AGM-Semi-AGM40P30D

Part #AGM-Semi-AGM40P30D
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AGM-Semi-AGM40P30D
AGM40P30D  
●
General Description  
Product Summary  
The AGM40P30D combines advanced trench MOSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

BVDSS  
RDSON  
ID  
This device is ideal  
applications.  
and battery protection  
for load switch  
-40V  
25mΩ  
-30A  
TO-252 Pin Configuration  
●
Features  
■
Advance high cell density Trenc
h
t
echnology  
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
■
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—-  
—-  
AGM40P30D  
AGM40P30D  
TO-252  
2500  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
V
V
VDS  
VGS  
-40  
±20  
-30  
-21  
-99  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
w
w
59  
23  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
(Note 3)  
EAS  
T ,T  
mJ  
℃
260  
Avalanche energy  
Operating Junction and Storage Temperature Range  
J
STG  
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
—  
1
60  
R
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
—  
1
2.1  
θJC  
Thermal Resistance Junction-Case  
1
VER2.5  

AGM40P30D  
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=-250μA  
—  
—  
—  
—  
-1  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
-40  
—  
V
DSS  
DSS  
=-40V,V =0V  
GS  
μA  
nA  
I
=±20V,V =0V  
DS  
—  
±100  
I
GSS  
V
g
V
V
V
V
=V ,I
 
=-250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
-1.2  
—  
-1.6  
-2.5  
—  
V
S
=5V,I =-10A  
Forward Transconductance  
DS  
GS  
GS  
D
FS  
10  
=-10V, I
 
=-20A  
D
—  
—  
mΩ  
mΩ  
25  
34  
32  
43  
R
Drain-Source On-State Resistance  
DS(on)  
=-4.5V, I
 
=-15A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
1120  
120  
95  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=-15V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
f=1.0MHz  
—  
—  
Rg  
Gate resistance  
Ω
1.2  
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
13.5  
18  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=-10V,VDS=-25V,  
ID=-10A,RGEN=3.3Ω  
d(off)  
36  
t
f
25  
Q
g
27  
VGS=-10V,  
VDS=-25V, ID=-12A  
Q
gs  
gd  
7.3  
5.6  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
—  
—  
—  
—  
-30  
-1.2  
—  
A
SD  
Forward on Voltage  
VGS=0V,IS=-20A  
V
SD  
V
ns  
—  
—  
t
—  
—  
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Isd=-20A ,  
nc  
dI/dt=100A/µs , TJ=25
℃
 
—  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM40P30D  
Typical Characteristics  
-VDS,- Drain -Source Voltage (V)  
Fig1.
Typical Output Characteristics  
Tj – Junction
T
e
mperature (°C)  
Fig2.
–
V

GS(TH)

Gate -Source Voltage Vs.Tj  
-VGS, -Gate -Source Voltage (V)  
Fig3.
Typical Transfer Characteristics  
Tj – Junction
T
e
mperature (°C)  
Fig4.
Normalized On-Resistance Vs. Tj  
-VSD, -Source-Drain Voltage (V)  
Fig5.
Typical Source-Drain Diode Forward Voltage  
-VDS, -Drain -Source Voltage (V)  
Fig6.
Maximum Safe Operating Area  
3
VER2.5  

AGM40P30D  
Typical Characteristics  
-VDS , -Drain-Source Voltage (V)  
Fig7.
Typical Capacitance Vs.Drain-Source Voltage  
Qg –
T
o
tal Gate Charge (nC)  
Fig8.
Typical Gate Charge Vs.Gate-Source Voltage  
Pulse Width (s)  
Fig9.
Normalized Maximum Transient Thermal Impedance  
Fig10.
Unclamped Inductive Test Circuit and Waveforms  
Fig11.
Switching Time Test Circuit and waveforms  
4
VER2.5  

AGM40P30D  
●
Dimensions  
SYMBOL  
min  
max  
2.50  
0.80  
0.70  
6.75  
6.30  
10.60  
1.75  
0.23  
SYMBOL  
min  
0.85  
0.50  
0.45  
5.10  
2.25  
4.45  
0.60  
max  
1.25  
0.90  
0.70  
5.50  
2.35  
4.75  
1.10  
A
b
2.10  
0.50  
0.45  
6.30  
5.30  
9.20  
0.90  
0.00  
B
b1  
C
b2  
D
D1  
e1  
e2  
L3  
E
L1  
L2  
K
5
VER2.5  

AGM40P30D  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequencesDo not consider the use of such  
information or use beyond its
 
scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
6
VER2.5