A-Power-microelectronics-AP9926A

Part #A-Power-microelectronics-AP9926A
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A-Power-microelectronics-AP9926A
AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Description  
The AP9926A
 
uses advanced trench technology  
to provide excellent R

DS(ON)

, low gate charge and  
operation with gate voltages as low as 2.5
V
. This  
device is suitable for use as a Battery protection  
or in other Switching application.  
General Features  
V

DS

= 20V
 
I

D

=6.5A  
R

DS(ON)

< 25mΩ @ V

GS

=10V (Type
:
20mΩ)  
Application  
Battery protection  
Load switch  
Wireless charging  
Package Marking and Ordering Information  
Product ID  
Pack  
Marking  
Qty(PCS)  
AP9926A  
SOP-8L  
9926A  
3000  
Absolute Maximum Ratings (T

C

=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Rating  
Units  
V
VDS  
Drain-Source Voltage  
20  
VGS  
Gate-Source Voltage  
±12  
V
Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

6.5  
A
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
IDM  
4
24  
A
A
T
o
tal Power Dissipation

4  

1.2  
W
P

D

@T

A

=25
℃  
TSTG  
Storage
T
e
mperature Range  
Thermal Resistance Junction-Ambient

1  

-55 to 150  
78  
℃
R

θ

JA  
℃
/W  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Units  
V(BR)DSS  
IDSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
Gate Threshold Voltage  
V

GS

=0
V
,
I

D

=250μA  
V

DS

=20
V
,
V

GS

=0
V
,  
V

DS

=0
V
,
V

GS

=±12V  
V

DS

=V

GS

, I

D

=250μA  
V

GS

=4.5
V
,
I

D

=6A  
V

GS

=2.5
V
,
I

D

=5A  
20  
22  
–
–
1.0  
±100  
1.2  
28  
V
μA  
nA  
V
–
IGSS  
–
–
VGS(th)  
0.5  
0.7  
20  
25.5  
358  
–
–
–
RDS(on)  
C

iss  

Static Drain-Source on-Resistance note3  
Input Capacitance  
mΩ  
pF  
38  
–
V

DS

=10
V
,
V

GS

=0
V
,  
f=1.0MHz  
Coss  
Crss  
Q

g  

Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
–
–
–
69.3  
58.5  
5.6  
–
–
–
pF  
pF  
nC  
V

DS

=10
V
,
I

D

=3A,  
V

GS

=4.5V  
Q

gs  

Q

gd  

Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
Turn-on Delay Time  
–
–
–
0.8  
1.0  
16  
–
–
–
nC  
nC  
ns  
td(on)  
t

r  

td(off)  
t

f  

Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
51  
21  
18  
–
–
–
ns  
ns  
ns  
V

DS

=10
V
,
I

D

=6A,  
R

G

=3Ω, V

GS

=4.5V  
IS  
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
–
–
6
A
ISM  
–
–
–
–
24  
A
V
VSD  
Drain to Source Diode Forward Voltage  
V

GS

=0
V
,
I

S

=20A  
1.2  
Notes:  
1
、
Repetitive Rating: Pulse Width Limited by Maximum Junction
T
e
mperature  
2
、
EAS condition : T J =25
℃
, V DD =30
V
, V G =10V, L=0.5mH, Rg=25Ω, IAS =3.5A  
3
、
Pulse
T
e
st: Pulse Width≤300μs, Duty Cycle≤0.5%  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Typical Characteristics  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Current  
Figure 4: Body Diode Characteristics  
Figure 5: Gate Charge Characteristics  
Figure 6: Capacitance Characteristics  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Figure 7: Normalized Breakdown Voltage vs.  
Figure 8: Normalized on Resistance vs  
Junction Temperature  
Junction Temperature  
Figure 9: Maximum Safe Operating Area  
vs. Case Temperature  
Figure 10: Maximum Continuous Drain Current  
Figure.11: Maximum Effective  
Transient Thermal Impedance, Junction-to-Case  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Package Mechanical Data-SOP-8/ESOP-8  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Attention  
1,Any and all APM Microelectronics products described or contained herein do not have specifications  
that can handle applications that require extremely high levels of reliability, such a
s
l
ife support systems,  
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in  
serious physical and/or material damage. Consult with your APM Microelectronics representative nearest  
you before using any APM Microelectronics products described or contained herein in such applications.  
2,APM Microelectronics assumes no responsibility for equipment failures that result from usin
g
p
roducts  
at values that exceed, even momentarily, rated values (such as maximum ratings, operatingcondition  
ranges, or other parameters) listed in products specifications of any and all APM Microelectronics  
products described or contained herein.  
3, Specifications of any and all APM Microelectronics products described or contained her
e
i
nstipulate the  
performance, characteristics, and functions of the descri
b
e
d products in the independent state, and are  
not guarantees of the performance, characteristics, and functions of thedescribed products as mounted  
in the customer
’
s products or equipment. To verify symptoms andstates that cannot be evaluated in an  
independent device, the customer should always evaluate and test devices mounted in the customer
’
s  
products or equipment.  
4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliabilityproducts.  
However, any and all semiconductor products fail with some probability. It is possible tha
t
t
hese  
probabilistic failures could give rise to accidents or events that could endanger human lives that could  
give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment,  
adopt safety measures so that these kinds of accidents or events canno
t
o
ccur. Such measures include  
but are not limited to protective circuits and error prevention circuits for safe design, redundant  
design,and structural design.  
5,In the event that any or all APM Microelectronics products(including technical data, services) described  
or contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from the authorities concerned in  
accordance with the above law.  
6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or  
mechanical, including photocopying and recording, or any information storage or retrieval system, or  
otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.  
7, Information (including circuit diagrams and circuit parameters) herein is for example only; it i
s
n
ot  
guaranteed for volume production. APM Microelectronics believes information herein is accurate and  
reliable, but no guarantees are made or implied regarding its use or any infringements o
f
i
ntellectual  
property rights or other rights of third parties.  
8, Any and all information d
e
s
cribed or contained herein are subject to change without notice du
e
t
o  
product/technology improvement,etc. When designing equipment, refer to the “DeliverySpecification” for  
the APM Microelectronics product that you Intend to use.  
AP9926A RVE1.0  
永源微電子科技有限公司  

AP9926A  
20V N+N-Channel Enhancement Mode MOSFET  
Edition  
Rve3.2  
Rve3.3  
Date  
Change  
2018/12/1  
2021/3/31  
Initial release  
Change of specification format  
Copyright Attribution“APM-Microelectronice”  
AP9926A RVE1.0  
永源微電子科技有限公司