AGM-Semi-AGM3015A
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AGM3015A
●
General Description
Product Summary
The AGM3015A combines advanced trench MOSFET
to provide
technology with a low resistance package
extremely low R
DS(ON)
.
This device is ideal
for load switch and battery
BVDSS
RDSON
ID
protection applications.
30V
1.3mΩ
136A
●
Features
PDFN5*6 Pin Configuration
■
Advance high cell density Trench technology
■
■
Low R
DS(ON)
to minimize conductive loss
Low Gate Charge for fast switching
■
Low Thermal resistance
●
Application
■
MB/VGA Vcore
nd
■
■
■
SMPS 2
Synchronous Rectifier
POL application
BLDC Motor driver
Package Marking and Ordering Information
Quantity
Device Marking
Device
Device Package
Reel Size
Tape width
12mm
AGM3015A
AGM3015A
PDFN5*6
330mm
3000
Table 1.
Absolute Maximum Ratings (TC=25
)
℃
Symbol
Parameter
Drain-Source Voltage (VGS=0V
)
Gate-Source Voltage (VDS=0V)
Value
Unit
VDS
VGS
V
V
30
±20
136
86
(Note 1)
Drain Current-Continuous(Tc=25
℃
)
A
A
A
I
D
c
Drain Current-Continuous(T
=100
℃
)
(Note 2)
I
Drain Current-Continuous@ Current-Pulsed
DM (pluse)
540
63
w
w
Maximum Power Dissipation(Tc=25
℃
)
Maximum Power Dissipation(Tc=100
℃
)
P
D
25
(Note 3)
EAS
T ,T
mJ
℃
61
Avalanche energy
J
STG
Operating Junction and Storage Temperature Range
-55 To 150
Table 2.
Thermal Characteristic
Symbol
Typ
Max
Unit
Parameter
1
—
—
R
θJA
℃
/W
℃
/W
65
Thermal Resistance Junction-ambient (Steady State)
1
R
θJC
Thermal Resistance Junction-Case
2.0
1
VER2.5
AGM3015A
Table 3.
Symbol
Electrical Characteristics (TC=25
unless otherwise noted)
℃
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BV
DSS
V
GS
V
DS
V
GS
=0V I
=250μA
—
—
—
—
1
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
D
30
—
V
=24V,V =0V
GS
μA
nA
I
I
DSS
=±20V,V =0V
DS
—
±
GSS
100
V
V
V
V
V
=V ,I
=250μA
Gate Threshold Voltage
DS GS
D
GS(th)
1.2
—
1.6
95
2.5
—
V
S
g
FS
=5V,I =20A
D
Forward Transconductance
DS
GS
GS
=10V, I
=20A
D
—
—
m
Ω
Ω
1.3
1.5
R
Drain-Source On-State Resistance
DS(on)
=4.5V, I
=15A
D
2.4
m
2.1
Dynamic Characteristics
—
—
—
—
—
—
C
C
C
Input Capacitance
pF
iss
2091
1539
147
VGS=0V,
Output Capacitance
oss
rss
VDS=15V,
F=1MHZ
pF
pF
Reverse Transfer Capacitance
=0V,
=0V,f=1.0MHz
VGS
VDS
—
—
Rg
Gate resistance
Ω
1.2
Switching Times
Turn-on Delay Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
t
nS
nS
nS
nS
nC
nC
nC
d(on)
6.2
7.8
35
t
t
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
r
VGS=10V,VDS=15V,
RL=0.75Ω,RGEN=6Ω
d(off)
t
f
20
Q
Q
g
32
VGS=10V, VDS=15V,
ID=20A
gs
gd
15.4
4.4
Q
Source-Drain Diode Characteristics
VG=VD=0V , Force
Current
VGS=0V,IS=20A
I
SD
