AGM-Semi-AGM402H

Part #AGM-Semi-AGM402H
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AGM-Semi-AGM402H
AGM402H  
●
General Description  
Product Summary  
The AGM402H combines advanced trench MOSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

.
BVDSS  
RDSON  
ID  
This device is ideal  
switch and battery  
for load  
40V  
2.6mΩ  
170A  
protection applications.  
●
Features  
TO-263 Pin Configuration  
■
Advance high cell density Trench technology  
D
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
G
S
nd  
■
SMPS 2
 
Synchronous Rectifier  
■
POL application  
■
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—-  
—-  
TO-263  
800  
AGM402H  
AGM402H  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
VDS  
VGS  
V
V
40  
±20  
170  
98  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
570  
250  
100  
1000  
DM (pluse)  
w
w
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
(Note 3)  
EAS  
T ,T  
mJ  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Parameter  
Typ  
—  
Max  
Unit  
℃
/W  
℃
/W  
1
R
θJA  
Thermal Resistance Junction-ambient (Steady State)  
62  
1
R
—  
θJC  
Thermal Resistance Junction-Case  
0.5  
1
VER2.6  

AGM402H  
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
V
V
=0V I
 
=250μA  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
GS  
DS  
GS  
D
V
DSS  
DSS  
40  
—  
45  
=40V,V =0V  
GS  
μA  
nA  
I
I
—  
—  
=±20V,V =0V  
DS  
—  
±
GSS  
100  
2.5  
—  
V
V
V
V
V
=V ,I
 
=250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
FS  
1.0  
1.7  
—  
V
g
=10V,I =20A  
D
Forward Transconductance  
DS  
GS  
GS  
—  
—  
—  
S
=10V, I
 
=40A  
D
mΩ  
mΩ  
2.6  
3.3  
3.8  
5.0  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=20A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
4140  
405  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=20V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
360  
=0V,  
=0V,f=1.0MHz  
VGS  
VDS  
Rg  
Gate resistance  
—  
2
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
13.7  
6.1  
50  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=20V  
ID=40A,RGEN=3Ω  
d(off)  
t
f
10  
Q
g
73  
VGS=20V, VDS=20V,  
ID=40A  
Q
gs  
gd  
15  
Q
15  
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
170  
—  
—  
—  
A
SD  
Forward on Voltage  
VGS=0V,IS=40A  
V
SD  
0.8  
18  
40  
1.2  
—  
V
ns  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
IS=40A , dI/dt=500A/µs ,  
nc  
TJ=25
℃  
—  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.6  

AGM402H  
Typical Characteristics  
VDS, Drain -Source Voltage (V)  
Fig1.
Typical Output Characteristics  
Tj – Junction
T
e
mperature (°C)  
Fig2.
V

GS(TH)

Gate -Source Voltage
Vs.
Tj  
VGS, Gate -Source Voltage (V)  
Tj – Junction
T
e
mperature (°C)  
Fig3.
Typical Transfer Characteristics  
Fig4.
Normalized On-Resistance Vs. Temperature  
VSD, Source-Drain Voltage (V)  
VDS, Drain -Source Voltage (V)  
Fig5.
Typical Source-Drain Diode Forward Voltage  
Fig6.
Maximum Safe Operating Area  
3
VER2.6  

AGM402H  
Typical Characteristics  
VDS , Drain-Source Voltage (V)  
Fig7.
Typical Capacitance Vs.Drain-Source Voltage  
Qg –
T
o
tal Gate Charge (nC)  
Fig8.
Typical Gate Charge Vs.Gate-Source
Voltage  
Pulse Width (s)  
Fig9 .
Normalized Maximum Transient Thermal Impedance  
Fig10.
Unclamped Inductive Test Circuit and waveforms  
Fig11.
Switching Time Test Circuit and waveforms  
4
VER2.6  

AGM402H  
TO-263, 2 leads  
Dimentions in mm unless otherwise specified  
Symbol  
Min  
9.66  
1.02  
8.59  
1.14  
0.70  
Nom  
9.97  
1.17  
9.00  
1.27  
0.83  
5.08  
15.24  
1.28  
4.50  
2.54  
0.25  
1.45  
0.55  
Max  
A
B
C
D1  
10.28  
1.32  
9.40  
1.40  
0.95  
D2  
D3  
E
F
G
H
I
K
a1  
15.09  
1.15  
4.30  
2.29  
15.39  
1.40  
4.70  
2.79  
1.30  
0.45  
0°  
1.60  
0.65  
8°  
a2(degree)  
5
VER2.6  

AGM402H  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequencesDo not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
6
VER2.6