AGM-Semi-AGM4005LL
| Part # | AGM-Semi-AGM4005LL |
Download  | AGM-Semi-AGM4005LL |
AGM4005LL
L
●
General Description
Product Summary
The AGM4005LL combines advanced trench
MOSFET technology with a low resistance package
to provide extremely low R
DS(ON)
.
BVDSS
RDSON
ID
This device is ideal
for load switch and battery
protection applications.
40V
0.82mΩ
350A
●
Features
■
Advance high cell density Trench technology
TOLL-8L Pin Configuration
■
■
Low R
DS(ON)
to minimize conductive loss
Low Gate Charge for fast switching
D
■
Low Thermal resistance
●
Application
G
■
MB/VGA Vcore
nd
■
■
■
SMPS 2
Synchronous Rectifier
S
POL application
Pin
1
Description
Gate(G)
BLDC Motor driver
2,3,4,5,6,7,8 Source(S)
Package Marking and Ordering Information
9
Drain(D)
Quantity
Device Marking
Device
Device Package
Reel Size
Tape width
—-
—-
TOLL-8L
2000
AGM4005LL
AGM4005LL
Table 1.
Absolute Maximum Ratings (TA=25
)
℃
Symbol
Parameter
Drain-Source Voltage (VGS=0V
）
Value
Unit
V
V
VDS
VGS
40
Gate-Source Voltage (VDS=0V)
±20
350
247
(Note 1)
Drain Current-Continuous(Tc=25
℃
)
A
I
D
c
Drain Current-Continuous(T
=100
℃
)
A
A
(Note 2)
I
Drain Current-Continuous@ Current-Pulsed
DM (pluse)
1330
250
w
w
Maximum Power Dissipation(Tc=25
℃
)
Maximum Power Dissipation(Tc=100
℃
)
P
D
100
(Note 3)
mJ
EAS
T ,T
Avalanche energy
1052
Operating Junction and Storage Temperature Range
℃
J
STG
-55 To 150
Table 2.
Thermal Characteristic
Symbol
Typ
Max
Unit
Parameter
1
—
—
R
θJA
℃
/W
℃
/W
40
Thermal Resistance Junction-ambient (Steady State)
1
R
θJC
0.5
Thermal Resistance Junction-Case
1
VER2.51
AGM4005LL
L
Table 3.
Symbol
On/Off States
Electrical Characteristics (TA=25
unless otherwise noted)
℃
Parameter
Conditions
Min
Typ
Max
Unit
BV
V
=0V I
=250μA
45
—
—
1
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
GS
D
40
—
V
DSS
V
V
=32V,V =0V
GS
μA
nA
DS
I
I
DSS
=±20V,V =0V
DS
—
—
GS
±
GSS
100
2.3
—
V
Gate Threshold Voltage
V
=V ,I
=250μA
DS GS
D
GS(th)
1.2
—
1.7
V
S
g
FS
V
=5V,I =12A
DS D
Forward Transconductance
—
V
V
=10V, I
=40A
D
GS
—
—
mΩ
mΩ
0.82
1.7
1.3
3
R
Drain-Source On-State Resistance
DS(on)
=4.5V, I
=20A
D
GS
Dynamic Characteristics
—
—
—
—
—
—
5440
1815
120
C
Input Capacitance
Output Capacitance
pF
pF
pF
iss
VDS=20V,VGS=0V,
F=1MHZ
C
oss
rss
C
Reverse Transfer Capacitance
Gate resistance
=0V,
VGS
Rg
Switching Times
—
—
Ω
1.3
=0V,f=1.0MHz
VDS
Turn-on Delay Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
t
d(on)
nS
nS
nS
nS
nC
nC
nC
15.7
48
t
t
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
r
VGS=10V,VDS=20V
ID=40A,RGEN=3Ω
d(off)
75
t
f
42
81
Q
g
VGS=10V, VDS=20V,
ID=40A
Q
gs
gd
18
15
Q
Source-Drain Diode Characteristics
Source-Drain Current(Body Diode)
—
—
—
350
1.3
I
A
SD
Forward on Voltage
VGS=0V,IS=40A
V
SD
0.8
V
ns
t
rr
Reverse Recovery Time
Reverse Recovery Charge
IF=25A , dI/dt=100A/µs ,
—
—
—
—
—
—
nc
TJ=25
℃
Q
rr
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: T
=25
℃
J
2
VER2.51
AG
M4005LL
L
. Typical Characteristics
Power Capability
Current Capability
500
400
300
200
100
0
350
300
250
200
150
100
50
T
C
=25
o
C,V
G
=10V
T
C
=25
o
C
0
0
20 40 60 80
100 120 140 160 180
0
20 40 60 80
100 120 140 160
T
mp
– Mounting Point Temp.
