Diodes-Incorporated-DMN2050LQ-7

Part #Diodes-Incorporated-DMN2050LQ-7
Download 
Diodes-Incorporated-DMN2050LQ-7
DMN2050LQ  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Low On-Resistance  
I

D

Max  
T

A

= +25°C  
BV

DSS  

R

DS(ON)

Max  
29m
@V

GS

= 4.5V  
50m
@V

GS

= 2.5V  
29m
Ω @ V

GS

= 4.5V  
50m
Ω @ V

GS

= 2.5V  
5.9A  
4.3A  
100m
@V

GS

= 2.0V  
20V  
Very Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3
)  
Qualified to AEC-Q101 Standards for High Reliability  
PPAP Capable (Note 4)  
Description and Applications  
This MOSFET is designed to meet the stringent requirements of  
automotive applications. It is qualified to AEC-Q101, supported by a  
PPAP and is ideal for use.  
Mechanical Data  
Case: SOT23  
Case Material: Molded Plastic, “Green” Mo
lding Compound.
 
UL  
Flammability Classification Rating 94V-0  
Moisture Sensitivity:
 
Level 1 per J-STD-020  
Terminal Connections: See Diagram  
Terminals: Finish
Matte Tin Annealed over Copper Leadframe.  
e3  
Solderable per MIL-STD-202, Method 208  
Weight: 0.008 grams (Approximate)  
SOT23  
D
D
G
S
G
Top View  
Pin-Out  
S
Top View  
Equivalent Circuit  
Ordering Information
(Note 5)  
Part Number  
Case  
Packaging  
DMN2050LQ-7  
SOT23  
3000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined
as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to

5. For packaging details, go to our website at

Marking Information  
MN3 = Marking Code  
YM = Date Code Marking  
MN3  
Y
Y or
 
= Year (ex: G = 2019)  
M = Month (ex: 9 = September)  
Date Code Key  
2024  
Year  
2008  
~
2018  
2019  
2020  
2021  
2022  
2023  
Code  
V
~
F
G
H
I
J
K
L
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

DMN2050LQ  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

V

GSS  

I

D  

Value  
20  
Unit  
V
Gate-Source Voltage  
±12  
5.9  
V
Drain Current (Note 6)  
A
Pulsed Drain Current (Note 7)  
21  
A
I

DM  

Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 6)  
Symbol  
P

D  

Value  
1.4  
Unit  
W
Thermal Resistance, Junction to Ambient (Note 6)  
Operating and Storage Temperature Range  
90  
°C/W  
°C  
R

θ
JA  

-55 to +150  
T

J

, T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
V

GS

= 0V, I

D

= 250µA  
20  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

µA  
nA  
V

DS

= 20V, V

GS

= 0V  
I

GSS  

100  
V

GS

=
12V, V

DS

= 0V  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
0.45  
—
24  
42  
68  
8
1.4  
29  
V
V

GS(TH)  

V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 4.5V, I

D

= 5.0A  
V

GS

= 2.5V, I

D

= 3.1A  
V

GS

= 2.0V, I

D

= 1.5A  
V

DS

= 5V, I

D

= 2.1A  
V

GS

= 0V, I

S

= 2.0A  
Static Drain-Source On-Resistance  
—
50  
R

DS(ON)  

m
  
100  
—
Forward Transfer Admittance  
Diode Forward Voltage (Note 8)  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
—
—
s
|Y

fs

|  
V

SD  

0.9  
1.4  
V
—
—
—
—
  
532  
144  
117  
1.3  
—
—
—
—
  
pF  
pF  
pF  
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 10V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1.0MHz  
SWITCHING CHARACTERISTICS
(Note 9)  
Total Gate Charge  
—
  
—
  
—
  
6.7  
0.8  
3.0  
—
  
—
  
—
  
Q

g  

Q

gs  

Q

gd  

V

DS

= 10V, V

GS

= 4.5V, I

D

= 5.0A  
V

DS

= 10V, V

GS

= 4.5V, I

D

= 5.0A  
V

DS

= 10V, V

GS

= 4.5V, I

D

= 5.0A  
Gate-Source Charge  
nC  
Gate-Drain Charge  
Notes:  
6. Device mounted on FR-4 PCB, on 2oz Copper pad layout with R

