AGM-Semi-AGM15T06T

Part #AGM-Semi-AGM15T06T
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AGM-Semi-AGM15T06T
AGM15T06T  
●
General Description  
Product Summary  
The AGM15T06T combines advanced trench  
MOSFET technology with a low resistance package  
to provide  
extremely low R

DS(ON)  

.
This device is ideal  
switch and battery  
BVDSS  
RDSON  
ID  
for load  
protection applications.  
150V  
6.3mΩ  
160A  
●
Features  
■
Advance high cell density Trench technology  
TO-247 Pin Configuration  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
D G S  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—-  
—-  
AGM15T06T  
AGM15T06T  
TO-247  
450  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
VDS  
VGS  
V
V
150  
±20  
160  
95  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
500  
DM (pluse)  
w
w
250  
100  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
(Note 3)  
EAS  
T ,T  
mJ  
520  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
1
—  
—  
60  
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
1
R
0.5  
θJC  
Thermal Resistance Junction-Case  
1
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
150  
—  
V
DSS  
DSS  
=150V,V =0V  
GS  
μA  
nA  
I
I
=±20V,V =0V  
DS  
—  
±
GSS  
100  
V
V
V
V
V
=V ,I
 
=250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
2.0  
—  
2.8  
18  
4.0  
—  
V
S
g
FS  
=5V,I =20A  
D
Forward Transconductance  
DS  
GS  
GS  
=10V, I
 
=20A  
D
—  
—  
mΩ  
mΩ  
6.3  
7.5  
7.5  
12  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=15A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
C
C
C
Input Capacitance  
5025  
410  
10  
pF  
pF  
pF  
iss  
VDS=75V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
=0V,  
=0V,f=1.0MHz  
VGS  
VDS  
Rg  
Gate resistance  
—  
—  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
25  
31  
60  
20  
19  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=75V,  
ID=80A,RGEN=6Ω  
d(off)  
t
f
Q
g
VGS=10V, VDS=75V,  
ID=80A  
Q
gs  
gd  
11  
12  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
—  
—  
—  
—  
I
160  
1.5  
A
SD  
Forward on Voltage  
VGS=0V,IS=80A  
V
SD  
V
ns  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
IF=80A , dI/dt=100A/µs ,  
—  
—  
—  
—  
—  
—  
nc  
TJ=25
℃  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Diagram 1: Power dissipation  
Diagram 2: Max. transient thermal impedance  
10

0  

320  
280  
240  
200  
160  
120  
80  
0.5  
0.3  
-1  
10  
0.1  
0.05  
-2  
10  
0.02  
0.01  
single pulse  
40  
-3  
0
10  
-6  
-5  
10  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
10

0  

10

1  

0
20 40 60 80
 
100 120 140 160 180  
10  
O
T
c
[
C
]  
t
p  
[s]  
P

tot

=f(
T

C

)  
Z

thJC

=f(
t

p

); parameter: D=
t

p

/T  
Diagram 3: Safe operating area  
Diagram 4: Typ. output characteristics  
10

3  

120  
10V  
8V  
5V  
6V  
100  
80  
R
D
S(ON)
limited  
10

2  

10

1  

10

0  

10µs  
100µs  
60  
1ms  
40  
10ms  
DC  
4.5V  
20  
-1  
0
10  
-1  
10

0  

10

1  

10

2  

10

3  

0.0  
0.5  
1.0  
1.5  
DS
[V]  
2.0  
2.5  
3.0  
10  
V

DS

[V]  
V
I

D

=f(
V

DS

);
T
j=25°C; D=0; parameter:
t

p  

I

D

=f(
V

DS

);
T
j=25°C; parameter:
V

GS  

3
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Diagram 6: Gate threshold voltage vs.  
Junction temperature  
Diagram 5: Typ. transfer characteristics  
18  
16  
14  
12  
1.3  
1.2  
1.1  
1.0  
0.9  
125

o

C  
25

o

C  
10  
8
typ  
0.8  
6
0.7  
0.6  
0.5  
0.4  
4
2
0
1
2
3
4
5
6
-60 -40 -20
 
0 20
 
40 60 80
 
100 120 140 160 180  
O
V
G
S
[V]  
T
[
C
]  
j
V

th

=f(
T

j

); I

D

=250
μ
A  
I

D

=f(
V

GS

);
V

DS

=5V; parameter:
T

j  

Diagram 7: On-state resistance vs. Drain  
current  
Diagram 8: On-state resistance vs. Junction  
temperature  
12  
14  
13  
12  
11  
10  
9
10  
8
6V  
10V  
6
8
typ  
7
6
5
4
3
4
2
0
2
-60 -40 -20
 
