STMicroelectronics-STN2NF10

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STMicroelectronics-STN2NF10
STN2NF10  
N-channel 100V – 0.23
Ω
– 2.4A – SO
T
–
223  
S
T
r
ipFET™ II Power MOSFET  
Features  
Type  
V

DSS  

R

DS(on)  

I

D  

STN2NF10  
100V  
< 0.26
Ω
 
2.4A  
2
3
Description  
2
1
This Power MOSFET is the latest development of  
STMicroelectronics unique “single feature size”  
strip-based process. The resulting transistor  
shows extremely high packing density for low on-  
resistance, rugged avalanche characteristics and  
less critical alignment steps therefore a  
SO
T
–
223  
remarkable manufacturing reproducibilit
y
.  
Application  
Internal schematic diagram  
■
Switching application  
– DC-DC
 
converters  
Order code  
Part number  
Marking  
Package  
Packaging  
STN2NF10  
N2NF10  
SO
T
–
223  
T
a
pe & reel  
April 2007  
Rev 6  
1/13  
13  

STN2NF10  
Electrical ratings  
1
Electrical ratings  
Table 1.  
Absolute maximum ratings  
Symbol  
Parameter  
Value  
100  
20  
Unit  
V
V

DS  

V

GS  

I

D  

Drain-source voltage (V

GS

=0)  
Gate-source voltage  
V
Drain current (continuous) at T

C

= 25°C  
Drain current (continuous) at T

C

= 100°C  
2.4  
A
I

D  

1.5  
A
(1)  
Drain current (pulsed)  
Derating factor  
17  
A
I

DM  

0.026  
3.3  
W/°C  
W
(2)  
T
o
tal dissipation at T

C

= 25°C  
P

TOT  

(3)  
Single pulse avalanche energy  
200  
30  
mJ  
E

AS  

dv/dt

(4)  

Peak diode recovery voltage slope  
V/ns  
T

j  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. Pulse
 
width limited by safe operating area  
2. This
 
value is rated according to Rthj-amb, t < 10sec  
3. I

AS

= 2.4A, V

DD

= 30V, Rg=4.7
Ω
, starting Tj = 25°C  
4. I

SD

< 6A, di/dt < 500A/µs, V

DD

= 80% V

(BR)DSS  

Table 2.  
Thermal data  
Symbol  
Parameter  
Value  
38  
Unit  
°C/W  
°C/W  
Rthj-amb

(1)  

Rthj-amb

(2)  

Thermal resistance junction-amb  
Thermal resistance junction-amb  
62.5  
1. When
 
mounted on 1inch² FR-4 board, 2 oz. Cu, (t < 10sec)  
2. When
 
mounted on 1inch² FR-4 board, 2 oz. Cu, (t >10sec)  
3/13  

Electrical characteristics  
STN2NF10  
2
Electrical characteristics  
(T  
=25°C unless otherwise specified)  
CASE  
Table 3.  
On/off states  
Parameter  
Symbol  
Test conditions  
I

D

= 250µA, V

GS

= 0  
V

DS

= Max rating,  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

100  
V
1
10  
1
µA  
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= Max rating,Tc=125°C  
V

DS

= 30
V
,
T
c=125°C  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS

= 20V  
100  
nA  
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10
V
,
I

D

= 1.2A  
Gate threshold voltage  
2
4
V
Static drain-source on  
resistance  
0.23 0.26  
Ω
Table 4.  
Dynamic  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
g

fs  

V

DS

=15
V
,
I

D

=1.2A  
Forward transconductance  
2.5  
S
Input capacitance  
C

iss  

C

oss  

C

rss  

280  
45  
pF  
pF  
pF  
Output capacitance  
V

DS

=25
V
,
f
=1MHz, V

GS

=0  
Reverse transfer  
capacitance  
20  
Q

g  

Q

gs  

Q

gd  

V

DD

=80
V
,
I

D

= 6A  

GS

=10V  
T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
10  
2.5  
4
14  
nC  
nC  
nC  
V
4/13  
 

