AGM-Semi-AGM60P85AP

Part #AGM-Semi-AGM60P85AP
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AGM-Semi-AGM60P85AP
AGM60P85AP  
● General Description  
Product Summary  
The AGM60P85AP combines advanced trench  
MOSFET technology with a low resistance  
to provide extremely low R

DS(ON)  

.
BVDSS  
RDSON  
ID  
package  
This device is  
ideal for load switch and battery  
-60V  
80
mΩ  
-14A  
protection applications.  
PDFN3.3*3.3 Pin Configuration  
● Features  
■
Advance high cell density Trench technology  
R

DS(ON)

to minimize conductive loss  
■
■
■
■
■
Low  
Low Gate Charge for fast switching  
Low Thermal resistance  
100
%
Avalanche tested  
100% DVDS tested  
●
Application  
■
■
■
■
MB/VGA Vcore  
SMPS 2

nd

Synchronous Rectifier  
POL application  
BLDC Motor driver  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
AGM60P85AP  
AGM60P85AP  
PDFN3.3*3.3  
330mm  
12mm  
5000  
Tabl
e
1
.  
Absolute Maximum Ratings (Tc=25  
)
℃
Symbol  
Parameter  
Value  
-60  
Unit  
VDS  
VGS  
Drain-Source Voltage (VGS=0V
)
 
V
V
Gate-Source Voltage (VDS=0V)  
±20  
-14  
-10  
-56  
34  
(Note 1)  
Drain Current-Continuous(Tc=25
℃
)  
A
A
A
I
D
c
Drain Current-Continuous(T
 
=100
℃
)  
(Note 2)  
I
Drain Current-Continuous@ Current-Pulsed  
DM (pluse)  
w
w
Maximum Power Dissipation(Tc=25
℃
)  
Maximum Power Dissipation(Tc=100
℃
)  
P
D
14  
(Note 3)  
EAS  
Avalanche energy  
16  
mJ  
℃
T ,T  
J
STG  
Operating Junction and Storage Temperature Range  
-55 To 150  
Tabl
e
2
.  
Thermal Characteristic  
Symbol  
Typ  
Max  
Unit  
Parameter  
1
R
θJA  
℃
/W  
℃
/W  
—  
—  
50  
Thermal Resistance Junction-ambient (Steady State)  
1
R
θJC  
Thermal Resistance Junction-Case  
3.7  
1
VER2.5  

AGM60P85AP  
Table 2. P-Channel Electrical Characteristics (TJ=25
℃
unless otherwisenoted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
On/Off States  
BV  
I
V
GS  
V
DS  
V
GS  
=0V I
 
=-250μA  
D
—  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
-60  
DSS  
-72  
—  
V
μA  
nA  
=-60V,V =0V  
GS  
-1  
—  
DSS  
=±20V,V =0V  
DS  
±100  
I
—  
—  
GSS  
V
g
Gate Threshold Voltage  
V
V
V
V
=V ,I
 
=-250μA  
GS(th)  
DS GS
 
D  
-1.2  
—  
-2.1  
—  
-1.6  
16  
V
S
=-5V,I =-8A  
Forward Transconductance  
FS  
DS  
GS  
GS  
D
=-10V, I
 
=-10A  
D
97  
—  
—  
80  
mΩ  
mΩ  
R
Drain-Source On-State Resistance  
DS(on)  
=-4.5V, I
 
=-8A  
D
126  
97  
Dynamic Characteristics  
—  
—  
—  
—  
—  
—  
C
C
C
Input Capacitance  
Output Capacitance  
iss  
1450  
48  
pF  
pF  
pF  
VDS=-25V,VGS=0V,  
F=1MHZ  
oss  
Reverse Transfer Capacitance  
Gate resistance  
rss  
35  
=0V,  
=0V,f=1.0MHz  
VGS  
VDS  
Rg  
Switching Times  
Turn-on Delay Time  
—  
—  
—  
Ω
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
t
d(on)  
9.7  
5.5  
29  
nS  
nS  
nS  
nS  
nC  
nC  
nC  
t
r
Turn-on Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VGS=-10V,VDS=-30V,  
R

L

=
3Ω,RGEN=3Ω  
t
d(off)  
t
f
6
Q
g
23.7  
2.1  
7.2  
VGS=-10V,  
VDS=-30V, ID=-10A  
Q
gs  
gd  
Q
Source-Drain Diode Characteristics  
Source-Drain Current(Body Diode)  
I
—  
—  
—  
—  
—  
-14  
-1.2  
—  
SD  
A
Forward on Voltage  
VGS=0V,IS=-10A  
V
SD  
—  
V
ns  
34  
37  
t
Reverse Recovery Time  
Reverse Recovery Charge  
IF=-10A , dI/dt=100A/µs ,  
rr  
TJ=25
℃
 
nc  
—  
Q
rr  
Notes 1.The maximum current rating is packag
e
l
imited.  
Notes  
Notes2.RepetitiveRating
:
P
ulsewidthlimitedbymaximumjunctio
n
t
emperature  
3.EAS condition: T
 
=25
℃  
J
2
VER2.5  

AGM60P85AP  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
Figure 3. Power Dissipation  
Figure 4. Drain Current  
Figure 5. BV

DSS

vs Junction Temperature  
Figure 6. R

DS(ON)

vs Junction Temperature  
3
VER2.5  

AGM60P85AP  
Figure 7. Gate Charge Waveforms  
Figure 8. Capacitance  
Figure 9. Body-Diode Characteristics  
Figure 10. Maximum Safe Operating Area  
4
VER2.5  

AGM60P85AP  
1) E

AS

Test Circuits  
2) Gate
 
Charge Test Circuit  
3) Switch
 
Time Test Circuit  
5
VER2.5  

AGM60P85AP  
●Dimensions
(
PDFN
3
.
3
×
3
.
3
)  
MILLIMETER  
Typ.  
b
SYMBOL  
D
MIN  
MAX  
A
A1  
A2  
D
0.700  
0.800  
0.900  
0.152 REF.  
0~0.05  
3.100  
D1  
3.000  
2.300  
2.900  
3.150  
1.320  
0.200  
0.550  
0.300  
0.180  
3.200  
2.600  
3.100  
3.450  
1.720  
0.400  
0.750  
0.500  
0.480  
D1  
E
2.450  
3.000  
E1  
E2  
b
3.300  
1.520  
0.300  
e
0.650  
L
0.400  
L1  
L2  
L3  
H
0.330  
L3  
L2  
0~0.100  
0~0.100  
0.415  
e
0.315  
0.515  
©
ꢀe  
ꢁꢂe  
ꢁꢃe  
©
6
VER2.5  

AGM60P85AP  
Disclaimer:  
The information provided in this document is believed to be accurate and reliable.  
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume  
any responsibility for the following consequences.Do not consider the use of such  
information or use beyond its scope.  
The information mentioned in this document may be changed at any time without  
notice.  
The products and information provided in this document do not infringe patents.  
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility  
for any infringement of any other rights of third parties.The result of using such  
products and information.  
This document is the first version issued on July 20th, 2023. This document  
replaces all previously provided information.  
It is a registered trademark of Shenzhen Core Control Electronics  
Technology Co., Ltd.  
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights  
reserved.  
7
VER2.5