0 20
 
40 60 80
 
100 120 140 160 180  
0
3
6
9
12  
O
T
j  
[
C
]  
I
D  
[A]  
R

DS

(on)=f(
I

D

);
T
j=25°C; parameter:
V

GS  

R

DS

(on)=f(
T

j

);
I

D

=20A;
V

GS

=10V  
4
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Diagram 9: Forward characteristics of reverse
 
Diagram 10: On-state resistance vs. Vgs  
diode  
characteristics  
10

2  

16  
14  
12  
10  
8
125

o

C  
10

1  

10

0  

125

o

C  
25

o

C  
25

o

C  
6
-1  
4
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10 12 14 16 18 20  
gs
[V]  
V

S
D

[V]  
V
I

F

=f(
V

SD

); parameter:
T

j  

R

DS

(on)=f(V

gs

);
I

D

=20A; parameter:
T

j  

Diagram 11: Breakdown Voltage Variation vs.  
Temperature  
Diagram 12: Maximum Drain Current  
180  
160  
140  
120  
100  
80  
200  
190  
180  
170  
160  
150  
60  
40  
20  
140  
0
-60 -40 -20
 
0 20
 
40 60 80
 
100 120 140 160 180  
0
25  
50  
75  
T
[
C
]  
100  
125  
150  
175  
O
O
T
j
[
C
]  
C
V

BR(DSS)

=
f(
T

j

)
; I

D

=
250μA  
I

D

= f(
T

c

); V

GS

=10V  
5
VER2.5  

AG  
                                                                                                                                                                                       
M15T06T  
Diagram 13: Typ. capacitances  
10

4  

Diagram 14: Typ. gate charge  
10  
9
8
7
6
5
4
3
2
1
0
Ciss  
75V  
10

3  

Coss  
10

2  

10

1  

Crss  
10

0  

0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
V

D
S

[V]  
Q
gate
[nC]  
C
=f(
V

DS

);
V

GS

=0V; f=1MHz  
V

GS

=f(
Q

gate

);
I

D

=20A pulsed;
V

DS

=75V  
6
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Table 7. Diode characteristics  
Test circuit for diode characteristics  
Diode recovery waveform  
Switching times waveform  
Unclamped inductive waveform  
Table 8. Switching times  
Switching times test circuit for inductive load  
Table 9. Unclamped inductive load  
Unclamped inductive load test circuit  
7
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
TO-
2
47
Package Information:  
ș
ș
mm  
SYMBOL  
MIN  
NOM  
MAX  
䙈
A  
4.90  
2.31  
5.00  
2.41  
5.10  
2.51  
ș
䙈
A1  
A2  
䙈
b  
䙈
b1  
䙈
b2  
䙈
c  
䙈
D  
D1  
1.90  
1.15  
1.95  
2.95  
0.55  
20.90  
16.35  
1.05  
15.70  
13.10  
4.90  
2.40  
5.40  
19.80  
–
2.00  
1.20  
2.10  
3.10  
0.60  
21.00  
16.55  
1.20  
15.80  
13.25  
5.00  
2.50  
5.44  
19.92  
–
2.10  
1.25  
2.25  
3.25  
0.65  
21.10  
16.75  
1.35  
15.90  
13.40  
5.10  
2.60  
5.48  
20.10  
4.30  
D2  
䙈
E  
E1  
E2  
E3  
䙈
e  
䙈
L  
䙈
L1  
3.70  
3.50  
7.00  
2.40  
5.60  
3.80  
3.60  
7.20  
2.50  
5.80  
3.90  
3.70  
7.40  
2.60  
6.00  
䙈
ž3  
䙈
ž3ꢀ  
ž3ꢁ  
ž3ꢂ  
Q
䙈
S  
T
6.05  
9.80  
6.00  
ꢃe  
6.15  
10.00  
6.20  
ꢄe  
6.25  
10.20  
6.40  
ꢅe  
U
șꢀ  
ꢀe  
ꢂe  
ꢃe  
ș
2
 
ș
3  
ꢀꢂe  
ꢀꢃe  
ꢀꢄe  
8
VER2.5  

AGM15T06T  
                                                                                                                                                                                       
                                                                                                                                                                                          
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequencesDo not consider the use of such  
information or use beyond its
 
scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
9
VER2.5