onsemi-SMMBTA13LT1

Part #onsemi-SMMBTA13LT1
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onsemi-SMMBTA13LT1
MMBTA13L, SMMBTA13L,  
MMBTA14L, SMMBTA14L  
Darlington Amplifier  
Transistors  
NPN Silicon  
Features  
•
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC
−
Q101 Qualified and  
PPAP Capable  
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS  
Compliant  
SOT
−
23 (TO
−
236)  
CASE 318  
STYLE 6  
COLLECTOR 3  
MAXIMUM RATINGS  
BASE  
1
Rating  
Collecto
r
−
Emitter Voltage  
Collecto
r
−
Base Voltage  
Emitte
r
−
Base Voltage  
Symbol  
Value  
30  
Unit  
Vdc  
V
CES  
CBO  
EBO  
V
V
30  
Vdc  
EMITTER 2  
10  
Vdc  
Collector Current
−
Continuous  
I
300  
mAdc  
C
MARKING DIAGRAM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
1x M
G  
T
o
tal Device Dissipation FR
−
5 Board  
P
D
G

(Note 1) T

= 25
°
C  
225  
1.8  
mW  
mW/
°
C  
A
1
Derate above 25
°
C  
1x =
 
Device Code  
Thermal Resistance, Junction
−
to
−
Ambient  
R
556  
°
C/W  
q
JA  
x = M for MMBTA13LT1G,  
SMMBTA13LT1G  
T
o
tal Device Dissipation Alumina  
P
D
300  
2.4  
mW  
mW/
°
C  
A
x = N for MMBTA14LT1G,  
SMMBTA14LT1G, T3G  
= Date Code*  
Derate above 25

C  
M
Thermal Resistance, Junction
−
to
−
Ambient  
Junction and Storage
T
e
mperature  
R
417  
°
C/W  
°
C  
q
JA  
G
= Pb
−
Free Package  
T , T  
J
−
55 to +150  
stg  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR
−
5 = 1.0
ꢀ
0.75
ꢀ
0.062 in.  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
MMBTA13LT1G,  
SMMBTA13LT1G  
SOT
−
23 3,000
 
/
T
a
pe & Reel  
(Pb
−
Free)  
MMBTA14LT1G,  
SMMBTA14LT1G  
SOT
−
23 3,000
 
/
T
a
pe & Reel  
(Pb
−
Free)  
SMMBTA14LT3G SOT
−
23  
(Pb
−
Free)  
10,000 /
T
a
pe &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 1994  
1
Publication Order Number:  
October, 2016
−
Rev. 6  
MMBTA13LT1/D  
 

MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collecto
r
−
Emitter Breakdown Voltage  
V
Vdc  
nAdc  
nAdc  
(BR)CES  
(I =
 
100
m
Adc, V
 
= 0)  
30  
−
−
C
BE  
Collector Cutoff Current  
(V =
 
30 Vdc, I
 
= 0)  
I
CBO  
100  
100  
CB  
E
Emitter Cutoff Current  
(V =
 
10 Vdc, I
 
= 0)  
I
EBO  
−
EB  
C
ON CHARACTERISTICS

DC Current Gain  
h
FE  
−
(I =
 
10 mAdc, V
 
= 5.0 Vdc)  
C
CE  
MMBTA13, SMMBTA13  
MMBTA14, SMMBTA14  
5000  
10,000  
−
−
(I =
 
100 mAdc, V
 
= 5.0 Vdc)  
C
CE  
MMBTA13, SMMBTA13  
MMBTA14, SMMBTA14  
10,000  
20,000  
−
−
Collecto
r
−
Emitter Saturation Voltage  
V
Vdc  
Vdc  
CE(sat)  
(I =
 
100 mAdc, I
 
= 0.1 mAdc)  
−
−
1.5  
2.0  
C
B
Bas
e
−
Emitter On Voltage  
(I =
 
100 mAdc, V
 
= 5.0 Vdc)  
V
BE  
C
CE  
SMALL
−
SIGNAL CHARACTERISTICS  
f
T
MHz  
(I =
 
10 mAdc, V
 
= 5.0 Vdc, f = 100 MHz)  
125  
−
C
CE  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse
 
