AGM-Semi-AGM40P35A

Part #AGM-Semi-AGM40P35A
Download 
AGM-Semi-AGM40P35A
AGM40P35A  
●
General Description  
Product Summary  
The AGM40P35A combines advanced trench MOSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

BVDSS  
RDSON  
ID  
This device is ideal  
and battery  
for load switch  
-40V  
11mΩ  
-60A  
protection applications.  
PDFN5*6 Pin Configuration  
●
Features  
■
Advance high cell density Trenc
h
t
echnology  
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
■
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—-  
—-  
AGM40P35A  
AGM40P35A  
PDFN5*6  
3000  
Tabl
e
1
.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
V
V
VDS  
VGS  
-40  
±20  
-60  
—  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
-160  
w
w
30  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
12  
—  
(Note 3)  
EAS  
T ,T  
mJ  
℃
Avalanche energy  
Operating Junction and Storage Temperature Range  
J
STG  
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
—  
1
—  
R
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
—  
1
4.17  
θJC  
Thermal Resistance Junction-Case  
1
VER2.5  

AGM40P35A  
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=-250μA  
—  
—  
—  
—  
-1  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
-40  
—  
V
DSS  
DSS  
=-40V,V =0V  
GS  
μA  
nA  
I
=±20V,V =0V  
DS  
—  
±100  
I
GSS  
V
g
V
V
V
V
=V ,I
 
=-250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
-1.5  
—  
-1.7  
-2.5  
—  
V
S
=5V,I =-12A  
Forward Transconductance  
DS  
GS  
GS  
D
FS  
26  
11  
=-10V, I
 
=-12A  
D
15  
24  
—  
—  
mΩ  
mΩ  
R
Drain-Source On-State Resistance  
DS(on)  
=-4.5V, I
 
=-12A  
D
17.5  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
2660  
360  
248  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=-20V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
f=1.0MHz  
Rg  
Gate resistance  
—  
—  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
10  
18  
38  
24  
72  
14  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=-10V,VDS=-20V,  
ID=-12A,RGEN=3Ω  
d(off)  
t
f
Q
g
VGS=-10V,  
VDS=-20V, ID=-12A  
Q
gs  
gd  
Q
15  
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
—  
—  
—  
—  
-60  
-1.2  
—  
A
SD  
Forward on Voltage  
VGS=0V,IS=-12A  
V
SD  
V
ns  
—  
—  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Isd=-12A ,  
40  
42  
nc  
dI/dt=100A/µs , TJ=25
℃  
—  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM40P35A  
Test Circuit  
1) E

AS

Test Circuit  
2) Gate Charge Test Circuit  
3) Switch Time Test Circuit  
3
VER2.5  

AGM40P35A  
Typical Electrical and Thermal Characteristics (Curves)  
Vds Drain-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 1 Output Characteristics  
Figure 4 Rdson-Junction Temperature  
Vgs Gate-Source Voltage (V)  
Qg Gate Charge (nC)  
Figure 2 Transfer Characteristics  
Figure 5 Gate Charge  
I

D

– Drain Current (A)  
Vsd Source-Drain Voltage (V)  
Figure 3 Rdson-
Drain Current  
Figure 6 Source- Drain Diode Forward  
4
VER2.5  

AGM40P35A  
Vds Drain-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 7 Capacitance vs Vds  
Figure 9 BV

DSS

vs Junction Temperature  
Vds Drain-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 10 ID Current Derating vs Junction  
Temperature  
Figure 8 Safe Operation Area  
Square Wave Pluse Duration(sec)  
Figure 11 Normalized Maximum Transient Thermal Impedance  
5
VER2.5  

AGM40P35A  
MILLIMETER  
Typ.  
YMBOL  
MIN  
MAX  
A
A1  
A2  
D
0.900  
1.000  
1.100  
0.254 REF.  
0~0.05  
4.900  
4.824  
3.910  
4.924  
5.924  
3.375  
5.674  
0.350  
4.976  
4.110  
5.076  
6.076  
3.575  
5.826  
0.450  
4.010  
D1  
D2  
E
5.000  
6.000  
3.475  
E1  
E2  
b
5.750  
0.400  
1.270 TYP.  
e
0.534  
0.424  
L
0.610  
0.500  
0.686  
0.576  
L1  
L2  
k
1.800 REF.  
1.190  
0.549  
1.290  
0.625  
10˚  
1.390  
0.701  
1²˚  
H
8˚  
1.100  
1.200  
1.300  
0.100  
d
6
VER2.5  

AGM40P35A  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on May 10, 2022. This document  
replaces and Replace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.5