(°C)
T
mp
– Mounting Point Temp.
(°C)
Safe Operating Area
Transient Thermal Impedance
3000
2
1
1000
100
10
100us
300us
1ms
t
i
Duty = 0.5
0.2
m
i
L
)
n
o
(
s
d
R
0.1
10ms
DC
0.1
0.05
0.02
0.01
1
Mounted on 1in
2
pad
Single Pulse
T
C
=25
o
C
R
JC
:0.5
o
C/W
0.1
0.01
0.01
0.1
1
10
100 300
1E-4
1E-3
0.01
0.1
1
10
V
DS
– Drain-Source Voltage (V)
Square Wave Pulse Duration (sec)
3
VER2.51
AG
M4005LL
L
. Typical Characteristics (Cont.)
Output Characteristics
On Resistance
4
3
2
1
0
50
V
GS
= 4,5,6,7,8,9,10V
45
40
35
30
25
20
15
10
5
V
GS
= 4.5V
V
GS
=10V
3V
2V
0
0.0
0.2
0.4
0.6
0.8
1.0
0
10
20
30
40
50
V
DS
– Drain-Source Voltage (V)
I
D
– Drain Current (A)
Transfer Characteristics
Normalized Threshold Voltage
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
50
40
30
20
10
0
I
DS
=250
A
I
DS
=20A
1
2
3
4
5
6
7
8
9
10
-50 -25
0
25 50 75
100 125 150
V
GS
– Gate-Source Voltage (V)
T
j
– Junction Temperature (°C)
4
VER2.51
AGM4005LL
L
. Typical Characteristics (Cont.)
Normalized On Resistance
Diode Forward Current
2.2
40
10
V
GS
= 10V
2.0
I
DS
= 20A
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
T
j
=150
o
C
T
j
=25
o
C
1
R
ON
@T
j
=25
o
C: 1.2m
0.2
-50 -25
0.1
0
25 50 75
100 125 150
0.0
0.2
0.4
0.6
0.8
1.0
1.2
T
j
– Junction Temperature (°C)
V
SD
– Source-Drain Voltage (V)
Capacitance
Gate Charge
8000
7000
6000
5000
4000
3000
2000
1000
0
10
Frequency=1MHz
V
DS
= 20V
I
DS
= 20A
Ciss
8
6
4
2
0
Coss
Crss
10 15 20 25 30 35 40
0
5
0
20
40
60
80
V
DS
– Drain-Source Voltage (V)
Q
G
– Gate Charge (nC)
5
VER2.51
AGM4005LL
L
Package Dimensions
TOLL-8L Package
A
E1
b1
A1
R
b3(3
x
)
E2
c
b2(2
x
)
e(6
x
)
e1(2
x
)
b(6
x
)
Q
E
BOTTOM VIEW
TOP VIEW
MILLIMETER
SYMBOL
MIN.
2.200
1.700
0.600
9.700
0.650
1.100
0.400
10.300
11.000
3.200
4.470
9.800
8.000
0.500
NOM.
2.300
MAX.
2.400
1.900
0.800
9.900
0.850
1.300
0.600
j
A
Detail “Z”
A1
b
1.800
0.700
b1
b2
b3
c
9.800
0.750
1.200
0.500
Detail “Z”
D
10.400
11.100
3.300
10.500
11.200
3.400
4.670
10.000
8.200
0.700
D1
D2
D4
E
4.570
9.900
E1
E2
e
8.100
0.600
1.200 BSC
1.225 BSC
11.700
6.950 BSC
5.900 BSC
0.100 REF.
0.350 REF.
3.100 REF.
1.650
e1
H
11.600
11.800
H1
H2
i
j
K
L
1.550
0.600
0.500
0.400
1.750
0.800
0.700
0.600
L1
L2
L3
Q
0.700
0.600
0.500
7.950 REF.
3.100
R
3.000
3.200
10
˚
REE.
6
VER2.51
AGM4005LL
L
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on May 10, 2022. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
7
VER2.51
