VBsemi-Elec-IRL1104PBF-VB

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VBsemi-Elec-IRL1104PBF-VB
IRL1104PBF  
0
N-Channel 4
 
-V (D-S) MOSFET  
FEATURES  
•
PRODUCT SUMMARY  
V

DS  

TrenchFET

®

Power MOSFET  
4
0
 
6
V
m
Ω
 
A
•
100 % R

g

and UIS Tested  
R

DS(on)

V

GS

= 10 V  
I

D  

RoHS  
1
1
0  
COMPLIANT  
APPLICATIONS  
Configuration  
Single  
•
Synchronous Rectification  
•
Power Supplies  
TO-220AB  
D
G
S
G D S  
N-Channel MOSFET  
Top View  
ABSOLUTE MAXIMUM RATINGS
T =
 
25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
4
0
 
Unit  
V

DS  

Drain-Source Voltage  
Gate-Source Voltage  
V
V

GS  

± 2
0  
1
1
0

a, c  

90

c  

T

C

= 25 °C  

C

= 70 °C  
T
Continuous Drain Current (T

J

= 175 °C)  
I

D  

31

b  

T

A

= 25 °C  
T

A

= 70 °C  
A
25

b  

270  
85  
I

DM  

I

AS  

Pulsed Drain Current  
Avalanche Current Pulse  
Single Pulse Avalanche Energy  
L = 0.1 mH  
E

AS  

320  
V
A
110

a, c  

2.6

b  

T

C

= 25 °C  

A

= 25 °C  
I

S  

Continuous Source-Drain Diode Current  
T
312

a  

T

C

= 25 °C  
T

C

= 70 °C  
T

A

= 25 °C  
T

A

= 70 °C  
200  
P

D  

Maximum Power Dissipation  
W
3.13

b  

2.0

b  

T

J

, T

stg  

Operating Junction and Storage
T
e
mperature Range  
– 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambient

b  

Maximum Junction-to-Case  
Symbol  
R

thJA  

Typical  
Maximum  
Unit  
Steady State  
Steady State  
32  
40  
°C/W  
R

thJC  

0.33  
0.4  
Notes:  
a. Based on T

C

= 25 °C.  
b. Surface Mounted on 1″ x 1″ FR4 board.  
c. Calculated based on maximum junction temperature. Package limitation current is 110 A.  
服务热线:400-655-8788  
1

IRL1104PBF  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
V

DS  

Δ
V

DS

/T

J  

Δ
V

GS(th)

/T

J  

V

GS(th)  

V

GS

= 0
V
,
I

D

= 250 µA  
I

D

= 250 µA  
Drain-Source Breakdown Voltage  
40  
V
V

DS

T
e
mperature Coefficient  
41  
– 8  
mV/°C  
V

GS(th)

T
e
mperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0
V
,
V

GS

= ± 20 V  
V

DS

= 40
V
,
V

GS

= 0 V  

DS

= 40
V
,
V

GS

= 0
V
,
T

J

= 55 °C  
V

DS

≥
5
V
,
V

GS

= 10 V  
V

GS

= 10
V
,
I

D

= 30 A  
1.2  
2.5  
± 100  
1
V
I

GSS  

nA  
I

DSS  

I

D(on)  

R

DS(on)  

g

fs  

Zero Gate Voltage Drain Current  
On-State Drain Current

a  

µA  
A
V
10  
120  
6
7
Drain-Source On-State Resistance

a  

m
Ω  
V

GS

= 4.5
V
,
I

D

= 20 A  
V

DS

= 15
V
,
I

D

= 30 A  
Forward
T
r
ansconductance

a  

Dynamic

b  

180  
S
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
2
9
00  
750  
310  
130  
20  
V

DS

= 20
V
,
V

GS

= 0
V
, f = 1
M
Hz  
Output Capacitance  
pF  
Reverse
T
r
ansfer Capacitance  
T
o
tal Gate Charge  
Q

gs  

Q

gd  

R

g  

V

DS

= 20
V
,
V

GS

= 10
V
,
I

D

= 20 A  
f = 1 MHz  
Gate-Source Charge  
Gate-Drain Charge  
nC  
32  
Gate Resistance  
0.85  
20  
1.3  
30  
Ω
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-On Delay Time  
Rise Time  
11  
17  
V

