LRC-LN4404T1G

Part #LRC-LN4404T1G
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LRC-LN4404T1G
LN4404T1G  
SO-8  
N-Channel 30-V (D-S) MOSFET  
1. FEATURES  
●
Low RDS(on) trench technology  
●
Low thermal impedance  
●
Fast switching speed  
2. APPLICATIONS  
●
DC/DC Conversion  
●
Power Routing  
●
Motor Drives  
3. DEVICE MARKING AND ORDERING INFORMATION  
Device  
Marking  
Shipping  
LN4404T1G  
4404  
4000/Tape&Reel  
4. MAXIMUM RATINGS(Ta = 25ºC)  
Parameter  
Symbol  
Limits  
30  
Unit  
V
Drain–Source Voltage  
Gate-Source Voltage  
VDSS  
VGS  
IAS  
±20  
V
Avalanche Current  
17  
A
Avalanche energy L=0.1mH  
EAS  
14.5  
16  
mJ  
TA =25
℃
 
TA =70
℃  
Continuous Drain Current(Note 1)  
ID  
A
13.2  
60  
A
A
Pulsed Drain Current(Note 2)  
IDM  
IS  
Continuous Source Current(Diode Conduction)(Note  
4.1  
TA =25
℃  
3.1  
Power Dissipation(Note 1)  
PD  
W
TA =70
℃  
2.2  
℃
Operating Junction and Storage Temperature Range
 
TJ,Tstg  
1. Surface Mounted on 1” x 1” FR4 Board.  
-55~+150  
2.Pulse width limited by maximum junction temperature  
5. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
RΘJA  
Limits  
40  
Unit  
ºC/W  
ºC/W  
Thermal Resistance,  
t
≤
10 sec  
Junction–to–Ambient(Note 1)  
Steady State  
80  
Leshan Radio Company, LTD.  
Rev.C Jun.
 
2019  
1/5  

LN4404T1G  
N-Channel 30-V (D-S) MOSFET  
6. ELECTRICAL CHARACTERISTICS (Ta= 25
ºC
)  
Characteristic  
Symbol  
Min.  
Typ.  
Max.  
Unit  
STATIC  
Gate-Source Threshold Voltage  
(VDS =VGS , ID =250μA)  
VGS(th)  
IGSS  
V
1
–
–
–
–
Gate-Body Leakage Current  
(VDS =0V, VGS =±20V)  
nA  
±100  
Zero Gate Voltage Drain Current  
(VDS = 24 V, VGS = 0 V)  
IDSS  
ID(on)  
µA  
A
–
–
–
–
1
(VDS = 24 V, VGS = 0 V,TJ = 55°C)  
On-State Drain Current(Note 3)  
(VDS = 5 V, VGS = 10 V)  
10  
25  
Drain-Source On-Resistance(Note 3)  
(VGS = 10 V, ID = 12.5 A)  
(VGS = 4.5 V, ID = 10 A)  
RDS(ON)  
mΩ  
–
–
–
–
10  
16.5  
Forward Transconductance(Note 3)  
(VDS = 15 V, ID = 12.5 A)  
Diode Forward Voltage(Note 3)  
(IS = 2.05 A, VGS = 0 V)  
gfs  
S
V
–
–
9
–
–
VSD  
0.77  
DYNAMIC(Note 4)  
Qg  
Qgs  
Qgd  
Ciss  
Coss  
Crss  
td(on)  
tr  
–
–
–
–
–
–
–
–
–
–
10  
4.1  
4.3  
1399  
159  
117  
7
–
–
–
–
–
–
–
–
–
–
Total Gate Charge  
(VDS = 15 V,  
VGS = 4.5 V,ID  
= 12.5 A)  
nC  
pF  
Gate-Source Charge  
Gate-Drain Charge  
Input Capacitance  
(VDS = 15 V,  
VGS = 0 V, f =  
1 MHz)  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
(VDS=15V,RL=  
1.2  
Ω,ID=12.5A,VG  
EN=10V,RG=6  
Ω)  
6
ns  
td(off)  
tf  
29  
9
3.Pulse test; pulse width
≤
300us, duty cycle
≤
2%  
4.Guaranteed by design, not subject to production testing.  
Leshan Radio Company, LTD.  
Rev.C Jun.
 
2019  
2/5  

LN4404T1G  
N-Channel 30-V (D-S) MOSFET  
7.ELECTRICAL CHARACTERISTICS CURVES  
14  
12  
10  
8
12  
VGS=4.0V  
VDS=10V  
VGS=3.0V  
10  
8
VGS=2.8V  
25
℃
 
6
VGS=2.6V  
6
4
-55
℃  
150
℃  
4
VGS=2.4V  
VGS=2.2V  
2
2
0
0
0
1
2
3
4
0
1
2
3
VDS(V)  
VGS(V)  
ID vs. VDS  
ID vs. VGS  
0.02  
0.015  
0.01  
0.005  
0
100  
10  
VGS=4.5V  
VGS=10V  
25
℃  
150
℃  
1
-55
℃  
0.1  
0.01  
0.2  
0.4  
0.6  
0.8  
1
3
6
9
ID(A)  
12  
15  
VSD(V)  
RDS(on) vs. ID  
IS vs. VSD  
Leshan Radio Company, LTD.  
Rev.C Jun.
 
2019  
3/5  

LN4404T1G  
N-Channel 30-V (D-S) MOSFET  
7.ELECTRICAL CHARACTERISTICS CURVES(Con.)  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.20  
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
ID=12.5A  
VGS=4.5V,ID=10A  
25
℃  
VGS=10V,ID=12.5A  
150
℃
 
-55
℃  
2
4
6
8
10  
-50 -25  
0
25 50 75
 
100 125 150  
VGS(V)  
Tj(
℃
)  
RDS(on) vs Tj  
RDS(on) vs. VGS  
1800  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
f=1.0MHz  
ID=250uA  
Ta=25
℃  
Ciss  
Coss  
Crss  
-50 -25  
0
25 50 75
 
100 125 150  
0
10  
20  
30  
Tj(
℃
)  
VDS(V)  
Capacitance  
VGSTH vs. Tj  
Leshan Radio Company, LTD.  
Rev.C Jun.
 
2019  
4/5  

LN4404T1G  
N-Channel 30-V (D-S) MOSFET  
8.OUTLINE AND DIMENSIONS  
Note:  
1. All
 
Dimension Are In mm.  
2. Package
 
Body Sizes Exclude Mold Flash, Protrusion Or Gate Burrs. Mold Flash, Protrusion Or Gate Burrs Shall  
Not Exceed 0.10 mm Per Side.  
3. Package
 
Body Sizes Determined At The Outermost Extremes Of The Plastic Body Exclusive Of Mold
 
Flash, Tie  
Bar Burrs, Gate Burrs And Interlead Flash, But Including Any Mismatch Between The Top And Bottom Of The  
Plastic Body.  
4. The
 
Package Top May Be Smaller Than The Package Bottom.  
5. Dimension
 
“B” Does Not Include Dambar Protrusion. Allowable Dambar Protrusion Shall Be 0.08 mm Total In  
Excess Of “B” Dimension At Maximum Material Condition. The Dambar Cannot Be Located On The Lower Radius  
Of The
 
Foot.  
Leshan Radio Company, LTD.  
Rev.C Jun.
 
2019  
5/5