AGM-Semi-AGM1095MN

Part #AGM-Semi-AGM1095MN
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AGM-Semi-AGM1095MN
AGM1095MN  
●
General Description  
Product Summary  
The AGM1095MN combines advanced trench MOSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

BVDSS  
RDSON  
ID  
This device is ideal  
applications.  
and battery protection  
for load switch  
100V  
90mΩ  
6.8A  
●
Features  
SOP8 Pin Configuration  
■
Advance high cell density Trenc
h
t
echnology  
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
■
D1 D1 D2 D2  
■
■
■
Low Thermal resistance  
100
%
Avalanche tested  
100% DVDS tested  
S1 G1 S2 G2  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
AGM1095MN  
AGM1095MN  
SOP8  
330mm  
12mm  
3000  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
V
V
VDS  
VGS  
100  
±20  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
Drain Current-Continuous(Tc=25
℃
)  
6.8  
A
A
A
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
4.1  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
27.2  
2.5  
w
w
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
1.0  
(Note 3)  
EAS  
T ,T  
mJ  
℃
90  
Avalanche energy  
Operating Junction and Storage Temperature Range  
Thermal Characteristic  
Symbol  
J
STG  
-55 To 150  
Tabl
e
2
.  
Typ  
Max  
Unit  
Parameter  
—  
1
50  
R
θJA  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
1
VER2.5  

AGM1095MN  
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TJ=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
100  
—  
V
DSS  
DSS  
=100V,V =0V  
GS  
μA  
nA  
I
=±20V,V =0V  
DS  
—  
±100  
I
GSS  
V
g
V
V
V
V
=V ,I
 
=250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
1.0  
1.7  
2.5  
—  
V
S
=5V,I =5A  
Forward Transconductance  
DS  
GS  
GS  
D
FS  
7
—  
—  
—  
=10V, I
 
=10A  
D
mΩ  
mΩ  
90  
95  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=5A  
D
100  
130  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
520  
40  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=50V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
2.4  
f=1.0MHz  
Rg  
Gate resistance  
—  
—  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
16.2  
3.2  
13  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=50V,  
RGEN=6Ω  
d(off)  
t
f
22  
Q
g
6
VGS=10V,  
VDS=30V, ID=3A  
Q
gs  
gd  
1.1  
1.3  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
—  
—  
—  
—  
A
SD  
6.8  
Forward on Voltage  
VGS=0V,IS=10A  
V
SD  
V
1.2  
—  
ns  
—  
—  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Isd=10A ,  
45  
63  
nc  
dI/dt=100A/µs , TJ=25
℃
 
—  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM1095MN  
Typical Characteristics (T  
J
=25
℃
 
Noted)  
3
VER2.5  

AGM1095MN  
Typical Characteristics (T
J
=25
℃
Noted)  
4
VER2.5  

AGM1095MN  
●
Dimensions(SOP8)  
SYMBOL  
min  
TYP  
max  
SYMBOL  
min  
max  
1.50  
A
A1  
A2  
A3  
B
4.80  
0.37  
5.00  
0.47  
C
1.30  
0.55  
0.55  
0.05  
0.19  
C1  
C2  
C3  
C4  
D
0.75  
0.65  
0.20  
0.23  
1.27  
0.41  
0.20  
1.05  
5.80  
3.80  
6.20  
4.00  
B1  
B2  
5.00  
D1  
0.40  
0.62  
5
VER2.5  

AGM1095MN  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the first version issued on August 10th, 2023. This document  
replaces all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
6
VER2.5