DD

= 20
V
,
R

L

= 1.0
Ω  
I

D

≅
20 A, V

GEN

= 10
V
,
R

g

= 1
Ω  
T
u
rn-Off Delay Time  
77  
115  
15  
Fall Time  
10  
ns  
T
u
rn-On Delay Time  
102  
62  
155  
95  
Rise Time  
V

DD

= 20
V
,
R

L

= 1.0
Ω  
I

D

≅
20 A, V

GEN

= 4.5
V
,
R

g

= 1
Ω  
T
u
rn-Off Delay Time  
180  
60  
270  
90  
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current

a  

Body Diode Voltage  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 20 A  
110  
200  
1.2  
75  
A
0.8  
50  
70  
30  
20  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Q

rr  

t

a  

105  
I

F

= 20 A, di/dt = 100 A/µs, T

J

= 25 °C  
ns  
t

b  

Notes:  
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
服务热线:400-655-8788  
2

IRL1104PBF  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
250  
5
4
3
2
1
0
V
= 10 thr
u
5
V  
GS  
200  
150  
100  
50  
T
= 125 °C  
= 25 °C  
C
V
= 4
V  
GS  
T
V
GS  
= 3
V  
C
T
C
= – 55 °C  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
2
4
6
8
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
V
GS  
– G
 
a t e – t o – S o
u
rce
V
oltage (
V
)  
Output Characteristics  
Transfer Characteristics  
400  
320  
240  
160  
8
0  
0.01
0
 
0.00
8  
0.00
6
 
0.00
4  
0.00
2  
T
C
= – 55 °C  
T
C
= 25 °C  
V
GS  
= 10
V  
T
C
= 125 °C  
0.0000  
0
0
20  
40  
60  
8
0  
100  
120  
0
15  
30  
45  
60  
75  
90  
I
– Drain C
u
rrent (A)  
D
I
– Drain C
u
rrent (A)  
D
Transconductance  
On-Resistance vs. Drain Current  
10  
8
4200  
3600  
3000  
2400  
1800  
1200  
600  
I
= 20 A  
D
C
iss  
V
DS  
= 20
V  
6
V
DS  
= 10
V  
V
DS  
= 30
V  
4
2
C
oss  
C
rss  
0
0
0
50  
100  
150  
200  
250  
0
10  
20  
30  
40  
50  
60  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
Q
g
–
T
o
tal Gate Charge (nC)  
Capacitance  
Gate Charge  
服务热线:400-655-8788  
3

IRL1104PBF  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
2.0  
100  
10  
1
I
= 30 A  
D
1.7  
1.4  
1.1  
0.
8  
0.5  
V
GS  
= 10
V  
T
J
= 150 °C  
T
J
= 25 °C  
V
GS  
= 4.5
V  
0.1  
0.01  
0.001  
0.0  
0.2  
0.4  
0.6  
0.
8  
1.0  
1.2  
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
V
SD  
– So
u
rce-to-Drain
V
oltage (
V
)  
T
J
– J
u
nction
T
e
mperat
u
re (°C)  
On-Resistance vs. Junction Temperature  
Forward Diode Voltage vs. Temperature  
0.6  
0.2  
0.010  
0.00
8  
0.006  
0.004  
0.002  
0.000  
– 0.2  
– 0.6  
– 1.0  
I
= 5 mA  
D
T
= 150 °C  
J
I
= 250
µ
A  
D
T
= 25 °C  
J
– 50
 
– 25  
0
25  
50  
75  
100 125 150  
0
2
4
6
8
10  
T
J
–
T
e
mperat
u
re (°C)  
V
GS  
– Gate-to-So
u
rce
V
oltage (
V
)  
Threshold Voltage  
On-Resistance vs. Gate-to-Source Voltage  
1000  
Limited
b
y R  
*
DS(on)  
10
µ
s  
100
µ
s  
100  
10  
1 ms  
10 ms  
100 ms, DC  
1
0.1  
0.01  
T
= 25 °C  
C
Single P
u
lse  
B
V
DSS  
0.1  
1
10  
100  
V
DS  
– Drain-to-So
u
rce
V
oltage (
V
)  
*
V
> minim
u
m
V
at
w
hich R
 
is specified  
DS(on)  
GS  
GS  
Safe Operating Area, Junction-to-Ambient  
服务热线:400-655-8788  
4

