Microchip-Tech-APT54GA60BD30

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Microchip-Tech-APT54GA60BD30
APT54GA60B  
APT54GA60S  
600V  
High Speed PT IGBT  
POWER MOS 8

®

is a high speed Punch-Through switch-mode IGB
T
.
 
L
ow E

off

is achieved  
APT54GA60S  
through leading technology silicon design and lifetime control processes.
 
A reduced E

off  

–
D

3

PAK  
V

CE(ON)

tradeoff results in superior ef
fi
ciency compared to other IGBT technologies.
 
Low  
gate charge and a greatly reduced ratio of C

res

/C

ies

provide excellent noise immunity, short  
delay times and simple gate drive.
 
The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
APT54GA60B  
Single die IGBT  
FEATURES  
TYPICAL APPLICATIONS  
• Fast
 
switching with low EMI  
• Very
 
Low E

off

for maximum ef
fi
ciency  
• Ultra
 
low C

res

for improved noise immunity  
• Low
 
conduction loss  
• ZVS
 
phase shifted and other full bridge  
• Half
 
bridge  
• High
 
power PFC boost  
• Welding  
• Low
 
gate charge  
• UPS,
 
solar, and other inverters  
• High
 
frequency, high ef
fi
ciency industrial  
• Increased
 
intrinsic gate resistance for low EMI  
• RoHS
 
compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
600  
V
V

ces  

I

C1  

Continuous Collector Current @ T

C

= 25°C  
Continuous Collector Current @ T

C

= 100°C  
Pulsed Collector Current

1  

96  
54  
A
I

C2  

I

CM  

161  
V

GE  

Gate-Emitter Voltage

2  

±30  
V
P

D  

T
o
tal Power Dissipation @ T

C

= 25°C  
Switching Safe Operating Area @ T

J

= 150°C  
Operating and Storage Junction
T
e
mperature Range  
416  
W
SSOA  
T

J

, T

STG  

T

L  

161A @ 600V  
-55 to 150  
°C  
Lead
T
e
mperature for Soldering: 0.063″ from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T =
 
25°C unless otherwise speci
fi
ed  
J
Test Conditions  
Min  
Typ  
Max  
Unit  
V

BR(CES)  

Collector-Emitter Breakdown Voltage  
V

GE

= 0V, I

C

= 1.0mA  
600  
T

J

= 25°C  
T

J

= 125°C  
2.0  
1.9  
4.5  
2.5  
V

GE

= 15
V
,  
I

C

= 32A  
V
V

CE(on)  

V

GE(th)  

I

CES  

Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
V

GE

=V

CE

, I

C

= 1mA  
3
6
T

J

= 25°C  
250  
V

CE

= 600V,  
V

GE

= 0V  
μ
A  
T

J

= 125°C  
2500  
±100  
I

GES  

V

GS

= ±30V  
nA  
Thermal and Mechanical Characteristics  
Symbol Characteristic  
Min  
Typ  
–
Max  
.3  
Unit  
°C/W  
g
R

θ
JC  

W

T  

Junction to Case Thermal Resistance  
Package Weight  
–
–
5.9  
–
T
o
rque  
Mounting
T
o
rque (TO-247 Package), 4-40 or M3 screw  
in·lbf  
10  

APT54GA60B_S  
Dynamic Characteristics  
T =
 
25°C unless otherwise speci
fi
ed  
J
Symbol  
C

ies  

Parameter  
Test Conditions  
Capacitance  
Min  
Typ  
4130  
350  
45  
Max  
Unit  
Input Capacitance  
C

oes  

Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
Gate-Emitter Charge  
V

GE

= 0V, V

CE

= 25V  
f = 1MHz  
pF  
C

res  

Q

g

3  

Gate Charge  
158  
26  
Q

ge  

V

GE

= 15V  
nC  
A
V

CE

= 300V  
Q

gc  

Gate- Collector Charge  
52  
I

C

= 32A  
T

J

= 150°C, R

G

= 4.7
Ω

4

, V

GE

= 15V,  
L= 100uH, V

CE

= 600V  
Inductive Switching (25°C)  
V

CC

= 400V  
SSOA  
Switching Safe Operating Area  
161  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-On Delay Time  
Current Rise Time  
17  
20  
ns  
μ
J  
ns  
μ
J  
Turn-Off Delay Time  
Current Fall Time  
112  
86  
V