θJA

= 90°C/W.  
7. Repetitive rating, pulse width limited by junction temperature.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to production testing.  
2 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

DMN2050LQ  
20  
16  
20  
16  
V
= 10V  
GS  
V
= 5V  
DS  
V
= 4.5V  
V
= 3.0V  
GS  
GS  
V
= 2.5V  
GS  
12  
8
12  
8
V
= 2.0V  
GS  

4
0
T =
 
150°C  
4
0
A
T =
 
125°C  
T
= 85°C  
A
A
T
= 25°C  
A
V
= 1.5V  
GS  
T
= -55°C  
A
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristic  
Fig. 1 Typical Output Characteristic  
0.08  
0.07  
0.06  
0.04  
V
= 4.5V  
GS  
T
= 150°C  
A
0.06  
0.05  
0.04  
0.03  
0.02  
T
= 125°C  
= 85°C  
A
V
= 2.5V  
GS  
T
A
A
T
= 25°C  
V
= 4.5V  
= 10V  
GS  
T
= -55°C  
0.02  
A
V
GS  
0.01  
0
0
0
4
8
12  
I

D

, DRAIN CURRENT (A)  
Fig. 4 Typical On-Resistance  
vs. Drain Current and Temperature  
16  
20  
0
4
8
12  
16  
20  
I

D

, DRAIN-SOURCE CURRENT (A)  
Fig. 3
 
Typical On-Resistance  
vs. Drain Current and Gate Voltage  
1.6  
1.6  
1.4  
1.4  
1.2  
1.0  
V
= 10V  
GS  
= 10A  
I
D
I
= 1mA  
D
V
= 4.5V  
1.2  
1.0  
GS  
I
= 5A  
D
I
=
2
5
0
A  
0.8  
0.6  
0.4  
0.2  
0
D
0.8  
0.6  
-50 -25  
T

A

, AMBIENT TEMPERATURE
Fig. 5 On-Resistance Variation with
T
emperature  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
(°C )  
(°C )  
T

A

, AMBIENT TEMPERATURE
Fig. 6 Gate Threshold Variation vs. Ambient
T
emperature  
3 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

DMN2050LQ  
1,000  
20  
16  
T =
 
25°C  

A

C
iss  
C
oss  
12  
C
rss  
100  
8
4
0
10  
0
5
10  
15  
20  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Fig. 7 Diode Forward Voltage vs. Current  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 8 Typical
T
o
tal Capacitance  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
R

θ
JA

(t) = r(t) * R

θ
JA  

R
= 88
℃
 
/
W

θ
JA

0.01  
D = 0.01  
P(pk)  
t
1
D = 0.005  
t
2
T
– T
 
= P * R
 
(t)  
J
A
JA  
Duty Cycle, D = t
 
/t  
D = Single Pulse  
1
2
0.001  
0.00001 0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t

1

, PULSE DUR
A
T
ION TIME (s)  
Fig. 9 Transient Thermal Response  
4 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

DMN2050LQ  
Package Outline Dimensions  
Please see

r the latest version.  
SOT23  
All 7°  
H
SOT23  
Min Max  
GAUGE PLANE  
0.25  
Dim  
A
B
C
D
F
G
H
Typ  
0.40  
1.30  
2.40  
J
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
K
K1  
a
M
A
L
L1  
2.05  
3.00  
1.83  
2.90  
0.05  
J
0.013 0.10  
K
K1  
L
L1  
M
a
0.890 1.00 0.975  
0.903 1.10 1.025  
C
B
0.45  
0.25  
0.61  
0.55  
0.55  
0.40  
0.085 0.150 0.110  
0° 8°
 
—  
D
All Dimensions in mm  
G
F
Suggested Pad Layout  
Please see

r the latest version.  
SOT23  
Y
Dimensions Value
 
(in mm)  
C
X
2.0  
0.8  
Y1  
C
X1  
Y
1.35  
0.9  
Y1  
2.9  
X
X1  
5 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

DMN2050LQ  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
6 of 6  
May 2019  
© Diodes Incorporated  
DMN2050LQ  
Document number: DS41550 Rev. 2 – 2  

Mouser Electronics  
Authorized Distributor  
Click to View Pricing, Inventory, Delivery & Lifecycle Information: