AGM-Semi-AGM40P65E

Part #AGM-Semi-AGM40P65E
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AGM-Semi-AGM40P65E
AGM40P65E  
●
General Description  
Product Summary  
The AGM40P65E combines advanced trench  
MOSFET technology with a low resistance package  
to provide extremely low R

DS(ON)  

.
device is ideal  
This  
for load switch and battery  
BVDSS  
RDSON  
ID  
protection applications.  
-40V  
70mΩ  
-5A  
●
Features  
■
Advance high cell density Trench technology  
SOT-23-3 Pin Configuration  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
8mm  
178mm  
40P65E  
AGM40P65E  
SOT-23-3  
3000  
Table 1.  
Absolute Maximum Ratings (TA=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Gate-Source Voltage (VDS=0V)  
Value  
Unit  
VDS  
VGS  
V
V
-40  
±20  
-3.3  
-2.0  
-13  
(Note 1)  
Drain Current-Continuous(TA=25
℃
)  
A
A
A
I
D
A
Drain Current-Continuous(T
 
=70
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
w
1.4  
Maximum Power Dissipation(TA=25
℃
)  
P
D
T ,T  
J
STG  
Thermal Characteristic  
Symbol  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Table 2.  
Typ  
Max  
Unit  
Parameter  
1
—  
R
θJA  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
89  
1
VER2.6  

AGM40P65E  
Table 3.  
Symbol  
Electrical Characteristics (TA=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
On/Off States  
BV  
DSS  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
-40  
—  
V
=-40V,V =0V  
GS  
-1  
μA  
nA  
I
I
DSS  
=±20V,V =0V  
DS  
—  
±
GSS  
100  
V
V
V
V
V
=V ,I
 
=-250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
-1.1  
-1.6  
-5  
-2.3  
—  
V
S
g
FS  
=-5V,I =-3.1A  
D
Forward Transconductance  
DS  
GS  
GS  
—  
—  
—  
=-10V, I
 
=-3A  
D
m
Ω
Ω
70  
95  
85  
R
Drain-Source On-State Resistance  
DS(on)  
=-4.5V, I
 
=-2A  
D
m
120  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
600  
90  
C
C
C
Input Capacitance  
pF  
iss  
VDS=-20V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
pF  
pF  
Reverse Transfer Capacitance  
70  
=0V,  
=0V,f=1.0MHz  
Rg  
Gate resistance  
VGS  
VDS  
—  
—  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
9
8
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=-10V,VDS=-20V,  
RGEN=3Ω,ID=-3A  
d(off)  
25  
9
t
f
Q
Q
g
14  
2.9  
3.8  
VGS=-10V,  
VDS=-20V, ID=-3A  
gs  
gd  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
—  
—  
—  
—  
I
-5.0  
-1.2  
A
SD  
Forward on Voltage  
VGS=0V,IS=-3A  
V
SD  
V
ns  
t
—  
—  
—  
—  
—  
—  
Reverse Recovery Time  
Reverse Recovery Charge  
IF=-3A , dI/dt=100A/µs ,  
rr  
nc  
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃
 
J
2
VER2.6  

AGM40P65E  
3
VER2.6  

AGM40P65E  
4
VER2.6  

AGM40P65E  
5
VER2.6  

AGM40P65E  
SOT-23-3L  
PACKAGE OUTLINE DIMENSIONS  
c
D
L1 L  
e1  
A1  
e
b
C
O
MM
O
N DIMENSI
O
NS  
CUNI
T
S MEASURE=MILLIME
T
ER  
SYMB
O
L  
MIN  
N
O
M  
MAX  
A
A1  
A
2  
b
1.050  
0.000  
1.050  
—— 1.
3
00  
—— 0.
2
00  
—— 1.
2
00  
0.
3
00 0.400 0.500  
—— 0.
2
00  
2
.900
3
.0
20  
c
0.100  
D
E
2
.
820  
1.500 1.
6
00 1.700  
E1  
e
2
.
6
50  
2
.
8
00  
0.950
T
YP  
2
.950  
2
.000  
e1  
L
1.
8
00 1.900  
0.
6
REf  
L1  
0.
3
00 0.450 0.
6
00  
0°
— 8
°  
Unit:mm  
6
VER2.6  

AGM40P65E  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on March 10, 2023. This document  
replaces andReplace all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.6