5
Insulation
Resistance (I.R.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max.
(ref.item 10.)
The rated current is applies.
Rated Current
Self- temperature rise shall be
Limited to 25°C max.
8.Mechanical Performance
No.
8.1
Item
Specification
T
e
st Method
Appearance and
Meet item 5.
Dimensions
Visual Inspection and measured with Slide Calipers.
8.2
Solderability
The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 60
～
90s
Solder : Sn-3.0Ag-0.5Cu
Solder
T
e
mperature : 240±3°C
Immersion Time : 3±0.5s
Immersion and emersion rates : 25 mm / s
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 60
～
90s
Solder : Sn-3.0Ag-0.5Cu
Solder
T
e
mperature : 270±5°C
Immersion Time : 5±1s
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.
It shall be dropped on concrete or steel board.
Method : free fall
8.3
Resistance to
Soldering Heat
Meet
T
a
ble 1.
T
a
ble 1
Appearance No
damaged
Common Mode
Impedance
Change
within
±
20%
100M
Ω
min.
within
±
30%
I.R.
8.4
8.5
Drop
DC Resistance
Change
Height : 1m
The Number of Times : 10 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 15
minutes
Vibration
T
o
tal amplitude : 3.0 mm or Acceleration amplitude
196 m/s
2
whichever is smaller.
T
e
sting Time : A period of 2 hours in each of 3
mutually perpendicular directions.
Substrate : (t =1.0 mm).
8.6
Bending
Strength
Meet
T
a
ble 2.
T
a
ble 2
Deflection : 3 mm
Speed of Applying Force : 1.0 mm / s
Keeping time : 5 seconds
Appearance No
damaged
DC Resistance
within
±
30%
Change
Pressure jig
R230
F
Deflection
Product
45
45
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P3/9
9.Environmental Performance
(Products shall be
soldered
on the glass-epoxy substrate)
No.
9.1
Item
T
e
mperature
Cycle
Specification
Meet
T
a
ble 1.
T
e
st Method
1 Cycle
Step 1
-40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2
Ordinary
T
e
mp. / within 3 min
Step 3
+85(+3°C,-0°C) / 30(+3,-0) min
Step 4
Ordinary
T
e
mp. / within 3 min
T
o
tal of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
9.2
9.3
9.4
Humidity
T
e
mperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
Heat life
T
e
mperature : 85±2°C
T
e
st Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
T
e
mperature : -40± 2°C
(ref. Item 10.)
Cold Resistance
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and
supplying
the voltage,the following terminal is applied.
No. Item
T
e
rminal to be
T
e
sted
10.1 Common
Mode
Impedance
ＯＵＴ
ＩＮ
10.2 Withstanding
Voltage
Insulation Resistance
Heat Life
ＩＮ
ＯＵＴ
10.3 DC
Resistance
ＩＮ
ＯＵＴ
ＩＮ
ＯＵＴ
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance, residual
inductance of test fixture.
To
c
orrect this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go
Bo.
(2) Measure impedance of the fixture(shorted), Rs
Xs.
(3) Measure admittance of the specimen, Gm
Bm.
(4) Calculate corrected impedance
Z
using the formula below.
Z
= (Rx
2
+Xx
2
)
1/2
Where
Gm – Go
Rx =
－
Rs
－
Xs
(Gm-Go)
２
+ (Bm-Bo)
２
– (Bm – Bo)
Xx =
(Gm-Go)
２
+ (Bm-Bo)
２
12.
P
.
C.B., Flux, Solder and Soldering condition
T
e
st shall be done using
P
.
C.B., Flux, Solder and Soldering condition which are specified in item 16 except the
case of being specified special condition.
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P4/9
13.Impedance Frequency Characteristics(Typical)
Scc21
Sdd21
14.Specification of Packaging
14.1 Appearance
and Dimensions ( 8mm-wide, 2mm pitch paper tape)
(2)
(1)
(4)
2.0±0.05
+0.1
-0
(3)
2.0±0.05 4.0±0.1
φ1.5
＊
(1)(2)(3)(4) indicates
terminal number
(in:mm)
0.60±0.03
0.43 Max.
Direction of Feed
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P5/9
14.2 Specification
of Taping
(1)Packing quantity(Standard quantity)
15000 pcs. / reel
(2)
T
a
ping
Products shall be packaged in the cavity of the base tape(paper tape) of 8mm-wide, 2mm-pitch
continuously
and sealed by cover tape .
