HL-20P06

Part #HL-20P06
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HL-20P06
P-CH 60V Fast Switching MOSFETs  
2
0
P
0
6  
Product Summary  
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
BVDSS  
-60V  
RDSON  
48m
Ω
 
ID  
-20A  
100% EAS Guaranteed  
TO252 Pin Configuration  
Description  
The 20P06
 
is the high cell density trenched
 
P-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for
 
most of
 
the synchronous buck  
converter applications.  
The 20P06
 
meet the RoHS and Green Product  
requirement 100% EAS guaranteed with full function  
reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
-60  
Unit  
V
V
DS  
Drain-Source
V
o
ltage  
Gate-Sou
r
ce Voltage  
V
GS  
±
20  
-20  
V
Continuous Drain Current,
V

GS

@ -10
V

1  

Continuous Drain Current,
V

GS

@ -10
V

1  

Continuous Drain Current, V

GS

@ -10V

1  

Continuous Drain Current, V

GS

@ -10V

1  

Pulsed Drain Current

2  

I
D
@T  
C
=25
℃
 
=100
℃  
=25
℃  
=70
℃  
A
I
D
@T  
C
-12  
-4.5  
A
I
D  
@T  
@T  
I
A
A
I
D  
A
-4  
A
DM  
-30  
A
Single Pulse
A
v
a
lanche Energy

3  

EAS  
18.1  
-13  
mJ  
A
I
AS  
Av
a
lanche Current  
Total Power Dissipation

4  

Total Power Dissipation

4  

P
D
@T  
C
=25
℃  
25  
W
W
℃
℃
P
D
@T  
A
=25
℃  
2
T
STG  
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T
J
Thermal Data  
Symbol  
Parameter  
Typ.  
—  
Max.  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-
A
m
bient

1  

Thermal Resistance Junction-Case

1  

R
θ
JA  
62  
5
R
θ
JC  
—  
01  

P-CH 60V Fast Switching MOSFETs  
2
0
P
0
6  

Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
BV

DSS  

Parameter  
Test Condition  
Min.  
-60  
Typ.  
—  
Max.  
—  
U
n
its  
V
Drain-Source Breakdown
V
o
ltage  
V

GS

=0
V
, I  
Reference to 25
℃
,  
=-1mA  

GS

=-10V , I  

GS

=-4.5
V
, I  
D
=-250uA  
△
BV

DSS

/
△
T  
J
BV

DSS

Temperature Coefficient  
—  
-0.023  
—  
V/
℃  
m
Ω
 
I
D  
V
D
=-10A  
=-6A  
—  
—  
-1.2  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
48  
56  
—  
58  
67  
-2.5  
—  
Static Drain-Source On-Resistance

2  

Gate Threshold
V
o
ltage  
R
DS(ON)  
V
D
V
GS(th)  
V
V

GS

=V

DS

, I
 
=-250uA  
D
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
4
m
V
/
℃  
V

DS

=-24V ,
V

GS

=0
V
, T  

DS

=-24V ,
V

GS

=0
V
, T  

GS

=
±
20V ,
V

DS

=0V  

DS

=-5V , I
 
=-15A  
J
=25
℃  
—  
-1  
I
DSS  
Drain-Source Leakage Current  
uA  
V
J
=55
℃  
—  
-5  
I
GSS  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V
—  
±
100  
—  
nA  
S
gfs  
V
D
12  
6.1  
3.1  
1.8  
2.6  
8.6  
33.6  
6
Q
g  
—  
V

DS

=-15V ,
V

GS

=-4.5
V
,  
Q
gs  
gd  
—  
nC  
I
D  
=-15A  
Q
—  
T
d
(
o
n)  
—  
T
r  
—  
V

DD

=-15V ,
V

GS

=-10V ,  
ns  
R
G
=3.3
Ω
, I
 
=-15A  
D
T
d
(
o
ff)  
Turn-Off Delay Time  
Fall Time  
—  
T
f  
—  
C
iss  
oss  
rss  
Input Capacitance  
585  
100  
85  
—  
C
C
Output Capacitance  
Re
v
e
rse Transfer Capacitance  
V

DS

=-15V , V

GS

=0
V
,
f
=1MHz  
—  
pF  
—  
Diode Characteristics  
Symbol  
Parameter  
Continuous Source Current

1,5  

Pulsed Source Current

2,5  

Diode Forward
V
o
ltage

2  

Re
v
e
rse Reco
v
e
ry Time  
Test Condition  
Min.  
Typ.  
—  
Max.  
-20  
-30  
-1.2  
—  
U
n
its  
A
I
S  
—  
—  
—  
—  
—  
V
G
=V =0
V
,
 
F
orce Current  
D
I
SM  
SD  
rr  
rr  
—  
A
V

GS

=0
V
, I  
=-15A , dI/dt=100
A
/µs ,  
=25
℃
 
S
=-1A , T =25
℃
 
J
V
—  
V
t
6.1  
1.4  
nS  
nC  
I
F  
Re
v
e
rse Reco
v
e
ry Charge  
T
J  
Q
—  
Note :  
1
.
T
he data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2
.
T
he data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%  
3
.
T
he EAS data shows Max. rating . The test condition is V

DD

=-25V,V
GS
=-10V,L=0.1mH,IAS=-19A  
4
.
T
he power dissipation is limited by 150℃ junction temperature  
5
.
T
he data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
02  

P-CH 60V Fast Switching MOSFETs  
2
0
P
0
6  
Typical Performance Characteristics  
Figure1: Output Characteristics  
Figure 2: On-Resistance v.s Gate-Source  
Figure 3:Forward Characteristics Of Reverse  
Figure 5:
 
Normalized VGS(th) vs. TJ  
Figure 4: Gate Charge Characteristics  
Figure 6: Normalized RDSON vs. TJ  
03  

P-CH 60V Fast Switching MOSFETs  
20P06  
Typical Performance Characteristics  
Figure 7: Typical Capacitance Vs. Drain-Source Volt
a
F
g
i
e
g
ure 7: Safe Operating Area  
Figure 9: Normalized Maximum Transient Thermal Impedance  
Figure 10: Switching Time Waveform  
hing Wa  
04  

P-CH 60V Fast Switching MOSFETs  
2
0
P
0
6  
Package Mechanical Data TO 252  
05