A-Power-microelectronics-AP70P03NF
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AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
Description
The AP
70P03N
F uses advanced trench technology
to provide excellent R
DS(ON)
, low gate charge and
operation with gate voltages as low as 4.5
V
. This
device is suitable for use as a
Battery protection or in other Switching application.
General Features
V
DS
=
–
30V I
D
=
–
7
0 A
R
DS(ON)
<
–
7.5
mΩ @ V
GS
=
–
10V
Application
Battery protection
Load switch
Uninterruptible power supply
Package Marking and Ordering Information
Product ID
Pack
Marking
Qty(PCS)
AP70N03NF
P
DFN5*6-8
L
AP70P03NF x
x
x yyyy
5000
Absolute Maximum Ratings (TC=25
℃
unless otherwise specified)
Symbol
Parameter
Rating
Units
V
DS
Drain-Source Voltage
-30
±
20
-70
V
V
V
GS
Gate-Sou
r
ce Voltage
Continuous Drain Current, V
GS
@ -10V
1,6
A
A
I
D
@T
C
=25
℃
Continuous Drain Current, V
GS
@ -10V
1,6
Pulsed Drain Current
2
-50
I
D
@T
C
=100
℃
I
DM
-200
80
A
EAS
Single Pulse Avalanche Energy
3
Avalanche Current
mJ
A
I
AS
P
D
@T
C
=25
℃
T
STG
-40
T
o
tal Power Dissipation
4
90
W
Storage
T
e
mperature Range
-55 to 175
-55 to 175
20
℃
T
J
Operating Junction
T
e
mperature Range
Thermal Resistance Junction-ambient
1
(t
≦
10S)
℃
℃
/W
℃
/W
R
θ
JA
Thermal Resistance Junction-ambient
1
(Steady
State)
50
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
R
θ
JC
Thermal Resistance Junction-case
1
1.6
℃
/W
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=-250uA
Min.
-30
—
Typ.
—
Max. Unit
BV
DSS
Drain-Source Breakdown Voltage
—
7.2
12
V
V
GS
=-10V , I
D
=-20A
5.6
9.5
—
m
Ω
m
Ω
V
R
DS(ON)
V
GS(th)
Static Drain-Source On-Resistance
2
Gate Threshold Voltage
V
GS
=-4.5V , I
D
=-15A
—
V
GS
=V
DS
, I
D
=-250uA
V
DS
=-24V , V
GS
=0V , T
J
=25
℃
V
DS
=-24V , V
GS
=0V , T
J
=55
℃
-1.2
—
-2.5
-1
—
I
DSS
Drain-Source Leakage Current
uA
—
—
-5
I
GSS
Rg
Q
g
Gate-Source Leakage Current
Gate Resistance
—
—
nA
Ω
V
GS
=
±
20V , V
DS
=0V
±
100
—
V
DS
=0V , V
GS
=0V , f=1MHz
—
1.2
60
T
o
tal Gate Charge (-10V)
Gate-Source Charge
—
—
—
—
—
—
—
—
—
—
Q
gs
—
—
—
—
—
—
—
—
—
—
—
—
—
9
15
V
DS
=-15V , V
GS
=-10V , I
D
=-18A
nC
ns
Q
gd
T
d(on)
T
r
Gate-Drain Charge
Turn-On Delay Time
Rise Time
17
V
DD
=-15V
,
V
GS
=-10V
,
40
R
G
=3.3
,
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
55
I
D
=-20A
13
C
iss
C
oss
C
rss
I
S
Input Capacitance
3450
255
140
—
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current
1,5
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
V
DS
=-25V , V
GS
=0V , f=1MHz
pF
—
V
G
=V
D
=0V , Force Current
-70
A
V
V
SD
t
rr
—
-1.2
—
V
GS
=0V , I
S
=-1A , T
J
=25
℃
I
F
=-20A , di/dt=100A/µs ,
22
nS
nC
T
J
=25
℃
Q
rr
72
—
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=-50V,V
GS
=-10V,L=0.1mH,I
AS
=-40A
4.The power dissipation is limited by 150
℃
junction temperature
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation
6.The maximum current rating is package limited.
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
Typical Characteristics
Fig.2 On-Resistance vs. Gate-Source Voltage
Fig.1 Typical Output Characteristics
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized -V
GS(th)
vs. T
J
Fig.6 Normalized R
DSON
vs. T
J
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
P
DM
T
ON
SINGLE
0.01
0.001
T
D =
T
ON
/T
T
Jpeak
=
T
C
+P
D
M
XR
θJC
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.11 Unclamped Inductive Switching Waveform
Fig.10 Switching Time Waveform
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
AP70P03NF
-30V P-Channel Enhancement Mode MOSFET
Attention
1,Any and all APM Microelectronics products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such a
s
l
ife support systems,
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in
serious physical and/or material damage. Consult with your APM Microelectronics representative nearest
you before using any APM Microelectronics products described or contained herein in such applications.
2,APM Microelectronics assumes no responsibility for equipment failures that result from usin
g
p
roducts
at values that exceed, even momentarily, rated values (such as maximum ratings, operatingcondition
ranges, or other parameters) listed in products specifications of any and all APM Microelectronics
products described or contained herein.
3, Specifications of any and all APM Microelectronics products described or contained her
e
i
nstipulate the
performance, characteristics, and functions of the descri
b
e
d products in the independent state, and are
not guarantees of the performance, characteristics, and functions of thedescribed products as mounted
in the customer
’
s products or equipment. To verify symptoms andstates that cannot be evaluated in an
independent device, the customer should always evaluate and test devices mounted in the customer
’
s
products or equipment.
4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliabilityproducts.
However, any and all semiconductor products fail with some probability. It is possible tha
t
t
hese
probabilistic failures could give rise to accidents or events that could endanger human lives that could
give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment,
adopt safety measures so that these kinds of accidents or events canno
t
o
ccur. Such measures include
but are not limited to protective circuits and error prevention circuits for safe design, redundant
design,and structural design.
5,In the event that any or all APM Microelectronics products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from the authorities concerned in
accordance with the above law.
6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or
otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.
7, Information (including circuit diagrams and circuit parameters) herein is for example only; it i
s
n
ot
guaranteed for volume production. APM Microelectronics believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringements o
f
i
ntellectual
property rights or other rights of third parties.
8, Any and all information d
e
s
cribed or contained herein are subject to change without notice du
e
t
o
product/technology improvement,etc. When designing equipment, refer to the “DeliverySpecification” for
the APM Microelectronics product that you Intend to use.
AP70P03NF R
ve3.8
臺灣永源微電子科技有限公司