GE

= 15V  
I

C

= 32A  
R

G

= 4.7
Ω

4  

E

on2  

Turn-On Switching Energy  
Turn-Off Switching Energy  
Turn-On Delay Time  
Current Rise Time  
534  
466  
16  
6
E

off  

T

J

= +25°C  
t

d(on  

t

r  

t

d(off)  

t

f  

Inductive Switching (125°C)  
21  
V

CC

= 400V  
Turn-Off Delay Time  
Current Fall Time  
146  
145  
891  
838  
V

GE

= 15V  
I

C

= 32A  
R

G

= 4.7
Ω

4  

E

on2  

Turn-On Switching Energy  
Turn-Off Switching Energy  
6
E

off  

T

J

= +125°C  
1
2
3
4
5
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
Pulse test: Pulse Width < 380
μ
s
, duty cycle
 
< 2%.  
See Mil-Std-750 Method 3471  
R

G

is external gate resistance, not including internal gate resistance or gate driver impedance.
 
(MIC4452)  
E

on2

is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the IGBT turn on energy loss. A combi device is used for the  
clamping diode.  
E

off

is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.  
Microsemi reserves the right to change, without notice, the speci
fi
cations and information contained herein.  
6

Typical Performance Curves  
APT54GA60B_S  
100  
350  
300  
250  
200  
150  
100  
50  
V
= 15V  
GE  
15V  
13V  
T

J

= 25°C  
T

J

= 55°C  
10V  
75  
50  
25  
T

J

= 125°C  
T

J

= 150°C  
9V  
8V  
7V  
6V  
5V  
28 32  
0
0
0
2
4
6
8
0
4
8
12  
16 20 24  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
CE  
CE  
FIGURE 1,
 
Output Characteristics
 
(T =
 
25°C)  
FIGURE 2,
 
Output Characteristics
 
(T =
 
25°C)  
J
J
200  
150  
100  
50  
16  
14  
12  
10  
250
μ
s PULSE  
TEST<0.5 % DUTY  
CYCLE  
I
= 32A  
C
T
= 25°C  
J
V
= 120V  
CE  
V
= 300V  
CE  
8
V
= 480V  
CE  
6
4
2
0
T

J

= 25°C  
T

J

= -55°C  
T

J

= 125°C  
0
0
2
4
6
8
10  
12  
14  
0
20 40 60 80
 
100 120
 
140 160  
GATE CHARGE (nC)  
V
, GATE-TO-EMITTER VOLTAGE (V)  
GE  
FIGURE 4,
 
Gate charge  
FIGURE 3,
 
Transfer Characteristics  
4
3
2
1
0
4
3
2
1
0
T

J

= 25°C.  
250
μ
s PULSE TEST  
<0.5 % DUTY CYCLE  
I
= 64A  
I
= 64A  
= 32A  
C
C
I
I
= 32A  
C
C
I
= 16A  
C
I
= 16A  
C
V

GE

= 15V.  
250
μ
s PULSE TEST  
<0.5 % DUTY CYCLE  
6
8
10  
12  
14  
16  
0
25  
50  
75  
100  
125  
150  
V
, GATE-TO-EMITTER VOLTAGE (V)  
T , Junction
T
e
mperature (°C)  
GE  
J
FIGURE 5,
 
On State Voltage vs Gate-to-Emitter Voltage  
FIGURE 6,
 
On State Voltage vs Junction Temperature  
1.15  
160  
140  
120  
100  
80  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
0.70  
60  
40  
20  
0
-50 -25  
0
25 50
 
75 100
 
125 150  
25  
50  
75  
100  
125  
150  
T , JUNCTION TEMPERATURE  
T ,
 
Case
T
e
mperature (°C)  
J
C
FIGURE 7,
 
Threshold Voltage vs Junction Temperature  
FIGURE 8,
 
DC Collector Current vs Case Temperature  

Typical Performance Curves  
APT54GA60B_S  
200  
160  
120  
80  
21  
V

CE

= 400V  
T

J

= 25°C
,
or 125°C  
20  
19  
18  
17  
16  
15  
14  
R

G

= 4.7
ꢀ
 
L = 100
μ
H  
V

GE

=15V,T

J

=125°C  
V

GE

=15V,T

J

=25°C  
V
= 15V  
GE  
40  
V

CE

=
400V  
R

G

=
4.7
ꢀ  
L = 100
μ
H  
0
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
40  
50  
60  
70  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 9, Turn-On Delay Time vs Collector Current  
FIGURE 10, Turn-Off Delay Time vs Collector Current  
70  
60  
50  
40  
30  
20  
10  
0
200  
R

