Agertech-ATM2306NSA

Part #Agertech-ATM2306NSA
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Agertech-ATM2306NSA
ATM2306NSA  
N-Channel Enhancement Mode Field Effect Transistor  
Drain-Source Voltage: 30V  
Drain Current: 3.16A  
DESCRIPTION  
The ATM2306NSA uses advanced trench technology  
to provide excellent
R

DS(on)

with low gate charge.  
This device is suitable for use as a load switch or  
DC/DC converter
 
.  
FEATURES  
V

DS(V)

=30V  
1Gate 2Source 3Drain  
SOT
–
23 Plastic Package  
I

D

=3.16A  
R

DS(on

)
<
47mΩ@10V  
Drain  
R

DS(on)

<

Gate  
Source  
MAXIMUM RATINGS  
at TA=25
℃
unless otherwise noted  
Parameter  
Symbol  
Value  
Unit  
Drain-Source voltage  
V

DS  

V

GS  

I

D  

30  
±20  
V
Gate-Source Voltag
Continuous
rain Current

J

=150
℃
)

(1.2)  

3.16  
A
Pulsed Drain
rrent  
I

DM  

20  
ontinuo
Source Current(Diode Conduction)

(1.2)  

aximum Power Dissipation

(1.2)  

I

S  

0.62  
W
℃
/W  
℃
P

D  

0.75  
Thermal Resistance from Junction to Ambient (t
≤5s
)  
Operating Junction and Storage Temperature Range  
R

θJA  

T

J,

T

stg  

100  
-55 to150  
Notes :  
1. Surface Mounted on 1”×1” FR4 board, t
≤5s.  
2. Pulse width limited by maximum junction temperature.  
Dated:07/2017  
Rev: 1.0  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
1/
6
 

ATM2306NSA  
ELECTRICAL CHARACTERISTICS  
Ta =25
℃
unless otherwise specified  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
V

(BR)DS  

V

GS

= 0V, I

D

=250µA  
V
DS
=V

GS

, I
D
=250µA  
30  
V
Gate-Threshold Voltage  
Gate-Body Leakage  
V

GS(th)  

I

GSS  

1.0  
3.0  
±100  
0.5  
V

DS

=0V, V

GS

=
±20V  
nA  
A  
Zero Gate Voltage Drain Current  
I

DSS  

V
DS
=30V, V
GS
=0V  
V
GS
=10V, I
D
=3.5A  
V
GS
=4.5V, I
D
=2.8A  
V
DS
=4.5V, I
D
=2.5A  
I

S

=1.25A,

S

=0V  
0.038
0
47  
0.052
0
65  
7.0  
Drain-Source On-Resistance

(1)  

R
DS(on)  
Ω
Forward Transconductance

(1)  

Diode Forward Voltage  
Dynamic  
g
fs  
S
V
V

SD  

0.8  
1.2  
Gate Charge  
Q

g  

V
DS
=15V
V
GS
=5V,I
D
=2.5A  
V

=15V,V

GS

=10V,I

D

=2.5A  
3.0  
6
4.5  
9
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
nC  

Q

R

g  

1.6  
0.6  
5
f =1.0MHz  
2.5  
7.5  
Ω
Input Capa
ance  
Output Capac
nce  
everse T
nsfer Capacitance  
witc
ing  
C

iss  

C

oss  

C

rss  

305  
65  
29  
V

DS

=15V,V

GS

=0V,f =1MHz  
pF  
Turn-On Delay Time  
Rise Time  
t

d(on)  

7
12  
14  
6
11  
18  
25  
10  
t
r
V

DD  

=
15V, R

L

=15Ω  
,
I

D

≈1A,  
ns  
V

GEN

=10V,Rg=6Ω  
Turn-Off Delay Time  
t
d(off)  
Fall Time  
Notes :  
t
f
1.Pulse
T
e
st : Pulse Width≤300µs, duty cycle
≤
2%.  
Dated:07/2017  
Rev: 1.0  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
2/
6  

ATM2306NSA  
TYPICAL CHARACTERISTICS CURVES  
Transfer Characteristics  
Output Characteristics  
20  
16  
12  
8
14  
12  
10  
8
V

