onsemi-MDC3237T1
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SEMICONDUCTOR TECHNICAL DATA
6
5
4
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOT–363 package is a
solution which simplifies circuit design, reduces device count, and
reduces board space by integrating a few discrete devices into one small
six–leaded package. The SOT–363 is ideal for low–power surface mount
applications where board space is at a premium, such as portable
products.
1
2
3
CASE 419B–01
SC–70/SOT–363
This device is intended to replace an array of four to eight discrete
components in an integrated SOT–363 package.
INTERNAL CIRCUIT DIAGRAM
V
(2)
CC
•
Optimized to Switch Inductive Pager/Phone Loads Such as Motors, Lamps
and Speakers from a 0.9 to 1.7 V Rail
V
V
out
out
(6)
(3)
•
•
•
Low Performance
VCE(sat)
Internal Output Clamp Diodes
V
V
in
in
(1)
(4)
Provide a Robust Driver Interface between Inductive Load and Sensitive
Logic Circuits
GND
(5)
Applications include:
•
•
Pager Silent Alert Motor
INTERNAL CIRCUIT DIAGRAM
Pager E/M Acoustic Transducers
6
5
4
Ordering Information:
•
•
MDC3237T1: 8 mm, 7–inch/3,000 Unit
T
a
pe and Reel
MDC3237T3: 8 mm, 13–inch/10,000 Unit
T
a
pe and Reel
1
2
3
MAXIMUM RATINGS
Rating
Symbol
Value
15
Unit
Collector–Emitter Voltage
Collector–Base Voltage
Emitter–Base Voltage
V
CEO
V
CBO
V
EBO
Vdc
Vdc
15
5.0
Vdc
Collector–Current Continuous
Diode Reverse Voltage
I
200
8.0
mAdc
Vdc
C
V
R
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
150
Unit
mW
°
C/W
°
C
T
o
tal Device Dissipation
P
D
Thermal Resistance Junction to Ambient
Junction and Storage
T
e
mperature
R
833
JA
T ,
T
J stg
–55 to 150
DEVICE MARKING
MDC3237T1 = E7
REV 1
M
o
t
o
r
o
l
a,
In
c.
1
9
9
8
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Collecto
r
–
E
mitter Breakdown Voltage
V
V
Vdc
Vdc
Vdc
(BR)CEO
(I =
1.0 mAdc, I
= 0 mAdc)
15
15
—
—
—
—
—
—
C
B
Collecto
r
–
B
ase Breakdown Voltage
(I =
10 Adc,
I =
0 mAdc)
(BR)CBO
C
E
Emitte
r
–
B
ase Breakdown Voltage
(I =
10 Adc,
I =
0 mAdc)
V
(BR)EBO
5.0
C
C
ON CHARACTERISTICS
DC Current Gain
h
—
FE
(I =
100 mAdc, V
= 5.0 Vdc)
100
—
—
—
—
400
C
BE
Collecto
r
–
E
mitter Saturation Voltage
(I =
100 mAdc, I
= 5.0 mAdc)
V
Vdc
Vdc
CE(sat)
BE(sat)
0.150
0.900
C
B
Bas
e
–
E
mitter Saturation Voltage
(I =
100 mAdc, I
= 2.0 mAdc)
V
—
C
B
SMALL
–
S
IGNAL CHARACTERISTICS
Curren
t
–
G
ain — Bandwidth Product
f
MHz
pF
T
(I =
50 mAdc, V
= 5.0 Vdc, f = 20 MHz)
100
—
—
—
—
—
18
C
CE
Output Capacitance
(V =
10 Vdc, f = 1.0 MHz)
C
obo
CB
Input Capacitance
(V =
0.5 Vdc, f = 1.0 MHz)
C
pF
ibo
—
105
EB
DIODE CHARACTERISTICS
Reverse Breakdown Voltage
V
Vdc
Vdc
ns
(BR)
(I
(BR)
= 100
µ
Adc)
8.0
—
—
—
—
—
1.0
25
Forward Voltage
(I =
50 mAdc)
F
V
F
Reverse Recovery Time
t
rr
(I =
I =
10 mAdc)
—
F
R
3 Vdc
0.9 TO 1.7 Vdc
(2)
V
CC
SPEAKER
MDC3237T1
VIBRATOR
V
V
out
out
(6)
(3)
V
V
in
in
CMOS
MCU
(1)
(4)
GND
(5)
Figure 1. Multiple Loads With Dual Inductive Load Driver
2
Motorola Small–Signal Transistors, FE
T
s
a
nd Diodes Device Data
INFORMATION FOR USING THE SOT–363 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOT–363
0.5 mm (min)
1.9 mm
SOT–363 POWER DISSIPATION
The power dissipation of the SOT–363 is a function of the
SOLDERING PRECAUTIONS
pad size.
This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
by T
, the maximum rated junction temperature of the
, the thermal resistance from the device junction to
J(max)
die, R
θ
JA
ambient, and the operating temperature, T
. Using the
A
values provided on the data sheet for the SOT–363 package,
P
can be calculated as follows:
D
•
Always preheat the device.
•
The delta temperature between the preheat and soldering
should be 100
°
C or less.*
T
– T
A
J(max)
P
=
D
R
θ
JA
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10
°
C.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 120 milliwatts.
A
•
The soldering temperature and time shall not exceed
260
°
C for more than 10 seconds.
•
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5
°
C or less.
120
°
C – 25
°
C
833
°
C/W
P
=
= 120 milliwatts
D
•
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
The 833
°
C/W for the SOT–363 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 120 milliwatts. There
are other alternatives to achieving higher power dissipation
from the SOT–363 package. Another alternative would be to
use a ceramic substrate or an aluminum core board such as
Thermal Clad
. Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
•
Mechanical stress or shock should not be applied during
cooling.
* Soldering
a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
Motorola Small–Signal Transistors, FE
T
s
a
nd Diodes Device Data
3
PACKAGE DIMENSIONS
A
G
V
NOTES:
1. DIMENSIONING
AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING
DIMENSION: INCH.
6
1
5
4
3
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.087
0.053
0.043
0.012
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
S
–B–
0.071
0.045
0.031
0.004
2
G
H
J
0.026 BSC
0.65 BSC
–––
0.004
0.004
0.004
0.010
0.012
–––
0.10
0.10
0.10
0.25
0.30
M
M
0.2 (0.008)
B
D
6 PL
K
N
0.008 REF
0.20 REF
S
V
0.079
0.012
0.087
0.016
2.00
0.30
2.20
0.40
N
J
C
K
H
CASE 419B–01
ISSUE C
Motorola reserves the right to make changes without further notice to any products herein.
Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificall
y
d
isclaims any and all liability, including without limitation consequential or incidental damages.
“Typical” parameters which may be provided in Motorola
dat
a
s
heet
s
a
nd/o
r
s
pecification
s
c
a
n
a
n
d
d
o
v
ar
y
i
n
d
ifferen
t
a
pplication
s
a
n
d
a
ctua
l
p
erformanc
e
m
a
y
v
ar
y
o
ve
r
t
ime. Al
l
o
peratin
g
p
arameters
,
i
ncludin
g
“
Typicals”
must be validated for each customer application by customer’s technical experts.
Motorola does not convey any license under its patent rights nor the rights of
others. Motorola
products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
application
s
i
ntended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
o
r
d
eat
h
m
a
y
o
ccur. Shoul
d
B
uye
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urchas
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o
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otorol
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roduct
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o
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nintende
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u
nauthorize
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a
pplication
,
B
uye
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ndemnif
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M
otorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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How to reach us:
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ocations Not Listed
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MDC3237T1/D
◊
