HUASHUO-HSBG2103

Part #HUASHUO-HSBG2103
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HUASHUO-HSBG2103
HSBG2103  
P-Ch 20V Fast Switching MOSFETs  
Description  
Product Summary  
The HSBG2103 is the high cell density trenched P-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
V

DS  

-20  
V
R

DS(ON),typ  

I

D  

350  
-0.65  
m
Ω  
A
The HSBG2103 meet the RoHS and Green Product  
requirement with full function reliability approved.  
⚫
Super Low Gate Charge  
⚫
Low Threshold  
DFN1006 Pin Configurations  
⚫
High-Side Switching  
⚫
Advanced high cell density Trench  
technology  
D
S
G
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-20  
Units  
V
V

DS  

V

GS  

Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
±
10  
V
I

D

@T

A

=25
℃  
I

DM  

Continuous Drain Current, V

GS

@ -4.5V

1  

-0.65  
-2.6  
A
Pulsed Drain Current

2  

A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

0.15  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
830  
Unit  
R

θ
JA  

Thermal Resistance Junction-Ambient

1  

—  
℃
/W  
1
V
e
r 2.0  

HSBG2103  
P-Ch 20V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-20  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
△
BV

DSS

/
△
T

J  

Reference to 25
℃
, I

D

=-1mA  
V

GS

=-4.5V , I

D

=-0.65A  
-0.014  
350  
500  
-0.65  
3.95  
—  
—  
V/
℃  
—  
520  
700  
-1.0  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
 
V

GS

=-2.5V , I

D

=-0.05A  
—  
V

GS(th)  

Gate Threshold Voltage  
-0.35  
—  
V
V

GS

=V

DS

, I

D

=-250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
V

DS

=-16V , V

GS

=0V , T

J

=25
℃  
V

DS

=-16V , V

GS

=0V , T

J

=55
℃  
—  
-1  
I

DSS  

Drain-Source Leakage Current  
uA  
uA  
—  
—  
-5  
V

GS

=
±
10V , V

DS

=0V  
I

GSS  

Q

g  

Gate-Source Leakage Current  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
—  
—  
±
10  
—  
—  
8
V

DS

=-10V , V

GS

=-4.5V , I

D

=-0.3A  
nC  
Q

gs  

—  
1.3  
3.2  
9
Q

gd  

T

d(on)  

Gate-Drain Charge  
—  
Turn-On Delay Time  
—  
—  
V

DD

=-10V , V

GS

=-4.5V , R

G

=3
,  
T

r  

T

d(off)  

T

f  

Rise Time  
—  
—  
—  
—  
—  
—  
6
30  
19  
120  
20  
11  
—  
—  
—  
ns  
I

D

=-0.2A  
Turn-Off Delay Time  
Fall Time  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
V

DS

=-16V , V

GS

=0V , f=1MHz  
pF  
Diode Characteristics  
Symbol  
Parameter  
Diode Forward Voltage

2  

Conditions  
Min.  
Typ.  
Max.  
Unit  
V

SD  

V

GS

=0V , I

S

=-1A , T

J

=25
℃  
—  
—  
-1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSBG2103  
P-Ch 20V Fast Switching MOSFETs  
3
V
e
r 2.0  

HSBG2103  
P-Ch 20V Fast Switching MOSFETs  
4
V
e
r 2.0  

HSBG2103  
P-Ch 20V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSBG2103  
DFN1006  
10000/Tape&Reel  
5
V
e
r 2.0