AGM-Semi-AGM306D

Part #AGM-Semi-AGM306D
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AGM-Semi-AGM306D
AGM306D  
●
General Description  
Product Summary  
The AGM306D combines advanced trenc
h
M
OSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

.
BVDSS  
RDSON  
ID  
This device is ideal  
for load switch and battery  
protection applications.  
30V  
5.7mΩ  
60A  
●
Features  
■
Advance high cell density Trench technology  
TO-252 Pin Configuration  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—–  
—–  
AGM306D  
AGM306D  
TO-252  
2500  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
VDS  
VGS  
V
V
30  
±20  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
60  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
39  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
200  
DM (pluse)  
w
w
51  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
12  
(Note 3)  
EAS  
T ,T  
mJ  
35  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
1
—  
—  
R
θJA  
℃
/W  
℃
/W  
35  
Thermal Resistance Junction-ambient (Steady State)  
1
R
θJC  
Thermal Resistance Junction-Case  
2.5  
1
VER2.5  

AGM306D  
Table 3.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
30  
—  
V
DSS  
DSS  
=30V,V =0V  
GS  
1.0  
μA  
nA  
I
I
=±20V,V =0V  
DS  
—  
±
GSS  
100  
V
Gate Threshold Voltage  
V
V
V
V
=V ,I
 
=250μA  
DS GS
 
D  
GS(th)  
1.2  
1.6  
21  
2.1  
—  
V
S
g
FS  
=5V,I =20A  
D
Forward Transconductance  
DS  
GS  
GS  
—  
—  
—  
=10V, I
 
=20A  
D
5.7  
9.5  
7.5  
14  
mΩ  
mΩ  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=15A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
1050  
165  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=15V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
147  
=0V,  
=0V,f=1.0MHz  
VGS  
VDS  
Rg  
Gate resistance  
—  
—  
Ω
6.0  
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
9
27  
36  
—  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=15V  
RL=0.75Ω,RGEN=3.3Ω  
d(off)  
t
f
Q
Q
g
34  
6
VGS=10V, VDS=25V,  
ID=12A  
gs  
gd  
Q
12  
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
—  
—  
60  
1.2  
—  
A
SD  
—  
—  
—  
—  
Forward on Voltage  
VGS=0V,IS=20A  
V
SD  
V
ns  
t
—  
—  
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
IF=20A , dI/dt=100A/µs ,  
nc  
TJ=25
℃  
—  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.  
Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%  
2
VER2.5  

AGM306D  
AGM
3
06D  
Test Circuit  
1
)
E

AS

T
e
st Circuits  
2
)
Gate Charge Test Circuit:  
3)
Switch Time Test Circuit
:
 
3
VER2.5  

AGM306D  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS (Curves)  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
VDS Drain-to-Source Voltage(V)  
VGS Gate-to-Source Voltage(V)  
Figure 4. Drain Current  
Figure 3. Max BV

DSS

vs Junction Temperature  
T

J

-Junction Temperature(
℃
)  
T

J

-Junction Temperature(
℃
)  
Figure 5. V

GS(th)

vs Junction Temperature  
Figure 6. R

DS(ON)

vs Junction Temperature  
T

J

-Junction Temperature(
℃
)  
T

J

-Junction Temperature(
℃
)  
4
VER2.5  

AGM306D  
Figure 7. Gate Charge Waveforms  
Figure 8. Capacitance  
Qg(nC)  
VDS Drain-to-Source Voltage(V)  
Figure 9. Body-Diode Characteristics  
Figure 10. Maximum Safe Operating Area  
Vsd (V)  
VDS Drain-to-Source Voltage(V)  
Figure 11. Normalized Maximum Transient Thermal Impedance  
5
VER2.5  

AGM306D  
●
Dimensions  
SYMBOL  
min  
max  
2.50  
0.80  
0.70  
6.75  
6.30  
10.60  
1.75  
0.23  
SYMBOL  
min  
0.85  
0.50  
0.45  
5.10  
2.25  
4.45  
0.60  
max  
1.25  
0.90  
0.70  
5.50  
2.35  
4.75  
1.10  
A
b
2.10  
0.50  
0.45  
6.30  
5.30  
9.20  
0.90  
0.00  
B
b1  
C
b2  
D
D1  
e1  
e2  
L3  
E
L1  
L2  
K
6
VER2.5  

AGM306D  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequencesDo not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.5