AGM-Semi-AGM609MNA

Part #AGM-Semi-AGM609MNA
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AGM-Semi-AGM609MNA
AGM609MNA  
●
General Description  
Product Summary  
The AGM609MNA
 
combines advanced trench  
MOSFET technology with a low resistance package  
to provide  
extremely low R

DS(ON)  

.
This device is ideal  
switch and battery  
BVDSS  
RDSON  
ID  
for load  
protection applications.  
60V  
6.5mΩ  
70A  
●
Features  
■
Advance high cell density Trench technology  
PDFN5*6 Pin Configuration  
■
■
Low R

DS(ON)

to minimize conductive loss  
Low Gate Charge for fast switching  
■
■
■
Low Thermal resistance  
100
%
Avalanche tested  
100% DVDS tested  
D2  
D2  
D1  
D1  
●
Application  
G2  
S2  
G1  
■
Electronic Ballast  
S1  
■
Electronic Transformer  
■
Switch Mode Power Supply  
Package Marking and Ordering Information  
Quantity  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
12mm  
AGM609MNA  
AGM609MNA  
PDFN5*6  
330mm  
3000  
Tabl
e
1
.  
Absolute Maximum Ratings (Tc=25  
)
℃
Symbol  
Parameter  
Drain-Source Voltage (VGS=0V
)
 
Value  
Unit  
VDS  
VGS  
V
V
60  
±20  
70  
Gate-Source Voltage (VDS=0V)  
(Note 1)  
A
A
A
Drain Current-Continuous(Tc=25
℃
)  
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
40  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
280  
54  
w
w
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
22  
(Note 3)  
EAS  
T ,T  
mJ  
28  
Avalanche energy  
J
STG  
Operating Junction and Storage Temperature Range  
℃
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
1
—  
—  
50  
R
θJA  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient (Steady State)  
1
R
2.3  
θJC  
Thermal Resistance Junction-Case  
1
VER2.5  

AGM609MNA  
Tabl
e
3
.  
Symbol  
On/Off States  
Electrical Characteristics (TJ=25
 
unless otherwise noted)  
℃
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BV  
V
GS  
V
DS  
V
GS  
=0V I
 
=250μA  
D
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
DSS  
DSS  
60  
—  
—  
—  
—  
1
V
=60V,V =0V  
GS  
μA  
I
I
=±20V,V =0V  
DS  
—  
—  
nA  
±
GSS  
100  
V
V
V
V
V
=V ,I
 
=250μA  
Gate Threshold Voltage  
DS GS
 
D  
GS(th)  
1.2  
—  
1.6  
5
2.1  
—  
V
S
g
FS  
=5V,I =15A  
D
Forward Transconductance  
DS  
GS  
GS  
=10V, I
 
=20A  
D
—  
—  
mΩ  
mΩ  
6.5  
9.5  
9.0  
R
Drain-Source On-State Resistance  
DS(on)  
=4.5V, I
 
=15A  
D
12.5  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
C
C
C
Input Capacitance  
iss  
pF  
pF  
pF  
1456  
424  
14  
VDS=30V,VGS=0V,  
F=1MHZ  
Output Capacitance  
oss  
rss  
Reverse Transfer Capacitance  
Rg  
Gate resistance  
VGS=0V,  
—  
1.3  
—  
Ω
Switching Times  
Turn-on Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
nS  
nS  
nS  
nS  
nC  
nC  
nC  
d(on)  
VDD=30V,  
RD = 5Ω,  
RG = 10Ω  
VGS=10V  
15  
20  
t
t
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
r
d(off)  
37  
t
f
7
Q
g
26.9  
7.2  
3.5  
VGS=10V, VDD=30V,  
ID=20A  
Q
gs  
gd  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
—  
—  
—  
—  
I
70  
A
SD  
Forward on Voltage  
VGS=0V,ISD=10A  
V
SD  
1.2  
V
ns  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
—  
—  
—  
—  
VDD=30V,IF=10A ,  
nc  
dI/dt=100A/µs , TJ=25
℃
 