T
e
st: Pulse Width
v
300
m
s, Duty Cycle
v
2.0%.  
4. f =
 
|h |
 
•
f .  
test  
T
fe  
R
S
i
n
e
n
IDEAL  
TRANSISTOR  
Figure 1. Transistor Noise Model  
2
 

MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L  
NOISE CHARACTERISTICS  
(V

CE

= 5.0 Vdc, T

A

= 25
°
C)  
500  
2.0  
BANDWIDTH = 1.0 Hz  
BANDWIDTH = 1.0 Hz  
R
≈
0  
S
1.0  
0.7  
0.5  
200  
100  
50  
I =
 
1.0 mA  
C
0.3  
0.2  
10
m
A  
100
m
A  
100
m
A  
0.1  
0.07  
0.05  
20  
10
m
A  
I =
 
1.0 mA  
C
10  
0.03  
0.02  
5.0  
10 20  
50 100
 
200 500
 
1ꢀk 2ꢀk
 
5ꢀk 10ꢀk
 
20ꢀk 50ꢀk
 
100ꢀk  
f, FREQUENCY (Hz)  
10 20  
50 100
 
200 500
 
1ꢀk 2ꢀk
 
5ꢀk 10ꢀk
 
20ꢀk 50ꢀk
 
100ꢀk  
f, FREQUENCY (Hz)  
Figure 2. Noise Voltage  
Figure 3. Noise Current  
200  
14  
12  
BANDWIDTH = 10 Hz TO 15.7 kHz  
BANDWIDTH = 10 Hz TO 15.7 kHz  
100  
70  
10  
8.0  
6.0  
4.0  
2.0  
I =
 
10
m
A  
C
10
m
A  
50  
100
m
A  
100
m
A  
30  
20  
I =
 
1.0 mA  
C
1.0 mA  
10  
0
1.0 2.0  
5.0  
10  
20  
50 100
 
200  
500 1000  
1.0 2.0  
5.0  
10  
20  
50 100 200  
500 1000  
R ,
 
SOURCE RESISTANCE (k
W
)  
S
R ,
 
SOURCE RESISTANCE (k
W
)  
S
Figure 4. Total Wideband Noise Voltage  
Figure 5. Wideband Noise Figure  
3

MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L  
SMALL
−
SIGNAL CHARACTERISTICS  
20  
10  
4.0  
V
= 5.0 V  
CE  
f = 100 MHz  
T =
 
25
°
C  
J
T =
 
25
°
C  
J
2.0  
7.0  
5.0  
C
ibo  
1.0  
0.8  
C
obo  
0.6  
0.4  
3.0  
2.0  
0.2  
0.04  
0.1 0.2  
0.4  
1.0 2.0
 
4.0  
10 20  
40  
0.5 1.0  
2.0  
0.5 10 20  
50  
100 200  
500  
V ,
 
REVERSE VOLTAGE (VOLTS)  
R
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 6. Capacitance  
Figure 7. High Frequency Current Gain  
200ꢀk  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
T =
 
125
°
C  
J
T =
 
25
°
C  
J
100ꢀk  
70ꢀk  
50ꢀk  
I =  
C
50 mA  
250 mA
 
500 mA  
10 mA  
25
°
C  
30ꢀk  
20ꢀk  
10ꢀk  
7.0ꢀk  
5.0ꢀk  
-ꢁ55
°
C  
V
CE  
= 5.0 V  
3.0ꢀk  
2.0ꢀk  
500  
0.1 0.2
 
0.5 1.0
 
2.0 5.0
 
10 20
 
50 100
 
200 500
 
1000  
5.0 7.0
 
10  
20 30  
50 70
 
100  
200 300  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
BASE CURRENT (
m
A)  
B
Figure 8. DC Current Gain  
Figure 9. Collector Saturation Region  
1.6  
1.4  
-ꢁ1.0  
-ꢁ2.0  
-ꢁ3.0  
-ꢁ4.0  
-ꢁ5.0  
-ꢁ6.0  
*APPLIES FOR I
 
