AGM-Semi-AGM306MA

Part #AGM-Semi-AGM306MA
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AGM-Semi-AGM306MA
AGM306MA  
●
General Description  
Product Summary  
The AGM306MA combines advanced trench  
MOSFET technology with a low resistance package  
to provide  
extremely low R

DS(ON)  

.
BVDSS  
RDSON  
ID  
switch and battery  
This device is ideal  
for load  
protection applications.  
30V  
6.8mΩ  
40A  
●
Features  
PDFN5*6 Pin Configuration  
■
Advance high cell density Trench technology  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—-  
—-  
AGM306MA  
AGM306MA  
PDFN5*6  
3000  
Table 1.  
Absolute Maximum Ratings (Tc=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
VDS  
VGS  
V
V
30  
±20  
40  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
Drain Current-Continuous(Tc=25
℃
)  
A
A
A
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
30  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
99  
DM (pluse)  
w
w
80  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
32  
(Note 3)  
EAS  
T ,T  
mJ  
℃
99  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
-55 To 150  
Table 2.  
Thermal Characteristic  
Symbol  
Typ  
Max  
50  
Unit  
Parameter  
1
—  
—  
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
1
R
θJC  
1.5  
Thermal Resistance Junction-Case  
1
VER2.5  

AGM306MA  
Table 3.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
V
V
=0V I
 
=250μA  
—  
—  
—  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
GS  
DS  
GS  
D
30  
—  
V
DSS  
DSS  
=30V,V =0V  
GS  
μA  
nA  
I
I
=±20V,V =0V  
DS  
—  
±
GSS  
100  
2.1  
—  
V
Gate Threshold Voltage  
V
V
V
V
=V ,I
 
=250μA  
DS GS
 
D  
GS(th)  
1.2  
1.4  
7
V
S
g
FS  
=10V,I =6A  
D
Forward Transconductance  
DS  
GS  
GS  
—  
—  
—  
=10V, I
 
=10A  
D
mΩ  
mΩ  
6.8  
9.5  
9.0  
14  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=10A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
1150  
150  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=15V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
110  
=0V,  
=0V,f=1.0MHz  
VGS  
VDS  
Rg  
Gate resistance  
—  
1.7  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
4.5  
11  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=12V,  
ID=5A,RGEN=3.3Ω  
d(off)  
25  
t
f
9.6  
23  
Q
Q
g
VGS=10V, VDS=25V,  
ID=10A  
gs  
gd  
3.0  
6.0  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
—  
—  
—  
—  
I
40  
A
SD  
Forward on Voltage  
VGS=0V,IS=10A  
V
SD  
1.2  
6.5  
7.0  
V
ns  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
IF=15A , dI/dt=100A/µs ,  
—  
—  
—  
—  
nc  
TJ=25
℃  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM306MA  
Fig.1 Power Dissipation Derating Curve  
Fig.2 Typical output Characteristics  
1.2  
1
50  
V

GS

=10V  
0.8  
0.6  
0.4  
0.2  
0
V

GS

=4.5V  
25  
0
0
0.5  
1
1.5  
2
Drain-Source voltage (V)  
0
50  
100  
150  
200  
Temperature (

。

C)  
Fig.3 Threshold Voltage V.S Junction Temperature
 
Fig.4 Resistance V.S Drain Current  
2.5  
2
20  
10  
0
1.5  
1
0.5  
0
-50  
50  
150  
0
10  
20  
30  
Junction Temperature  
Drain Current(A)  
Fig.5 On-Resistance VS Gate Source Voltage  
Fig.6 On-Resistance V.S Junction Temperature  
1.5  
14  
12  
10  
8
1
6
4
2
0
0.5  
3
5
7
9
-50  
0
50  
100  
150  
V

GS

( V )  
Temperature  
3
VER2.5  

AGM306MA  
Fig.7 Switching Time Measurement Circuit  
Fig.8 Gate Charge Waveform  
Fig.9 Switching Time Measurement Circuit  
Fig.10 Gate Charge Waveform  
Fig.11 Avalanche
 
Measurement Circuit  
Fig.12 Avalanche
 
Waveform  
4
VER2.5  

AGM306MA  
MILLIMETER  
Typ.  
SYMBOL  
MIN  
MAX  
A
A1  
A2  
D
0.900  
1.000  
1.100  
0.254 REF.  
0~0.05  
4.900  
4.824  
3.910  
4.924  
5.924  
3.375  
5.674  
0.350  
4.976  
4.110  
5.076  
6.076  
3.575  
5.826  
0.450  
4.010  
D1  
D2  
E
5.000  
6.000  
3.475  
E1  
E2  
b
5.750  
0.400  
1.270 TYP.  
e
0.534  
0.424  
L
0.610  
0.500  
0.686  
0.576  
L1  
L2  
k
1.800 REF.  
1.190  
0.549  
1.290  
0.625  
10˚  
1.390  
0.701  
1²˚  
H
8˚  
1.100  
1.200  
1.300  
0.100  
d
5
VER2.5  

AGM306MA  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequencesDo not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
6
VER2.5