IRL1104PBF  
TYPICAL CHARACTERISTICS
 
25 °C, unless otherwise noted  
350  
400  
350  
300  
250  
200  
150  
100  
50  
2
8
0  
210  
140  
70  
0
Package Limited  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
J
– J
u
nction to Case (°C)  
T
J
– J
u
nction to Case (°C)  
Current Derating*  
Power Derating  
* The power dissipation P

D

is based on T

J(max)

= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
1
D
u
ty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single P
u
lse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
Sq
u
are
W
a
v
e P
u
lse D
u
ration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
服务热线:400-655-8788  
5

IRL1104PBF  
TO-220AB  
MILLIMETERS  
MIN.  
INCHES  
A
E
DIM.  
MAX.  
4.65  
1.01  
1.73  
0.61  
15.49  
10.51  
2.67  
5.28  
1.40  
6.48  
2.92  
14.02  
3.82  
3.94  
3.00  
MIN.  
MAX.  
0.183  
0.040  
0.068  
0.024  
0.610  
0.414  
0.105  
0.208  
0.055  
0.255  
0.115  
0.552  
0.150  
0.155  
0.118  
F
A
b
4.25  
0.69  
1.20  
0.36  
14.85  
10.04  
2.41  
4.88  
1.14  
6.09  
2.41  
13.35  
3.32  
3.54  
2.60  
0.167  
0.027  
0.047  
0.014  
0.585  
0.395  
0.095  
0.192  
0.045  
0.240  
0.095  
0.526  
0.131  
0.139  
0.102  
Ø P  
b(1)  
c
D
E
e
e(1)  
F
H(1)  
J(1)  
L
1
3
2
L(1)  
Ø P  
Q
*
M
b(1)  
ECN: X12-0208-Rev. N, 08-Oct-12  
DWG: 5471  
Notes  
* M = 1.32 mm to 1.62 mm (dimension including protrusion)  
Heatsink hole for HVM  
C
b
e
J(1)  
e(1)  
服务热线:400-655-8788  
6

IRL1104PBF  
Disclaimer  
All products due to improve reliability, function or design or for other reasons, product specifications and  
data are subject to change without notice.  
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their  
representatives (collectively, the “
T
aiwan VBsemi”), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to the  
product.(www.VBsemi.com)  
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of  
any goods or continuous production.
T
o
t
he maximum extent permitted by applicable law on
T
aiwan VBsemi  
relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability,  
including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
including a particular purpose, non-infringement and merchantability guarantee.  
Statement on certain types of applications are based on knowledge of the product is often used in a typical  
application of the general product VBsemi
T
aiwan demand that the Taiwan VBsemi of. Statement on whether the  
product is suitable for a particular application is non-binding. It is the customer’s responsibility to verify specific  
product features in the products described in the specification is appropriate for use in a particular application.  
Parameter data sheets and technical specifications can be provided may vary depending on the application and  
performance over time. All operating parameters, including typical parameters must be made by customer’s  
technical experts validated for each customer application. Product specifications do not expand or modify
T
aiwan  
VBsemi purchasing terms and conditions, including but not limited to warranty herein.  
Unless expressly stated in writing,
T
aiwan VBsemi products are not intended for use in medical, life saving,  
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal  
injury or death, use or sale of products used in
T
aiwan VBsemi such applications using client did not express their  
own risk. Contact your authorized
T
aiwan VBsemi people who are related to product design applications and  
other terms and conditions in writing.  
The information provided in this document and the company’s products without a license, express or implied,  
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product  
names and trademarks referred to herein are trademarks of their respective representatives will be all.  
Material Category Policy  
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be  
RoHS compliant and meets the definition of restrictions under Directive of the European Parliament  
2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
electronic equipment (EEE) – modification, unless otherwise specified as inconsistent.(www.VBsemi.com)  
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
2011/65 /.  
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as  
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products  
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.  
7