HUASHUO-HSO8205

Part #HUASHUO-HSO8205
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HUASHUO-HSO8205
HSO8205  
Dual N-ch 20V Fast Switching MOSFETs  
Description  
Product Summary  
V
DS  
20  
27  
6
V
The HSO8205 is the low RDSON trenched N-CH  
MOSFE
T
s
. This product is suitable for Lithium-ion  
battery pack applications.  
R
DS(ON),max  
m
Ω  
A
The HSO8205 meet the RoHS and Green Product  
requirement with full function reliability approved.  
I
D  
⚫
⚫
⚫
⚫
Green Device Available  
Super Low Gate Charge  
Excellent Cdv/dt effect decline  
Advanced high cell density Trench  
technology  
TSSOP8 Pin Configuration  
Absolute Maximum Ratings  
Symbol  
V
DS  
Parameter  
Rating  
Units  
V
Drain-Source Voltage  
20  
±
12  
6
V
GS  
V
Gate-Sou
r
ce Voltage  
I
D
@T
A
=25
℃  
I
D
@T
A
=70
℃  
I
DM  
Continuous Drain Current
1  
Continuous Drain Current
1  
Pulsed Drain Current
2  
Total Power Dissipation
3  
Storage
T
e
mperature Range  
A
5.4  
A
24  
A
P
D
@T
A
=25
℃  
T
STG  
1.5  
W
℃
℃
-55 to 150  
T
J  
Operating Junction Temperature Range  
-55 to 150  
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
R
θ
JA  
Thermal Resistance Junction-ambient
1  
—  
83  
℃
/W  
1
V
e
r 2.0  

HSO8205  
Dual N-ch 20V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V
GS
=0V , I
D
=250uA  
Min.  
20  
—  
—  
0.5  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
BV
DSS  
Drain-Source Breakdown Voltage  
V
V
GS
=4.5V , I
D
=6A  
23  
27  
38  
1.5  
1
R
DS(ON)  
Static Drain-Source On-Resistance
2  
m
 
V
GS
=2.5V , I
D
=5.2A  
V
GS
=V
DS
, I
D
=250uA  
V
DS
=20V , V
GS
=0V , T
J
=25
℃  
V
GS
=
±
12V , V
DS
=0V  
V
DS
=5V , I
D
=3.5A  
30  
V
GS(th)  
I
DSS  
I
GSS  
gfs  
Gate Threshold Voltage  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
0.9  
—  
V
uA  
nA  
S
—  
±
100  
—  
21  
Q
g  
6.1  
1.7  
1.4  
10  
—  
V
DS
=10V , V
GS
=4.5V , I
D
=3A  
nC  
Q
gs  
Q
gd  
T
d(on)  
T
r  
—  
—  
Turn-On Delay Time  
Rise Time  
—  
V
DD
=10V , V
GS
=4.5V , R
G
=3
  
8.2  
2.5  
6
—  
ns  
I
D
=1A  
T
d(off)  
T
f  
Turn-Off Delay Time  
Fall Time  
—  
—  
C
iss  
C
oss  
C
rss  
Input Capacitance  
522  
124  
148  
—  
V
DS
=8V , V
GS
=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V
G
=V
D
=0V , Force Current  
V
GS
=0V , I
S
=1A , T
J
=25
℃  
Min.  
—  
Typ.  
—  
Max.  
6
Unit  
A
I
S  
Continuous Source Current
1,4  
Diode Forward Voltage
2  
V
SD  
—  
—  
1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSO8205  
Dual N-ch 20V Fast Switching MOSFETs  
3
V
e
r 2.0  

HSO8205  
Dual N-ch 20V Fast Switching MOSFETs  
4
V
e
r 2.0  

HSO8205  
Dual N-ch 20V Fast Switching MOSFETs  
TSSOP8 Package Outline Dimensions  
5
V
e
r 2.0