STN2NF10  
Electrical characteristics  
Table 5.  
Switching times  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
V

DD

=50
V
,
I

D

= 2.4A  
V

GS

=10
V
,
R

G

=4.7
Ω  
t

d(on)  

t

r  

T
u
rn-on delay time  
Rise time  
6
ns  
ns  
10  
V

DD

=50
V
,
I

D

= 2.4A  
V

GS

=10
V
,
R

G

=4.7
Ω  
t

d(off)  

t

f  

T
u
rn-off delay time  
Fall time  
20  
3
ns  
ns  
Table 6.  
Source drain diode  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max
 
Unit  
I

SD  

Source-drain current  
2.4  
17  
A
A
(1)  
Source-drain current (pulsed)  
I

SDM  

(2)  
I

SD

= 2.4A, V

GS

=0  
Forward on voltage  
1.2  
V
V

SD  

t

rr  

I

SD

= 6A, V

DD

=10V  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
70  
175  
5
ns  
nC  
A
Q

rr  

di/dt=100A/µs,Tj=150°C  
I

RRM  

1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration = 300µs, duty cycle 1.5%  
5/13  

Electrical characteristics  
STN2NF10  
2.1  
Electrical characteristics (curves)  
Figure 1.  
Safe operating area  
Output characteristics  
Transconductance  
Figure 2.  
Figure 4.  
Figure 6.  
Thermal impedance  
Figure 3.  
Figure 5.  
6/13  
Transfer characteristics  
Static drain-source on resistance  
 

STN2NF10  
Figure 7.  
Electrical characteristics  
Gate charge vs. gate-source  
voltage  
Figure 8.  
Capacitance variations  
Figure 9.  
Normalized gate threshold voltage
 
Figure 10.
 
Normalized on resistance vs.  
vs. temperature  
temperature  
Figure 11.
 
Source-drain diode forward  
characteristics  
Figure 12.
 
Normalized BV  
vs. temperature  
DSS  
7/13  

Electrical characteristics  
STN2NF10  
Figure 13.
 
Max drain current vs. temperature  
8/13  

STN2NF10  
Test circuit  
3
Test circuit  
Figure 14.
 
Switching times test circuit for  
resistive load  
Figure 15.
 
Gate charge test circuit  
Figure 16.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 17.
 
Unclamped inductive load test  
circuit  
Figure 18.
 
Unclamped inductive waveform  
Figure 19.
 
Switching time waveform  
9/13  

Package mechanical data  
STN2NF10  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a Lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

10/13  

STN2NF10  
Package mechanical data  
SOT-223 MECHANICAL DATA  
mm  
inch  
DIM.  
MIN.  
TYP.  
MAX.  
1.80  
0.80  
3.10  
0.32  
6.70  
MIN.  
TYP.  
MAX.  
0.071  
0.031  
0.122  
0.013  
0.264  
A
B
0.60  
2.90  
0.24  
6.30  
0.70  
3.00  
0.26  
6.50  
2.30  
4.60  
3.50  
7.00  
0.024  
0.114  
0.009  
0.248  
0.027  
0.118  
0.010  
0.256  
0.090  
0.181  
0.138  
0.276  
B1  
c
D
e
e1  
E
3.30  
6.70  
3.70  
7.30  
10

o  

0.130  
0.264  
0.146  
0.287  
10

o  

H
V
A1  
0.02  
P008B  
11/13  

Revision history  
STN2NF10  
5
Revision history  
Table 7.  
Date  
Revision history  
Revision  
Changes  
14-Sep-2006  
29-Mar-2007  
04-Apr-2007  
4
5
6
The document has been reformatted  

Figure 1

has been updated  
New test condition for I

DSS

on

12/13  

STN2NF10  
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13/13