Source-Drain Current(Body Diode)
Forward on Voltage
—
—
—
136
1.2
A
V
—
40
35
V
SD
ns
t
rr
Reverse Recovery Time
Reverse Recovery Charge
—
—
—
—
IF=20A , dI/dt=100A/µs ,
nc
TJ=25
℃
Q
rr
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: T
=25
℃
J
2
VER2.5
AGM3015A
Typical Electrical & Thermal Characteristics
30
24
18
12
6
150
V
GS
= 10V
V
GS
= 3.5V
V
DS
= 5.0V
V
GS
= 5.0V
V
GS
= 4.5V
V
GS
= 4.0V
120
90
60
30
0
T
J
= 125°C
V
GS
= 3.0V
T
J
= 25°C
V
GS
= 2.7V
V
GS
= 2.5V
0
1
1.5
2
2.5
V
GS
(V)
3
3.5
0
0.6
1.2
1.8
V
DS
(V)
2.4
3
100
1.2
Figure 1:
Saturation Characteristics
Figure 2:
Transfer Characteristics
4
3.2
2.4
1.6
0.8
0
2.5
2
V
GS
= 10V
I
D
= 20A
V
GS
= 4.5V
1.5
1
V
GS
= 10V
V
GS
= 4.5V
I
D
= 15A
0.5
0
0
20
40
60
80
-50
0
50
100
150
Temperature (
C)
I
D
(A)
Figure 4:
R
DS(ON)
vs. Junction Temperature
Figure 3:
R
DS(ON)
vs. Drain Current
100
10
10000
1000
100
10
C
iss
C
oss
T
J
= 125°C
1
C
rss
0.1
T
J
= 25°C
0.01
0.001
1
0
6
12
18
V
DS
(V)
24
30
0.0
0.2
0.4
0.6
0.8
1.0
V
SD
(V)
Figure 5:
Body-Diode Characteristics
Figure 6:
Capacitance Characteristics
3
VER2.5
AGM3015A
Typical Electrical & Thermal Characteristics
75
60
45
30
15
0
150
120
90
60
30
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
T
CASE
(
C)
T
CASE
(
C)
Figure 7:
Current De-rating
Figure 8:
Power De-rating
1000
100
10
500
400
300
200
100
0
Limited by
R
DS(ON)
1.0
s
10
s
100
s
1.0ms
10ms
DC
1
T
J_Max
= 150°C
T
C
= 25°C
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
0.1
1
10
100
V
DS
(V)
Pulse Width (s)
Figure 9:
Maximum Safe Operating Area
Figure 10:
Single Pulse Power Rating, Junction-to-Case
10
Duty Cycle = T
on
/T
Peak
T
J
= T
C
+ P
D
x Z
JC
x R
JC
R
JC
= 1.5
°
C/W
1
0.1
Duty = 0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11:
Normalized Maximum Transient Thermal Impedance
4
VER2.5
AGM3015A
R
DS
)
vs. V
GS
Gate Charge
(
ON
10
8
10
8
I
D
= 20A
V
DS
= 15V
D
= 20A
I
6
6
4
4
2
2
0
0
2
4
6
8
10
12
0
7
14
21
Q
g
(nC)
28
35
V
GS
(V)
5
VER2.5
AGM3015A
PDFN5*6 Package Outline Data
MILLIMETER
Typ.
SYMBOL
MIN
MAX
A
A1
A2
D
0.900
1.000
1.100
0.254 REF.
0~0.05
4.900
D2
D
4.824
3.910
4.924
5.924
3.375
5.674
0.350
4.976
4.110
5.076
6.076
3.575
5.826
0.450
D1
D2
E
4.010
5.000
6.000
D1
E1
E2
b
3.475
5.750
0.400
e
1.270 TYP.
0.610
L
0.534
0.424
0.686
0.576
L1
L2
k
0.500
1.800 REF.
1.290
1.190
0.549
ꢀe
1.390
0.701
ꢁꢂe
e
b
H
0.625
©
¶
d
ꢁꢃe
1.100
1.200
1.300
0.100
©
6
VER2.5
AGM3015A
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequences.Do not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the first version issued on March 20th, 2023. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
7
VER2.5
