Microchip-Tech-2N2222AL
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TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
NPN SILICON SWITCHING TRANSISTOR
Qualified per MIL-PRF-19500/255
DEVICES
LEVELS
2N2221A
2N2221AL
2N2221AUA
2N2221AUB
2N2221AUBC *
2N2222A
2N2222AL
2N2222AUA
2N2222AUB
2N2222AUBC *
JAN
JANTX
JANTXV
JANS
*
Available to JANS quality level only.
ABSOLUTE MAXIMUM RATINGS
(T
C
= +25°C unless otherwise noted)
Parameters / Test Conditions
Symbol
Value
Unit
Collector-Emitter Voltage
V
CEO
V
CBO
V
EBO
I
C
50
75
Vdc
Vdc
Vdc
mAdc
W
Collector-Base Voltage
Emitter-Base Voltage
6.0
Collector Current
800
TO-18 (TO-206AA)
2N2221A, 2N2222A
Total Power Dissipation @ T
A
= +25°C
Operating & Storage Junction Temperature Range
P
T
0.5
T
op
, T
stg
-65 to +200
°C
THERMAL CHARACTERISTICS
Parameters / Test Conditions
Symbol
Max.
Unit
Thermal Resistance, Junction-to-Ambient
2N2221A, L
2N2221AUA
2N2221AUB, UBC
2N2222A, L
2N2222AUA
2N2222AUB, UBC
325
210
325
°C/W
R
θ
JA
4 PIN
2N2221AUA, 2N2222AUA
Note:
Consult 19500/255 for thermal performance curves.
1. Derate
linearly 3.08mW/°C above T
A
> +37.5°C
2. Derate
linearly 4.76mW/°C above T
A
> +63.5°C
ELECTRICAL CHARACTERISTICS
(T
A
= +25°C, unless otherwise noted)
Parameters / Test Conditions
OFF CHARACTERTICS
Symbol
Min.
Max.
Unit
Collector-Emitter Breakdown Voltage
I
C
= 10mAdc
V
(BR)CEO
I
CBO
50
Vdc
3 PIN
2N2221AUB, 2N2222AUB
2N2221AUBC, 2N2222AUBC
(UBC = Ceramic Lid Version)
Collector-Base Cutoff Current
V
CB
= 75Vdc
10
10
μ
Adc
η
Adc
V
CB
= 60Vdc
Emitter-Base Cutoff Current
EB
= 6.0Vdc
V
I
EBO
10
10
μ
Adc
η
Adc
V
EB
= 4.0Vdc
Collector-Emitter Cutoff Current
V
CE
= 50Vdc
I
CES
50
η
Adc
T4-LDS-0060 Rev. 2 (100247)
Page 1 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
ELECTRICAL CHARACTERISTICS
(T
A
= +25°C, unless otherwise noted)
Parameters / Test Conditions
ON CHARACTERISTICS
(2)
Symbol
Min.
Max.
Unit
Forward-Current Transfer Ratio
I
C
= 0.1mAdc, V
CE
= 10Vdc
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
30
50
I
C
= 1.0mAdc, V
CE
= 10Vdc
I
C
= 10mAdc, V
CE
= 10Vdc
I
C
= 150mAdc, V
CE
= 10Vdc
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
35
75
150
325
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
40
100
h
FE
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
40
100
120
300
I
C
= 500mAdc, V
CE
= 10Vdc
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
20
30
Collector-Emitter Saturation Voltage
V
CE(sat)
Vdc
Vdc
I
C
= 150mAdc, I
B
= 15mAdc
I
C
= 500mAdc, I
B
= 50mAdc
0.3
1.0
Base-Emitter Voltage
V
BE(sat)
I
C
= 150mAdc, I
B
= 15mAdc
I
C
= 500mAdc, I
B
= 50mAdc
0.6
1.2
2.0
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Symbol
Min.
Max.
Unit
Small-Signal Short-Circuit Forward Current Transfer Ratio
h
fe
I
C
= 1.0mAdc, V
CE
= 10Vdc, f = 1.0kHz
2N2221A, L, UA, UB, UBC
2N2222A, L, UA, UB, UBC
30
50
Magnitude of Small–Signal Short-Circuit
Forward Current Transfer Ratio
|h
fe
|
I
C
= 20mAdc, V
CE
= 20Vdc, f = 100MHz
2.5
Output Capacitance
C
obo
8.0
25
pF
pF
V
CB
= 10Vdc, I
E
= 0, 100kHz
≤
f
≤
1.0MHz
Input Capacitance
C
ibo
V
EB
= 0.5Vdc, I
C
= 0, 100kHz
≤
f
≤
1.0MHz
SWITCHING CHARACTERISTICS
Parameters / Test Conditions
Symbol
Min.
Max.
Unit
Turn-On Time
See figure 8 of MIL-PRF-19500/255
t
on
35
η
s
Turn-Off Time
See Figure 9 of MIL-PRF-19500/255
t
off
300
η
s
(2) Pulse Test: Pulse Width = 300
μ
s, Duty Cycle
≤
2.0%.
T4-LDS-0060 Rev. 2 (100247)
Page 2 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
PACKAGE DIMENSIONS
NOTES:
1. Dimensions
are in inches.
Dimensions
Inches Millimeters
Symbol
Note
2. Millimeters
are given for general information only.
3. Beyond
r (radius) maximum, TL shall be held for a minimum length
of .011 inch (0.28 mm).