/I
≤
h /3.0  
C B  
FE  
25
°
C TO 125
°
C  
T =
 
25
°
C  
J
*R  
FOR V  
CE(sat)  
q
VC  
V
@ I
 
/I =
 
1000  
-ꢁ55
°
C TO 25
°
C  
25
°
C TO 125
°
C  
BE(sat)  
C B  
1.2  
1.0  
0.8  
0.6  
V
BE(on)  
@ V
 
= 5.0 V  
CE  
q
FOR V  
BE  
VB  
-ꢁ55
°
C TO 25
°
C  
V
@ I
 
/I =
 
1000  
C B  
CE(sat)  
5.0 7.0  
10  
20 30  
50 70 100
 
200 300  
500  
5.0 7.0
 
10  
20 30  
50 70
 
100  
200 300
 
500  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 10. “On” Voltages  
Figure 11. Temperature Coefficients  
4

MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L  
1.0  
0.7  
0.5  
D = 0.5  
0.2  
0.3  
0.2  
SINGLE PULSE  
SINGLE PULSE  
0.05  
0.1  
0.1  
0.07  
0.05  
0.03  
0.02  
Z
Z
= r(t)
•
R ꢂT  
– T
 
= P  
Z
q
q
q
q
JC(t)  
JA(t)  
JC  
J(pk)  
C
(pk) JC(t)  
= r(t)
•
R ꢂT  
– T
 
= P  
Z
q
q
JA  
J(pk)  
A
(pk) JA(t)  
0.01  
0.1  
0.2  
0.5  
1.0  
2.0  
5.0  
10  
20  
50  
100  
200  
500  
1.0ꢀk  
2.0ꢀk  
5.0ꢀk 10ꢀk  
t, TIME (ms)  
Figure 12. Thermal Response  
1.0ꢀk  
700  
1.0 ms  
500  
T =
 
25
°
C  
C
300  
200  
100
m
s  
T =
 
25
°
C  
A
1.0 s  
100  
70  
50  
30  
20  
CURRENT LIMIT  
THERMAL LIMIT  
SECOND BREAKDOWN LIMIT  
10  
0.4 0.6  
40  
1.0  
2.0  
4.0 6.0  
10  
20  
V
CE  
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
Figure 13. Active Region Safe Operating Area  
FIGURE A  
t
P
P
P
P
P
t
1
1/f  
t
1
DUTYꢀCYCLE
+
t ꢀf
 
+  
1
t
P
PEAK PULSE POWER = P  
P
Design Note: Use of Transient Thermal Resistance Data  
5

MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AR  
NOTES:  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
THE BASE MATERIAL.  
0.25  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
T
H
E
E
1
2
MILLIMETERS  
INCHES  
NOM  
0.039  
0.002  
0.017  
0.006  
0.114  
0.051  
0.075  
0.017  
0.021  
0.094  
−−−  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.89  
0.01  
0.37  
0.08  
2.80  
1.20  
1.78  
0.30  
0.35  
2.10  
0
_
 
NOM  
1.00  
0.06  
0.44  
0.14  
2.90  
1.30  
1.90  
0.43  
0.54  
2.40  
−−−  
MAX  
MIN  
MAX  
0.044  
0.004  
0.020  
0.008  
0.120  
0.055  
0.080  
0.022  
0.027  
0.104  
10
_  
L
1.11  
0.10  
0.50  
0.20  
3.04  
1.40  
2.04  
0.55  
0.69  
2.64  
10
_  
0.035  
0.000  
0.015  
0.003  
0.110  
0.047  
0.070  
0.012  
0.014  
0.083  
0
_  
3X  
b
L1  
VIEW C  
e
TOP VIEW  
L1  
A
H
E
T
c
A1  
SEE VIEW C  
STYLE 6:  
PIN 1.
 
BASE  
SIDE VIEW  
END VIEW  
2. EMITTER  
3. COLLECTOR  
RECOMMENDED  
SOLDERING FOOTPRINT*  
3X  
0.90  
2.90  
3X  
0.95  
PITCH  
0.80  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb
−
Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.  
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MMBTA13LT1/D