HL-80N06F

Part #HL-80N06F
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HL-80N06F
N-Ch 60V Fast Switching MOSFETs  
80
N
0
6
F
Green Device  
Product Summary  
Super Low Gate  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
BVDSS  
RDSON  
ID  
technology  
60V  
6mΩ  
80A  
100% EAS Guaranteed  
PDFN5X6 Pin Configuration  
Description  
The 80N06F is the high cell density trenched  
N-ch MOSFETs, which provides excellent  
RDSON and and gate charge for most of the  
synchronous buck converter applications.  
The 80N06F meets the RoHS and Green  
Product requirement 100% EAS guaranteed  
with full function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
60  
±25  
80  
Units  
V
V
A
A
V
DSS  
GSS  
Drain-Source Voltage  
Gate-Source Voltage  
V
T
T
C
C
= 25
℃
 
= 100
℃  
I
D  
Continuous Drain Current  
52  
I
DM  
Pulsed Drain Current

note1  

Single Pulsed Avalanche Energy
note2  
Power Dissipation  
Thermal Resistance, Junction to Case  
Operating and Storage Temperature Range  
320  
169  
108  
1.4  
A
mJ  
W
℃
/W  
℃
EAS  
P
R
, T
STG  
D
T
C
= 25
℃  
θ
JC  
T
J
-55 to +175  
01  

N-Ch 60V Fast Switching MOSFETs  
80N06F  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Test condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
60  
V
(BR)DSS  
DSS  
GSS  
Drain-Source Breakdown Voltage
 
V
GS
=0V, I  
D
=250
μ
A  
–
–
–
–
1
V
μ
A  
nA  
I
I
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
V
V

DS

=60V, V

GS

=0V,  

DS

=0V, V

GS

=±20V  
–
–
±100  
On Characteristics  
2
3
6
4
7
V
GS(th)  
Gate Threshold Voltage  
Static Drain-Source on-Resistance  
note3  
V

DS

=V

GS

, I  
D
=250
μ
A  
V
V

GS

=10V, I

D

=
30A  
R
DS(on)  
–
m
Ω
 
Dynamic Characteristics  
4136  
286  
257  
90  
C
iss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
–
–
–
–
–
–
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V

DS

=30V, V

GS

=0V,  
C
oss  
f=1.0MHz  
C
rss  
Q
Q
Q
g
V
DS
=30V, I  
D
=30A,  
9
gs  
gd  
V

GS

=10V  
18  
Switching Characteristics  
9
7
t
d(on)  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
t
r
V
R

DS

=30V, I  
D
=30A,  
40  
15  
t
d(o
f
f)  
G
=1.8
Ω
, V

GS

=10V  
t
f
Drain-Source Diode Characteristics and Maximum Ratings  
M
a
x
i
mum Continuous Drain to Source Diode Forward Current  
80  
320  
1.2  
–
I
S
–
–
–
–
–
–
–
–
A
A
V
ns  
nC  
I
SM  
Maximum Pulsed Drain to Source Diode Forward Current  
Drain to Source Diode Forward
V
o
ltage  
V
SD  
V
GS
=0V, I
S
=30A  
Body Diode Re
v
e
rse Reco
v
e
ry Time  
33  
trr  
Qrr  
I
F  
=30A, dI/dt=100A/
μ
s  
racteristics  
Body Diode Re
v
e
rse Reco
v
e
ry Charge  
46  
–
Notes:  
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2.EAS condition : T

J

=25℃, V
DD
=30V, V
G
=10V, L=0.5mH, Rg=25Ω, IAS=26A  
3.Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%  
02  

N-Ch 60V Fast Switching MOSFETs  

80N06F  
Typical Electrical and Thermal Characteristics (Curves)  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Curren  
Figure 5: Gate Charge Characteristics  
Figure 4: Body Diode Characteristics  
Figure 6: Capacitance Characteristics  
03  

N-Ch 60V Fast Switching MOSFETs  

8
0
N
0
6
F
Typical Performance Characteristics  
Figure 7: Normalized Breakdown Voltage vs. Junction
T
F
e
i
m
g
u
p
r
er
8
a
:
t
u
N
r
o
e
r
malized on Resistance vs. Ju  
0.1  
Figure 9: Maximum Safe Operating Area  
FFigure 10: Maximum Continuous Drain Curr  
Figure 11:Maximum Continuous Drain Curren  
Figure 10: Maximum Effective  
Transient Thermal Impedance, Junction-to-Case  
04  

N-Ch 60V Fast Switching MOSFETs  
80N06F  
Package Mechanical Data-DFN5*6-8L-JQ Single  
05