AGM-Semi-AGM409D
| Part # | AGM-Semi-AGM409D |
Download  | AGM-Semi-AGM409D |
AGM409D
●
General Description
Product Summary
The AGM409D combines advanced trenc
h
M
OSFET
to provide
technology with a low resistance package
extremely low R
DS(ON)
.
BVDSS
RDSON
ID
This device is ideal
for load switch and battery
protection applications.
●
Features
40V
6.5mΩ
63A
TO-252 Pin Configuration
■
Advance high cell density Trench technology
■
■
Low R
DS(ON)
to minimize conductive loss
Low Gate Charge for fast switching
■
Low Thermal resistance
●
Application
■
MB/VGA Vcore
nd
■
■
■
SMPS 2
Synchronous Rectifier
POL application
BLDC Motor driver
Package Marking and Ordering Information
Quantity
Device Marking
Device
Device Package
Reel Size
Tape width
—-
AGM409D
AGM409D
TO-252
2500
—-
Tabl
e
1
.
Absolute Maximum Ratings (TA=25
)
℃
Symbol
Parameter
Value
Unit
VDS
VGS
Drain-Source Voltage (VGS=0V
）
V
V
40
±20
Gate-Source Voltage (VDS=0V)
(Note 1)
Drain Current-Continuous(Tc=25
℃
)
63
A
A
A
I
D
c
Drain Current-Continuous(T
=100
℃
)
41
(Note 2)
I
Drain Current-Continuous@ Current-Pulsed
190
DM (pluse)
w
w
54
Maximum Power Dissipation(Tc=25
℃
)
Maximum Power Dissipation(Tc=100
℃
)
P
D
21
(Note 3)
EAS
T ,T
mJ
141
Avalanche energy
J
STG
Operating Junction and Storage Temperature Range
℃
-55 To 150
Tabl
e
2
.
Thermal Characteristic
Symbol
Typ
Max
Unit
Parameter
1
—
—
R
θJA
℃
/W
℃
/W
40
Thermal Resistance Junction-ambient (Steady State)
1
R
θJC
Thermal Resistance Junction-Case
2.3
1
VER2.5
AGM409D
Table 3.
Symbol
On/Off States
Electrical Characteristics (TA=25
unless otherwise noted)
℃
Parameter
Conditions
Min
Typ Max
Unit
BV
V
=0V I
=250μA
—
—
—
—
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
GS
D
40
—
V
DSS
DSS
V
V
=40V,V =0V
GS
1
μA
nA
DS
I
I
=±20V,V =0V
GS DS
—
±
GSS
100
V
Gate Threshold Voltage
V
=V ,I
=250μA
DS GS
D
GS(th)
1.0
—
1.5
—
2.5
—
V
S
g
FS
V
=5V,I =12A
DS D
Forward Transconductance
V
V
=10V, I
=25A
D
GS
—
—
mΩ
mΩ
6.5
8.5
8.9
12
R
Drain-Source On-State Resistance
DS(on)
=4.5V, I
=15A
D
GS
Dynamic Characteristics
—
—
—
—
—
—
C
C
C
Input Capacitance
pF
pF
pF
iss
1490
170
125
VDS=30V,VGS=0V,
F=1MHZ
Output Capacitance
oss
rss
Reverse Transfer Capacitance
=0V,
=0V,f=1.0MHz
VGS
VDS
Rg
Gate resistance
—
—
Ω
2.3
Switching Times
Turn-on Delay Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
t
nS
nS
nS
nS
nC
nC
nC
d(on)
8
t
t
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
r
21
VGS=10V,VDS=20V,
ID=10A,RGEN=3.5Ω
d(off)
34
19
28.5
t
f
Q
Q
g
VGS=10V, VDS=20V,
ID=20A
gs
gd
5.8
7.3
Q
Source-Drain Diode Characteristics
Source-Drain Current(Body Diode)
—
—
—
63
I
A
SD
Forward on Voltage
VGS=0V,IS=25A
V
SD
1.2
V
0.86
38
ns
t
—
—
—
—
rr
Reverse Recovery Time
Reverse Recovery Charge
IF=20A , dI/dt=100A/µs ,
nc
TJ=25
℃
26
Q
rr
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: T
=25
℃
J
2
VER2.5
AGM409D
Typical Characteristics
VDS, Drain -Source Voltage (V)
Fig1.
Typical Output Characteristics
Tj – Junction
T
e
mperature (°C)
Fig2.
V
GS(TH)
Gate -Source Voltage Vs.Tj
VGS, Gate -Source Voltage (V)
Tj – Junction
T
e
mperature (°C)
Fig3.
Typical Transfer Characteristics
Fig4.
Normalized On-Resistance Vs. Tj
VSD, Source-Drain Voltage (V)
VDS, Drain -Source Voltage (V)
Fig5.
Typical Source-Drain Diode Forward Voltage
Fig6.
Maximum Safe Operating Area
3
VER2.5
AGM409D
Typical Characteristics
VDS , Drain-Source Voltage (V)
Fig7.
Typical Capacitance Vs.Drain-Source Voltage
Qg –
T
o
tal Gate Charge (nC)
Fig8.
Typical Gate Charge Vs.Gate-Source Voltage
Pulse Width (s)
Fig9 .
Normalized Maximum Transient Thermal Impedance
Fig10.
Unclamped Inductive Test Circuit and waveforms
Fig11.
Switching Time Test Circuit and waveforms
4
VER2.5
AGM409D
●
Dimensions
SYMBOL
min
max
2.50
0.80
0.70
6.75
6.30
10.60
1.75
0.23
SYMBOL
min
0.85
0.50
0.45
5.10
2.25
4.45
0.60
max
1.25
0.90
0.70
5.50
2.35
4.75
1.10
A
b
2.10
0.50
0.45
6.30
5.30
9.20
0.90
0.00
B
b1
C
b2
D
D1
e1
e2
L3
E
L1
L2
K
5
VER2.5
AGM409D
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on May 10, 2022. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
6
VER2.5