Q
rr  
Notes 1.The maximum current rating is package limited.  
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature  
Notes 3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM609MNA  
100  
80  
60  
40  
20  
0
14  
12  
10  
8
V

DS

=5V  
10V 8V  
6V  
V

GS

=4V  
6
4
T

j

=125
℃
 
2
V

GS

=3V  
T

j

=25
℃  
0
0
1
2
3
4
5
0
1
2
3
4
VDS (V)  
VGS (V)  
Fig1. Typical Output Characteristics  
Fig2. Typical Transfer Characteristics  
18  
15  
10  
V

Gs

=10V  
12  
9
V

Gs

=4.5V  
1
6
3
T

j

=25
℃
 
T

j

=125
℃  
0
0.1  
0.0  
0
25  
50  
75  
100  
125  
150  
175  
200  
0.4  
0.8  
1.2  
1.6  
Tj-Iunction Temperature (
℃
)  
VSD (V)  
Fig3. Normalized On-Resistance Vs. Temperature  
Fig4. Typical Source-Drain Diode Forward Voltage  
10000  
10  
V

DS

=30V  
I

D

=20A  
C

iss  

8
1000  
C

oss  

6
4
2
0
100  
C

rss  

10  
1
0
10  
20  
30  
40  
0
10  
20  
30  
40  
50  
60  
Qg (nC)  
VDS (V)  
Fig5. Typical.Capacitance  
Fig6. Typical.Gate Charge  
3
VER2.5  

AGM609MNA  
Fig7. Safe Operating Area  
Fig8. Max. transient thermal impedance  
4
VER2.5  

AGM609MNA  
MILLIMETER  
●Dimensions
(
PDFN
5*6
)  
SYMBOL  
MIN  
Typ.  
1.000  
MAX  
A
A1  
A2  
D
0.900  
1.100  
0.254 REF.  
0~0.05  
4.900  
D3  
D
4.824  
1.605  
0.500  
4.924  
5.924  
3.375  
5.674  
0.350  
4.976  
1.805  
0.700  
5.076  
6.076  
3.575  
5.826  
0.450  
D1  
D2  
D3  
E
1.705  
0.600  
5.000  
6.000  
D1  
D2  
E1  
E2  
b
3.475  
5.750  
0.400  
e
1.270 TYP.  
0.610  
L
0.534  
0.424  
0.686  
0.576  
L1  
L2  
k
0.500  
1.800 REF.  
1.290  
b
1.190  
0.549  
ꢀe  
1.390  
0.701  
ꢁꢂe  
e
H
0.625  
©
d
ꢁꢃe  
1.100  
1.200  
1.300  
0.100  
Millimeters  
Symbols  
NOM.  
1.05  
0.40  
MIN.  
0.90  
0.35  
0.20  
4.90  
MAX.  
1.20  
0.50  
0.35  
5.20  
6
8
7
6
5
5
7
8
A
b
C
H
L2  
P
0.25  
5.05  
D1  
D2  
D
D1/D2  
1.51 1.61 1.71  
0.50 0.60 0.70  
1.200  
E2  
d
E
E
E
1  
6.15  
5.75  
O
6.00  
5.60  
6.30  
5.90  
E1  
E2  
e
3.47 3.57 3.67  
1.27 BSC.  
d
K
N
0.48 0.58 0.68  
1.17 1.27 1.37  
H
K
0.64  
8°  
0
0.84  
L
0.74  
1
3
4
2
4
2
3
1
L
L1  
0.20 REF.  
L1/L2  
e
b
10° 12°  
0.08 REF.  
θ
M
N
O
P
0.15  
–
θ
M
0.25 REF.  
1.28 REF.  
A
C
D
5
VER2.5  

AGM609MNA  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of  
such information or use beyond its
 
scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the first version issued on July 20th, 2023. This document  
replaces all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
6
VER2.5