AGM-Semi-AGM418M

Part #AGM-Semi-AGM418M
Download 
AGM-Semi-AGM418M
AGM418M  
● General Description  
The AGM418M combines advanced trench  
MOSFET technology with a low resistance  
Product Summary  
to provide extremely low R

DS(ON)  

.
package  
BVDSS  
RDSON  
18mΩ  
ID  
This device is  
ideal for load switch and battery  
40V  
8A  
protection applications.  
● Features  
■
Advance high cell density Trench technology  
R

DS(ON)

to minimize conductive loss  
Low  
SOP8 Pin Configuration  
■
■
■
■
■
Low Gate Charge for fast switching  
Low Thermal resistance  
100
%
Avalanche tested  
100% DVDS tested  
2
D
2
D
D1  
D1  
●
Application  
■
■
■
■
MB/VGA Vcore  
SMPS 2

nd

Synchronous Rectifier  
S1 G1
 
S2 G2  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
SOP8  
330mm  
12mm  
3000  
AGM418M  
AGM418M  
Table 1.
 
Absolute Maximum Ratings (T
A
=25  
)
℃
Symbol  
Parameter  
Rating  
Units  
V
V
A
A
Drain-Source Voltage (
V

GS=

0V
)
 
V

DS  

V

GS  

40  
±20  
8.0  
4.8  
32  
Gate-Source Voltage (
V

DS=

0V)  
(Note 1)  
Drain Current-Continuous(T
a
=25
℃
)  
I

D  

Drain Current-Continuous(Ta=100
℃
)  
Drain Current-Continuous@ Current-Pulsed

(Note 2)  

A
IDM (pluse)  
Total Power Dissipation(T
a
=25
℃
)  
W
W
2.5  
1.0  
P

D  

Total Power Dissipation(Ta=100
℃
)  
(Note 3)  
Avalanche energy  
mJ  
EAS  
99  
Operating Junction and Storage Temperature Range  
℃
TJ,TSTG  
-55 To 150  
Table 2.
 
Thermal Characteristic  
Symbol  
Parameter  
Typ  
Max  
50  
Unit  
Thermal Resistance Junction-ambient (Steady State)

1  

℃
/W  
R

θJA  

—  
1
VER2.6  

AGM418M  
Table 3. N- Channel Electrical Characteristics (T
J
=25
℃
unless otherwisenoted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
On/Off States  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
40  
—  
V
DSS  
=40V,V =0V  
GS  
μA  
nA  
I
DSS  
=±20V,V =0V  
DS  
—  
±
100  
I
GSS  
V
g
V
V
V
V
=V ,I
 
=250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
1.2  
—  
1.6  
10  
2.5  
—  
V
S
=5V,I =5A  
Forward Transconductance  
DS  
GS  
GS  
D
FS  
=10V, I
 
=10A  
D
—  
—  
mΩ  
mΩ  
18  
21  
24  
35  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=5A  
D
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
C
C
C
Input Capacitance  
660  
92  
pF  
pF  
pF  
iss  
Output Capacitance  
oss  
rss  
VDS=20V,VGS=0V,  
F=1MHZ  
Reverse Transfer Capacitance  
33  
=0V,  
=0V,f=1.0MHz  
Rg  
Gate resistance  
VGS  
VDS  
—  
1.7  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
4.5  
2.5  
14  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=15V,  
RL=2.5
Ω
,RGEN=3
Ω  
d(off)  
3.5  
t
f
Q
Q
g
8.9  
2.4  
1.4  
VGS=10V, VDS=20V,  
ID=6A  
gs  
gd  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
Forward on Voltage  
—  
—  
—  
—  
I
8.0  
1.2  
A
V
SD  
VGS=0V,IS=10A  
V
SD  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃
 
J
2
VER2.6  

AGM418M  
N- Channel Typical Electrical and Thermal Characteristics (Curves)  
Vdd  
Rl  
t

on  

t
t
t
t
t
)
f)  
Vin  
9
90%  
9
90%  
D
Vout  
Vgs  
V

O  

U
T
T  
IN
V
V
E
E
R
R
T
T
E
E
D
D  
Rgen  
1
10%  
G
10%  
50%  
9
90%  
S
V
5
50%  
1
10%  
PU
L
L
S
S
E
E
W
W
I
I
D
D
T
T
H
H  
Figure 1:Switching Test Circuit  
Figure 2:Switching Waveforms  
Vds Drain-Source Voltage (V)  
Vgs Gate-Source Voltage (V)  
Figure 3 Output Characteristics  
Figure 4 Transfer Characteristics  
I

D

– Drain Current (A)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 5 Drain-Source On-Resistance  
Figure 6 Drain-Source On-Resistance  
3
VER2.6  

AGM418M  
Vgs Gate-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 8 Power Dissipation  
Figure7 Rdson vs Vgs  
Qg Gate Charge (nC)  
Vds Drain-Source Voltage (V)  
Figure 9 Gate Charge  
Figure 10 Source- Drain Diode Forward  
Vds Drain-Source Voltage (V)  
Vds Drain-Source Voltage (V)  
Figure 11 Capacitance vs Vds  
Figure 12 Safe Operation Area  
4
VER2.6  

AGM418M  
Square Wave Pluse Duration(sec)  
Figure 13 Normalized Maximum Transient Thermal Impedance  
5
VER2.6  

AGM418M  
●
Dimensions(SOP8)  
SYMBOL  
min  
TYP  
max  
SYMBOL  
min  
max  
A
A1  
A2  
A3  
B
4.80  
0.37  
5.00  
0.47  
C
1.30  
0.55  
0.55  
0.05  
0.19  
1.50  
0.75  
0.65  
0.20  
0.23  
C1  
C2  
C3  
C4  
D
1.27  
0.41  
0.20  
1.05  
5.80  
3.80  
6.20  
4.00  
B1  
B2  
5.00  
D1  
0.40  
0.62  
6
VER2.6  

AGM418M  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on August 10th, 2023. This document  
replaces all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.6