AGM-Semi-AGM609C

Part #AGM-Semi-AGM609C
Download 
AGM-Semi-AGM609C
AGM609C  
●
General Description  
Product Summary  
The AGM609C combines advanced trench MOSFET  
to provide  
technology with a low resistance package  
extremely low R

DS(ON)  

.
BVDSS  
RDSON  
ID  
device is ideal  
This  
for load switch and battery  
protection applications.  
60V  
6.3mΩ  
80A  
●
Features  
TO-220 Pin Configuration  
■
Advance high cell density Trench technology  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
Low Thermal resistance  
100
%
Avalanche tested  
100% DVDS tested  
■
■
●
Application  
■
MB/VGA Vcore  
nd  
■
■
■
SMPS 2
 
Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
—  
AGM609C  
AGM609C  
TO-220  
—-  
1000  
Table 1.  
Absolute Maximum Ratings (TC=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Gate-Source Voltage (VDS=0V)  
Value  
Unit  
VDS  
VGS  
V
V
60  
±20  
(Note 1)  
Drain Current-Continuous(Tc=25
℃
)  
80  
A
A
A
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
48  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
320  
w
w
62.5  
25  
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
(Note 3)  
EAS  
T ,T  
mJ  
52  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Table 2.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
1
—  
—  
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
60  
1
R
θJC  
Thermal Resistance Junction-Case  
2.0  
1
VER2.6  

AGM609C  
Table 3.  
Symbol  
Electrical Characteristics (TJ=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
On/Off States  
BV  
DSS  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
—  
—  
—  
—  
1
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
D
60  
—  
V
=60V,V =0V  
GS  
μA  
nA  
I
I
DSS  
=±20V,V =0V  
DS  
—  
±
GSS  
100  
V
Gate Threshold Voltage  
V
V
V
V
=V ,I
 
=250μA  
DS GS
 
D  
GS(th)  
1.05  
—  
1.7  
60  
2.1  
—  
V
S
g
FS  
=5V,I =15A  
D
Forward Transconductance  
DS  
GS  
GS  
=10V, I
 
=20A  
D
—  
—  
mΩ  
mΩ  
6.3  
8.0  
8.5  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=15A  
D
12.5  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
2100  
182  
C
C
C
Input Capacitance  
pF  
pF  
pF  
iss  
VDS=30V,VGS=0V,  
F=100MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
129  
=0V,  
VGS  
Rg  
Gate resistance  
—  
3.3  
—  
Ω
=0V,f=1.0MHz  
VDS  
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
7.5  
5.5  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
VGS=10V,VDS=30V,  
RL=1.5
Ω
,RGEN=3
Ω  
d(off)  
29.3  
5.9  
t
f
Q
g
52.1  
7.0  
VGS=10V, VDS=30V,  
ID=30A  
Q
gs  
gd  
Q
15.3  
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
—  
—  
—  
—  
80  
I
A
SD  
Forward on Voltage  
VGS=0V,IS=20A  
V
SD  
1.2  
V
ns  
t
Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
26  
38  
—  
—  
IS=20A , dI/dt=100A/µs ,  
rr  
nc  
TJ=25
℃
 
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.6  

AGM609C  
Fig.1 Gate-Charge
 
Characteristics  
Fig.2 Capacitance
 
Characteristics  
12  
1810  
1610  
10  
VDS=25V  
1410  
8
1210  
1010  
IC=8A  
6
4
2
0
810  
610  
410  
210  
10  
0
5
10  
QG Total Gate Charge  
15  
0
10  
20  
30  
Fig.3 Power Dissipation  
Fig.4 Typical output Characteristics  
1.2  
1
100  
V

GS

=10V  
0.8  
0.6  
0.4  
0.2  
0
V

GS

=4.5V  
50  
0
0
0.5  
1
1.5  
2
0
50  
100  
150  
200  
Drain-Source voltage (V)  
Temperature (

。

C)  
Fig.5 Threshold Voltage V.S Junction Temperature
 
Fig.6 Resistance V.S Drain Current  
2.5  
2
15  
10  
5
1.5  
1
0.5  
0
0
0
10  
20  
30  
-50  
50  
150  
Drain Current(A)  
Junction Temperature  
3
VER2.6  

AGM609C  
Fig.7 On-Resistance VS Gate Source Voltage  
Fig.8 On-Resistance V.S Junction Temperature  
1.6  
14  
12  
10  
8
1.2  
0.8  
0.4  
6
4
2
0
3
5
7
9
-50  
0
50  
100  
150  
V

GS

( V )  
Temperature  
Fig.9 Switching Time Measurement Circuit  
Fig.10 Gate Charge Waveform  
Fig.11 Switching Time Measurement Circuit  
Fig.12 Gate Charge Waveform  
4
VER2.6  

AGM609C  
Test Circuit  
Figure1:Gate Charge Test Circuit & Waveform  
Figure 2: Resistive Switching Test Circuit & Waveforms  
Figure 3:Unclamped Inductive Switching Test Circuit & Waveforms  
5
VER2.6  

AGM609C  
TO-220 PACKAGE INFORMATION  
A
E
A1  
MILLIMETER  
Typ.  
SYMBOL  
MIN  
MAX  
A
A1  
A2  
b
4.370  
1.250  
2.150  
0.700  
1.170  
0.450  
15.100  
8.800  
5.500  
9.700  
7.000  
4.570  
4.700  
1.400  
2.550  
0.950  
1.470  
0.600  
16.100  
9.400  
1.300  
©ꢀ  
2.350  
0.800  
1.270  
b1  
c
©ꢂ  
0.500  
E3  
D
15.600  
9.100  
A2  
D1  
D2  
E
6.300 REF  
10.000  
7.600 REF  
2.540 BSC  
5.080 BSC  
13.500  
3.100  
b1  
b
10.300  
E3  
e
e1  
L
13.200  
13.800  
3.400  
6.750  
3.800  
3.000  
e
c
L1  
H
e1  
6.250  
3.400  
2.600  
6.500  
(Bottom View)  
(Top View)  
Q
3.600  
2.800  
ꢃe7<3  
ꢃe7<3  
ꢂe7<3  
©ꢀ  
©ꢁ  
©ꢂ  
6
VER2.6  

AGM609C  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the second version issued on June 20th, 2023. This document  
replaces all
 
previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.6