Slkor-SLKORMICRO-Elec–SL4N65F

Part #Slkor-SLKORMICRO-Elec–SL4N65F
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Slkor-SLKORMICRO-Elec–SL4N65F
SL4N65  
N-CHANNEL MOSFET  
主要参数
MAIN CHARACTERISTICS  
4A  
I

D  

650V  
2.6Ω  
18nC  
V

DSS  

DS(ON)

(
V

GS

=10V
)  
Q

G  

R
用途  
APPLICATIONS  
高频开关电源  
电子整流器  
LED
电源  
High efficiency switch mode power supplies  
Electronic lamp ballasts based on half bridge  
LED power supplies  
产品特性  
FEATURES  
低栅极电荷  
1 Gate  
Low gate charge  
Low C

RSS

(typical 50pF)  
Fast switching  
低
C

RSS

(
典型值
50pF)  
开关速度快  
2 Drain  
3 Source  
100%
雪崩测试  
高抗
dv/dt
能力  
RoHS
产品  
100% avalanche tested  
Improved dv/dt capability  
RoHS product  
订货信息
ORDER MESSAGE  
订货型号  
印记  
封装  
无卤素  
包装  
器件重量  
Order codes  
Marking  
Package  
Halogen Free  
Packaging  
Device Weight  
SL4N65F  
SL4N65F  
TO-220FT  
IPAK  
否
NO  
否
NO  
否
NO  
条管
Tube  
条管
Tube  
条管
Tube  
2.2g(typ)  
0.35g(typ)  
0.3g(typ)  
SL4N65I  
SL4N65I  
SL4N65D  
DPAK  
SL4N65D  
1

SL4N65  
绝对值
ABSOLUTE RATINGS
(T

C

=25
℃
,unless otherwise specified)  
数值  
Ratings  
项目  
Parameter  
符号  
Symbol  
单位  
Unit  
IPAK  
DPAK  
650  
TO-220FT  
漏极-源极击穿电压  
Drain-Source Breakdown Voltage  
V

DSS  

I

D  

V
4

*  

A
A
T

C

=25
℃  
T

C

=100°
℃  
漏极连续电流  
Continuous Drain Current  
2.5

*  

漏极脉冲电流(注
1
)  
Drain Current pulsed
(
note 1
)  
最高栅源电压  
I

DM  

V

GSS  

E

AS  

16

*  

±30  
184  
15  
A
V
Gate-Source Voltage  
单脉冲雪崩能量(注
2
)  
mJ  
mJ  
V/ns  
Single Pulsed Avalanche Energy
(
note 2
)  
重复雪崩能量(注
1
)  
Repetitive Avalanche Current
(
note 1
)  
二极管反向恢复最大电压变化速率(注
3
)  
Peak Diode Recovery dv/dt
(
note 3
)  
E

AR  

dv/dt  
5
T

C

=25
℃  
157.1  
1.26  
144.4  
1.15  
23.3  
0.19  
W
耗散功率  
P

D  

Total Power Dissipation  
Derate above 25
℃  
W/
℃  
最高结温  
℃
℃
℃
T

J  

T

STG  

T

L  

150  
-55
~
+150  
300  
Operating Junction Temperature  
存储温度  
Storage Temperature  
焊接温度  
Maximum Temperature for Soldering Leads  
*
漏极电流由最高结温限制。  
* Drain current is limited by junction temperature.  
电特性
ELECTRICAL CHARACTERISTICS
(
T

J

=25
℃
,unless otherwise specified
)  
项目  
符号  
测试条件  
最小值  
典型值  
最大值  
单位  
Parameter  
Symbol  
Test conditions  
Min  
Typ  
Max  
Unit  
断态特性
Off Characteristics  
漏-源击穿电压  
BV

DSS  

I

D

=250
μ
A, V

GS

=0V  
650  
–
–
–
–
V
Drain-Source Breakdown Voltage  
击穿电压温度特性  
I

D

=250
μ
A,  
referenced to 25
℃  
V/
℃  
ΔBV

DSS

/ΔT

J  

0.48  
Breakdown Voltage Temperature  
Coefficient  
V

DS

=650V,V

GS

=0V  
V

DS

=520V,T

C

=125
℃  
V

DS

=0V,V

GS

=30V  
–
–
–
–
–
–
1
μA  
μA  
nA  
漏源极漏电流  
I

DSS  

Drain-Source leakage Current  
50  
栅源极漏电流  
正向
Forward  
100  
I

GSS  

Gate-Source  
leakage current  
反向
Reverse  
V

DS

=0V,V

GS

=-30V  
–
–
-100  
nA  
2

SL4N65  
项目  
Parameter  
符号  
Symbol  
测试条件  
Test conditions  
最小值 典型值  
Typ  
最大值  
单位  
Unit  
Min  
Max  
通态特性
On Characteristics  
阈值电压  
Gate Threshold Voltage  
V

GS(th)  