G

=
4.7
ꢀ
, L
=
100
μ
H, V

CE

=
400V  
160  
T

J

=
125°C, V

GE

=
15V  
120  
80  
40  
0
T

J

=
25°C, V

GE

=
15V  
T

J

=
25 or 125°C,V

GE

=
15V  
R

G

=
4.7
ꢀ
, L
=
100
μ
H, V

CE

=
400V  
0
10  
20  
30  
40  
50  
60 70  
0
10  
20  
30  
40  
50  
60  
70  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 12, Current Fall Time vs Collector Current  
FIGURE 11, Current Rise Time vs Collector Current  
2400  
2000  
1600  
1200  
800  
2400  
2000  
1600  
1200  
800  
V
V
=
=
400V  
+15V  
V
V
=
=
400V  
+15V  
CE  
GE  
CE  
GE  
R
= 4.7
ꢀ  
R
=4.7
ꢀ  
G
G
T

J

=
125°C  
T

J

=
125°C  
T

J

=
25°C  
T

J

=
25°C  
400  
400  
0
0
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
40  
50  
60 70  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 13, Turn-On Energy Loss vs Collector Current  
FIGURE 14, Turn-Off Energy Loss vs Collector Current  
6000  
5000  
4000  
3000  
2000  
1000  
2400  
V
V
T
=
=
400V  
+15V  
V
V
=
=
400V  
+15V  
E

on2,

64A  
CE  
GE  
CE  
GE  
E

on2,

64A  
= 125°C  
R
= 10
ꢀ  
J
G
2000  
1600  
1200  
800  
E

off,

64A  
E

off,

64A  
E

on2,

32A  
E

off,

32A  
E

on2,

32A  
E

on2,

16A  
E

off,

16A  
E

off,

32A  
E

on2,

16A  
E

off,

16A  
400  
0
0
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
T , JUNCTION TEMPERATURE (°C)  
R ,
 
GATE RESISTANCE (OHMS)  
J
G
FIGURE 16, Switching Energy Losses vs Junction Temperature  
FIGURE 15, Switching Energy Losses vs Gate Resistance  

Typical Performance Curves  
APT54GA60B_S  
10000  
500  
100  
C

ies  

1000  
10  
1
C

oes  

100  
10  
C

res  

0.1  
1
10  
100  
1000  
0
100  
200  
300  
400  
500  
V
, COLLECTOR-TO-EMITTER VOLTAGE  
V
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
CE  
CE  
FIGURE 18,
 
Minimum Switching Safe Operating Area  
FIGURE 17,
 
Capacitance vs Collector-To-Emitter Voltage  
0.35  
0.30  
D = 0.9  
0.25  
0.7  
0.20  
0.5  
Note:  
0.15  
t
1
0.3  
0.10  
t
2
t
0.1  
0.05  
0
1
t
/
2
Duty Factor D =  
Peak T
 
= P
 
x Z  
+ T  
C
J
DM  
θJC  
SINGLE PULSE  
0.05  
10

-5  

10  
10

-3  

10

-2  

-4  
1
0

-1  

1.0  
RECTANGULAR PULSE DURATION (SECONDS)  
Figure 19, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration  

APT54GA60B_S  
10%  
Gate Voltage  
t

d(on)  

T
= 125°C  
J
90%  
APT30DQ60  
t

r  

Collector Current  
Collector Voltage  
V

CE  

V

CC  

I

C  

10%  
5%  
5%  
Switching Energy  
A
D.U.T.  
Figure 12, Inductive Switching Test Circuit  
Figure 13, Turn-on Switching Waveforms and De
fi
nitions  
T
= 125°C  
90%  
t

d(off)  

J
Gate Voltage  
Collector Voltage  
t

f  

10%  
0
Collector Current  
Switching Energy  
Figure 14, Turn-off Switching Waveforms and De
fi
nitions  
TO-247 Package Outline  
D

3

PAK Package Outline  
e3 100%
 
Sn Plated  
e1 SAC:
 
Tin, Silver, Copper  
4.98 (.196)  
5.08 (.200)  
1.47 (.058)  
1.57 (.062)  
4.69 (.185)  
15.95 (.628)  
16.05(.632)  
13.41 (.528)  
13.51(.532)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15(.045)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99(.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.67 (.105)  
2.84 (.112)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.06 (.160)  
(Base of Lead)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
1.016 (.040)  
19.81 (.780)  
20.32 (.800)  
Collector  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.  
1.01 (.040)  
1.40 (.055)  
Gate  
Collector  
}
Emitter  
Emitter  
Collector  
Gate  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters (Inches)  
Dimensions in Millimeters (Inches)