(3)Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point:The base tape and cover tape have no spliced point
(5)Cavity:There shall not be burr in the cavity.
(6)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
14.3 Pull
Strength of Plastic Tape
Paper
T
a
pe
Cover
T
a
pe
5N min.
10N min.
14.4 Peeling
off force of Cover Tape
0.1 to 0.6N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
Cover tape
165 to 180 degree
F
Base tape
Leader
14.5 Dimensions of Leader-tape, Trailer and Reel
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
φ
60±
1
φ
0
21.0±0.8
φ
Direction of feed
9±
1
0
13±1.4
180
±
0
φ
3
(in:mm)
14.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
∗
1), RoHS marking(
∗
2), Quantity, etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
:
Y
e
ar
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(
∗
2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P6/9
!
15.
△
Caution
15.1 Mounting
Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction causes not only open or short circuit but also flames or
other serious trouble.
Ｚ
Ｚ
right direction
15.2 Limitation
of Applications
wrong direction
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or
property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
16. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux
and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is
limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
16.3 Resin
coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention
regarding
P
.
C.B. bending
The following shall be considered when designing and laying out
P
.
C.B.’s.
(1)
P
.
C.B. shall be designed so that products are not subject to the mechanical stress due to warping the
board.
［
Products direction
］
Products shall be location the sideways
a
Direction (Length : a<b) to the machanical
b
Stress.
Poor example
〈
〉
Good example
〈
〉
［
Warping
direction
］
roducts(
warping
direction 1,
warping
direction
2) shall be located carefully so that products
are not subject to the mechanical stress due to
warping
the board. Because they may be
subjected the mechanical stress in order of
warping
direction 1
>
warping
direction 2.
a
a
b
b
〈
Warping direction 1
〉
〈
Warping direction 2
〉
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P7/9
(2)Components location on
P
.
C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
B
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
D
A
Sl
it
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
Portion of
Perforation
16.5 Attention
Regarding
P
.
C.B. Design
< The Arrangement of Products >
×
P.C.B.
○
P
.
C.B. shall be designed so that products are
far from the portion of perforation.
○
Product
Portion of
Perforation
×
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of
P
.
C.B. separation.
○
×
P.C.B.
Products shall not be arranged on the line
of a series of holes when there are big
holes in
P
.
C.B.
Product
Hole
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Pic
k
–
u
p nozzle
Support pins shall be set under
P
.
C.B .
to prevent causing a warp to
P
.
C.B.
during placing the products on the other
side of
P
.
C.B.
Product
P.C.B.
<
P
.
C.B. Separation >
Support pin
P
.
C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause
P
.
C.B. bending.
16.6 Attention
Regarding
P
.
C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 0603 size.
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P8/9
16.7 Standard
Land Dimensions
＊
(1)(2)(3)(4) indicates terminal number.
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in: mm)
16.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s
～
60s
60s max.
90s±30s
(
s)
Time
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Heating
above 230°C
、
60s max.
260°C
、
10s
Peak temperature
Cycle of reflow
2 times
2 times
(1) Standard printing pattern of solder paste
•
•
•
•
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use Sn-3.0Ag-0.5Cu solder.
(2) Reworking with Soldering iron
This product can not rework with soldering iron.
(3) Solder Volume
(in: mm)
Solder shall be used not to be exceeded the upper limits as shown
Unsuitability
Recommendable
Upper Limit
Accordingly increasing
ess to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD
Reference Only
Spec No. : JEFL243E-0022B
-01
P9/9
16.9 Cleaning
Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and
P
.
C.B..
・
Power : 20W/ l max.
・
Frequency : 28kHz to 40kHz
・
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
•
Isopropyl alcohol (IPA)
2. Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.11 Operating
Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance,
such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.12 Storage
Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
•
Products should be stored in the warehouse on the following conditions.
T
e
mperature : -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
•
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the
following deterioration.
Poor solderability due to the oxidized electrode.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
17.
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)
Y
o
u are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