R

DS(ON)  

g

FS  

V

DS

=V

GS

,

I

D

=250μA  
V

GS

=10V,I

D

=2A  
2.5  
–
–
2
–
4.5  
2.6  
–
V
Ω
S
静态导通电阻  
Static Drain-Source On-Resistance  
正向跨导  
Forward Transconductance  
V

DS

=30V,I

D

=2A(note 4)  
3.5  
动态特性
Dynamic Characteristics  
输入电容  
C

ISS  

C

OSS  

C

RSS  

–
–
–
531  
60  
–
–
–
Input capacitance  
输出电容  
V

DS

=25V,V

GS

=0V,  
pF  
f=1MH  
B
Z
B
Output capacitance  
反向传输电容  
50  
Reverse transfer capacitance  
开关特性
Switching Characteristics  
导通延迟时间  
Turn on delay time  
上升时间  
t

d(ON)  

t

r  

t

d(off)  

t

f  

–
–
–
–
–
–
–
11  
26  
42  
27  
18  
3
–
–
–
–
–
–
–
V

DD

=325V,I

D

=4A,  
R

G

=25Ω  
(
note 4
,
5
)  
Rise time  
ns  
关断延迟时间  
Turn off delay time  
下降时间  
Fall time  
栅极电荷总量  
Total Gate Charge  
栅-源电荷  
Gate-Source charge  
栅-漏电荷  
Q

G  

Q

GS  

Q

GD  

V

DS

=520V,I

D

=4A,  
V

GS

=10V  
(
note 4
,
5
)  
nC  
9
Gate-Drain charge  
源
–
漏二极管特性
Source-Drain Diode Characteristics  
正向连续电流  
Continuous Forward Current  
I

S  

–
–
–
–
–
–
–
4
16  
1.5  
–
A
A
正向脉冲电流  
Pulsed Forward Current  
I

SM  

V

SD  

正向压降  
Forward Voltage  
V

GS

=0V,I

S

=4A  
–
V
反向恢复时间  
Reverse recovery time  
t

rr  

229  
1.6  
ns  
μC  
V

GS

=0V,I

S

=4A,  
dI

F

/dt=100A/
μ
s  
(note 4)  
反向恢复电荷  
Reverse recovery charge  
Q

rr  

–
3

SL4N65  
热特性
THERMAL CHARACTERISTICS  
最大值  
Max  
项目  
Parameter  
符号  
Symbol  
单位  
Unit  
IPAK  
0.8  
DPAK  
0.87  
TO-220FT  
结到管壳的热阻  
Thermal Resistance,Junction to Case  
℃
/W  
℃
/W  
R

th(j-c)  

5.36  
48.7  
结到环境的热阻  
Thermal Resistance,Junction to Ambient  
R

th(j-a)  

81.4  
79.6  
Notes:  
注:  
1:Pulse width limited by maximum junction temperature  
2:L=22.8mH, I

AS

=4A, V

DD

=50V, R

G

=25 Ω,Starting  
T

J

=25
℃  
1:脉冲宽度由最高结温限制  
2:L=22.8mH, I

AS

=4A, V

DD

=50V, R

G

=25
Ω
,起始结  
温 T

J

=25℃  
3:I

SD

≤4A,di/dt ≤100A/μs,V

DD

≤BV

DSS

, Starting  
T

J

=25
℃  
3:I

SD

≤4A,di/dt ≤100A/μs,V

DD

≤BV

DSS

,起始结温  
T

J

=25℃  
4:Pulse Test:Pulse Width ≤300μs,Duty Cycle≤2
%  
5:Essentially independent of operating temperature  
4:脉冲测试:脉冲宽度≤300μs,占空比≤2%  
5:基本与工作温度无关  
4

SL4N65  
特征曲线
TYPICAL CHARACTERISTICS
 
(curves)  
Fig.2. On-resistance variation vs.  
drain current and gate voltage  
Fig.1. On-state Characteristics  
Fig.4. On state current vs.  
Diode forward voltage  
Fig.3. Gate charge characteristics  
Fig.5. Breakdown voltage variation vs.  
Junction temperation  
Fig.6. On resistance variation vs.  
Junction temperature  
5

SL4N65  
Fig.7. Maximum safe operating  
area(TO-220FT)  
Fig.8. Transient thermal response  
curve(TO-220FT)  
Fig.9. Maximum safe operating area(IPAK)  
Fig.10. Transient thermal response  
curve(IPAK)  
Fig.11. Maximum safe operating  
area(DPAK)  
Fig.12. Transient thermal response  
curve(DPAK)  
6

SL4N65  
Fig.13. Capacitance characteristics  
Fig.14. Gate charge test circuit & waveform  
Fig.15. Switching time test circuit & waveform  
7

SL4N65  
Fig.16. Unclamped inductive switching test circuit & waveform  
Fig.17. Peak diode recovery dv/dt test circuit & waveform  
8

SL4N65  
外形尺寸
PACKAGE MECHANICAL DATA  
TO-220FT  
IPAK  
9

SL4N65  
DPAK  
10