GS

=7V  
V

GS

=6V  
VDS=3V  
T

a

=100
℃
 
V

GS

=5V  
V

GS

=4V  
T

a

=25
℃  
6
4
V

GS

=3V  
4
2
0
0
0
1
2
3
4
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
2.
3.2  
3.6  
4.
.4  
4.8  
DRAIN TO SOURCE VOLTAGE
 
V

DS

(V)  
GATE TO SOURCE
TAGE V

GS

(V)  
R

DS(ON)

V

GS  

—
R

DS(ON)  

I

D  

——  
80  
70  
60  
50  
40  
30  
20  
10  
0
400  
300  
200  
100  
0
T

a

=25
℃  
Pulsed  
VGS=4.5V  
ID=2.5A  
T

a

=100
℃  
Pulsed  
T

a

=25
℃  
Pulsed  
0
2
3
4
7
8
9
10  
0
1
2
3
4
5
6
7
8
9
10  
D
N CUR
T I

D

(A)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
Threshold Voltage  
I

S

——  
V

SD  

10  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I

D

=-250uA  
1
T

a

=100
℃  
T

a

=25
℃  
Pulsed  
Pulsed  
0.1  
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
25  
50  
75  
100  
125  
SOURCE TO DRAIN VOLTAGE
 
V

SD

(V)  
JUNCTION TEMPERATURE
 
T

j

(
℃
)  
Dated:07/2017  
Rev: 1.0  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
3/
6  

ATM2306NSA  
PACKAGE OUTLINE  
SOT-23
(
TO-236)  
0.8  
Dimensions in millimeter  
Symbol  
Min.  
Typ.  
Max.  
1.150  
100  
0.900  
A
A1  
0.000  
0.8  
b
c
0.300  
0.08
00  
0.
0.11
2.900  
0.500  
0.150  
3.000  
D
E
1.2
2.250  
1
00  
00  
2.400  
1.400  
2.550  
2.000  
H
E
1.9  
1.900  
e
L
0.550REF  
SOT-23 (
TO-236
)  
0.300  
0.500  
8
°  
θ
0
°  
R
ecommended soldering pad  
ORDERING INFORMATION  
Device  
Package  
Shipping  
ATM
2306N
SA  
SOT-23  
30
00/Reel&Tape(7inch)  
Dated:07/2017  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
Rev: 1.0  
4/
6  

ATM2306NSA  
CONDITIONS OF SOLDERING
AND STORAGE  
Recommended condition of reflow soldering  
Recommended peak temperature is over 245
℃
. If peak tem
eratu
i
below 24
℃
, you may adjust  
the following parameters:  
Time length of peak temperature (longer)  
Time length of soldering (longer)  
Thickness of solder paste (thicker
Condition
s
of hand sold
ring  
T
e
mperature: 370
℃
 
Time: 3s
 
m
x.  
Times
one time  
orage c
ondition
s  
emperature  
5 to 40
℃  
Humidity  
30 to 80% RH  
Recommended period  
One y
ea
r after manufacturing  
Dated:07/2017  
Rev: 1.0  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
5
/
6  

ATM2306NSA  
PACKAGE
SPECIFICATIONS  
The method of packaging  
3
,
000 pcs per reel  
1
3
SOT
–
23
(
TO
–
236
)  
2
30
,
000 pcs per box  
10
reels per box  
195  
220  
120
,
000 pcs p
r carto
4 boxes p
carton  
210  
435  
Embossed tape and reel data  
G
4
.
0  
4
.
0  
E
H
F
120
°±
2
°  
C
A
1Pin  
Tape
(
8mm
)  
Symbol  
Value
(
unit
:
m
m
)  
3
.
15
±
0
.
1  
2
.
7
±
0
.
1  
1
.
25
±
0
.
1  
2
±
0
.
5  
A
B
C
E
Reel
(
7
”)  
13
±
0
.
5  
178
±
2
.
0  
8
.
4
±
1
.
5  
4
±
0
.
5  
60  
F
D
G
H
N
T
<
14
.
9  
Dated:07/2017  
Rev: 1.0  
AGERTECH MICROELECTRONICS  
Subsidiary of Sino-Talent International Holdings Ltd.  
6
/
6