AGM-Semi-AGM40P30AP
| Part # | AGM-Semi-AGM40P30AP |
Download  | AGM-Semi-AGM40P30AP |
AGM40P30AP
●
General Description
Product Summary
The AGM40P30AP combines advanced trench MOSFET
to provide
technology with a low resistance package
extremely low R
DS(ON)
BVDSS
RDSON
ID
This device is ideal
and battery
for load switch
-40V
26mΩ
-33A
protection applications.
PDFN3.3*3.3 Pin Configuration
●
Features
■
Advance high cell density Trenc
h
t
echnology
Low R
DS(ON)
to minimize conductive loss
Low Gate Charge for fast switching
■
■
■
Low Thermal resistance
●
Application
■
MB/VGA Vcore
nd
■
■
■
SMPS 2
Synchronous Rectifier
POL application
BLDC Motor driver
Package Marking and Ordering Information
Quantity
Device Marking
Device
Device Package
Reel Size
Tape width
AGM40P30AP
AGM40P30AP
PDFN3.3*3.3
330mm
12mm
5000
Table 1.
Absolute Maximum Ratings (TA=25
)
℃
Symbol
Parameter
Value
Unit
Drain-Source Voltage (VGS=0V
）
V
V
VDS
VGS
-40
±20
-33
-25
-98
Gate-Source Voltage (VDS=0V)
(Note 1)
A
A
A
Drain Current-Continuous(Tc=25
℃
)
I
D
c
Drain Current-Continuous(T
=100
℃
)
(Note 2)
I
Drain Current-Continuous@ Current-Pulsed
DM (pluse)
w
w
59
23
Maximum Power Dissipation(Tc=25
℃
)
Maximum Power Dissipation(Tc=100
℃
)
P
D
(Note 3)
EAS
T ,T
mJ
℃
260
Avalanche energy
Operating Junction and Storage Temperature Range
J
STG
-55 To 150
Tabl
e
2
.
Thermal Characteristic
Symbol
Typ
Max
Unit
Parameter
—
1
60
R
R
θJA
℃
/W
℃
/W
Thermal Resistance Junction-ambient (Steady State)
—
1
2.1
θJC
Thermal Resistance Junction-Case
1
VER2.61
AGM40P30AP
Tabl
e
3
.
Symbol
On/Off States
Electrical Characteristics (TJ=25
unless otherwise noted)
℃
Parameter
Conditions
Min
Typ
Max
Unit
BV
V
GS
V
DS
V
GS
=0V I
=-250μA
—
—
—
—
-1
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
D
-40
—
V
DSS
DSS
=-40V,V =0V
GS
μA
nA
I
=±20V,V =0V
DS
—
±100
I
GSS
V
g
V
V
V
V
=V ,I
=-250μA
Gate Threshold Voltage
DS GS
D
GS(th)
-1.2
—
-1.6
10
-2.1
—
V
S
=5V,I =-5A
Forward Transconductance
DS
GS
GS
D
FS
=-10V, I
=-10A
D
—
—
mΩ
mΩ
26
42
38
54
R
Drain-Source On-State Resistance
DS(on)
=-4.5V, I
=-5A
D
Dynamic Characteristics
—
—
—
—
—
—
1310
C
C
C
Input Capacitance
pF
pF
pF
iss
VDS=-15V,VGS=0V,
F=1MHZ
Output Capacitance
oss
rss
115
90
Reverse Transfer Capacitance
f=1.0MHz
—
—
Rg
Gate resistance
Ω
1.2
Switching Times
Turn-on Delay Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
t
nS
nS
nS
nS
nC
nC
nC
d(on)
13.5
18
t
t
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
r
VGS=-10V,VDS=-25V,
ID=-10A,RGEN=3.3Ω
d(off)
36
t
f
25
Q
g
27
VGS=-10V,
VDS=-25V, ID=-12A
Q
gs
gd
7.3
5.6
Q
Source-Drain Diode Characteristics
Source-Drain Current(Body Diode)
I
—
—
—
—
-33
-1.2
—
A
SD
Forward on Voltage
VGS=0V,IS=-10A
V
SD
V
ns
—
—
t
—
—
rr
Reverse Recovery Time
Reverse Recovery Charge
Isd=-10A ,
nc
dI/dt=100A/µs , TJ=25
℃
—
Q
rr
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: T
=25
℃
J
2
VER2.61
AGM40P30AP
Typical Characteristics
-VDS,- Drain -Source Voltage (V)
Fig1.
Typical Output Characteristics
Tj – Junction
T
e
mperature (°C)
Fig2.
–
V
GS(TH)
Gate -Source Voltage Vs.Tj
-VGS, -Gate -Source Voltage (V)
Fig3.
Typical Transfer Characteristics
Tj – Junction
T
e
mperature (°C)
Fig4.
Normalized On-Resistance Vs. Tj
-VSD, -Source-Drain Voltage (V)
Fig5.
Typical Source-Drain Diode Forward Voltage
-VDS, -Drain -Source Voltage (V)
Fig6.
Maximum Safe Operating Area
3
VER2.61
AGM40P30AP
Typical Characteristics
-VDS , -Drain-Source Voltage (V)
Fig7.
Typical Capacitance Vs.Drain-Source Voltage
Qg –
T
o
tal Gate Charge (nC)
Fig8.
Typical Gate Charge Vs.Gate-Source Voltage
Pulse Width (s)
Fig9.
Normalized Maximum Transient Thermal Impedance
Fig10.
Unclamped Inductive Test Circuit and Waveforms
Fig11.
Switching Time Test Circuit and waveforms
4
VER2.61
AGM40P30AP
●Dimensions
（
PDFN
3
.
3
×
3
.
3
）
MILLIMETER
Typ.
b
SYMBOL
D
MIN
MAX
A
A1
A2
D
0.700
0.800
0.900
0.152 REF.
0~0.05
3.100
D1
3.000
2.300
2.900
3.150
1.320
0.200
0.550
0.300
0.180
3.200
2.600
3.100
3.450
1.720
0.400
0.750
0.500
0.480
D1
E
2.450
3.000
E1
E2
b
3.300
1.520
0.300
e
0.650
L
0.400
L1
L2
L3
H
0.330
L3
L2
0~0.100
0~0.100
0.415
e
0.315
0.515
©
ꢀe
ꢁꢂe
ꢁꢃe
©
5
VER2.61
AGM40P30AP
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequences.Do not consider the use of
such information or use beyond its
scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the third version issued on May 20th, 2023. This document
replaces all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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VER2.61