4. Dimension
TL measured from maximum HD.
5. Body
contour optional within zone defined by HD, CD, and Q.
6. Leads
at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm)
below seating plane shall be within .007 inch (0.18 mm) radius of
true position (TP) at maximum material condition (MMC) relative to
tab at MMC.
Min
Max
.195
.210
.230
Min
4.52
4.32
5.31
2.54 TP
0.41
Max
4.95
5.33
5.84
CD
CH
HD
LC
LD
LL
LU
L
1
L
2
P
Q
TL
TW
r
.178
.170
.209
.100 TP
6
7,8
.016
.500
.016
.021
.750
.019
.050
0.53
12.70 19.05 7,8,13
0.41
0.48
1.27
7,8
7,8
7,8
7. Dimension
LU applies between L
1
and L
2
. Dimension
LD applies
between L
2
and LL minimum.
Diameter is uncontrolled in L
1
and
beyond LL minimum.
.250
.100
6.35
2.54
.030
.048
.046
.010
0.76
1.22
1.17
0.25
5
3,4
3
10
6
8. All
three leads.
.028
.036
0.71
0.91
9. The
collector shall be internally connected to the case.
10. Dimension
r (radius) applies to both inside corners of tab.
11. In
accordance with ASME Y14.5M, diameters are equivalent to
φ
x
symbology.
α
45
°
TP
45
°
TP
1, 2, 9, 11, 12, 13
12. Lead
1 = emitter, lead 2 = base, lead 3 = collector.
13. For
L suffix devices, dimension LL = 1.5 inches (38.10 mm) min.
and 1.75 inches (44.45 mm) max.
FIGURE 1.
Physical dimensions (similar to TO-18).
T4-LDS-0060 Rev. 2 (100247)
Page 3 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
NOTES:
Dimensions
1. Dimensions
are in inches.
Inches
Min
.215
Millimeters
Symbol
Note
2. Millimeters
are given for general information only.
3. Dimension
CH controls the overall package thickness.
When a
window lid is used, dimension CH must increase by a minimum of
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
4. The
corner shape (square, notch, radius) may vary at the
manufacturer’s option, from that shown on the drawing.
5. Dimensions
LW2 minimum and L3 minimum and the appropriate
castellation length define an unobstructed three-dimensional space
traversing all of the ceramic layers in which a castellation was
designed. (Castellations
are required on the bottom two layers,
optional on the top ceramic layer.)
Dimension LW2 maximum and
L3 maximum define the maximum width and depth of the
castellation at any point on its surface.
Measurement of these
dimensions may be made prior to solder dipping.
Max
.225
.225
.155
.155
.075
.007
.042
.048
.088
.055
.028
.022
Min
5.46
Max
5.71
5.71
3.93
3.93
1.90
0.18
1.07
1.22
2.23
1.39
0.71
0.56
BL
BL2
BW
BW2
CH
.145
3.68
.061
.003
.029
.032
.072
.045
.022
.006
1.55
0.08
0.74
0.81
1.83
1.14
0.56
0.15
3
5
L3
LH
LL1
LL2
LS
LW
LW2
5
6. The
co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for
solder dipped leadless chip carriers.
Pin no.
Transistor Collector
1
2
3
Base
4
N/C
Emitter
7. In
accordance with ASME Y14.5M, diameters are equivalent to
φ
x
symbology.
FIGURE 2.
Physical dimensions, surface mount (UA version).
T4-LDS-0060 Rev. 2 (100247)
Page 4 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
UB
Dimensions
Dimensions
Symbol
Inches
Min
.046
.115
.085
Millimeters
Min Max
Note
Inches
Min
.036
.071
.016
Millimeters
Symbol
Note
Max
.056
.128
.108
.128
.108
.038
.035
Max
.040
.079
.024
.008
.012
.022
Min
0.91
1.81
0.41
Max
1.02
2.01
0.61
.203
.305
.559
BH
BL
BW
CL
CW
LL1
LL2
1.17
2.92
2.16
1.42
3.25
2.74
3.25
2.74
0.96
0.89
LS
1
LS
2
LW
r
r
1
r
2
.022
.017
0.56
0.43
NOTES:
1. Dimensions
are in inches.
2. Millimeters
are given for general information only.
3. Hatched
areas on package denote metalized areas.
4. Pad
1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In
accordance with ASME Y14.5M, diameters are equivalent to
φ
x symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
T4-LDS-0060 Rev. 2 (100247)
Page 5 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
UBC
Dimensions
Dimensions
Symbol
Inches
Min
.046
.115
.085
Millimeters
Min Max
Note
Inches
Min
.036
.071
.016
Millimeters
Symbol
Note
Max
.071
.128
.108
.128
.108
.038
.035
Max
.040
.079
.024
.008
.012
.022
Min
0.91
1.81
0.41
Max
1.02
2.01
0.61
.203
.305
.559
BH
BL
BW
CL
CW
LL1
LL2
1.17
2.92
2.16
1.80
3.25
2.74
3.25
2.74
0.96
0.89
LS
1
LS
2
LW
r
r
1
r
2
.022
.017
0.56
0.43
NOTES:
1. Dimensions
are in inches.
2. Millimeters
are given for general information only.
3. Hatched
areas on package denote metalized areas.
4. Pad
1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring.
5. In
accordance with ASME Y14.5M, diameters are equivalent to
φ
x symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
T4-LDS-0060 Rev. 2 (100247)
Page 6 of 6
