AGM-Semi-AGM60P85AP
| Part # | AGM-Semi-AGM60P85AP |
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AGM60P85AP
● General Description
Product Summary
The AGM60P85AP combines advanced trench
MOSFET technology with a low resistance
to provide extremely low R
DS(ON)
.
BVDSS
RDSON
ID
package
This device is
ideal for load switch and battery
-60V
80
mΩ
-14A
protection applications.
PDFN3.3*3.3 Pin Configuration
● Features
■
Advance high cell density Trench technology
R
DS(ON)
to minimize conductive loss
■
■
■
■
■
Low
Low Gate Charge for fast switching
Low Thermal resistance
100
%
Avalanche tested
100% DVDS tested
●
Application
■
■
■
■
MB/VGA Vcore
SMPS 2
nd
Synchronous Rectifier
POL application
BLDC Motor driver
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
AGM60P85AP
AGM60P85AP
PDFN3.3*3.3
330mm
12mm
5000
Tabl
e
1
.
Absolute Maximum Ratings (Tc=25
)
℃
Symbol
Parameter
Value
-60
Unit
VDS
VGS
Drain-Source Voltage (VGS=0V
)
V
V
Gate-Source Voltage (VDS=0V)
±20
-14
-10
-56
34
(Note 1)
Drain Current-Continuous(Tc=25
℃
)
A
A
A
I
D
c
Drain Current-Continuous(T
=100
℃
)
(Note 2)
I
Drain Current-Continuous@ Current-Pulsed
DM (pluse)
w
w
Maximum Power Dissipation(Tc=25
℃
)
Maximum Power Dissipation(Tc=100
℃
)
P
D
14
(Note 3)
EAS
Avalanche energy
16
mJ
℃
T ,T
J
STG
Operating Junction and Storage Temperature Range
-55 To 150
Tabl
e
2
.
Thermal Characteristic
Symbol
Typ
Max
Unit
Parameter
1
R
θJA
℃
/W
℃
/W
—
—
50
Thermal Resistance Junction-ambient (Steady State)
1
R
θJC
Thermal Resistance Junction-Case
3.7
1
VER2.5
AGM60P85AP
Table 2. P-Channel Electrical Characteristics (TJ=25
℃
unless otherwisenoted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BV
I
V
GS
V
DS
V
GS
=0V I
=-250μA
D
—
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
-60
DSS
-72
—
V
μA
nA
=-60V,V =0V
GS
-1
—
DSS
=±20V,V =0V
DS
±100
I
—
—
GSS
V
g
Gate Threshold Voltage
V
V
V
V
=V ,I
=-250μA
GS(th)
DS GS
D
-1.2
—
-2.1
—
-1.6
16
V
S
=-5V,I =-8A
Forward Transconductance
FS
DS
GS
GS
D
=-10V, I
=-10A
D
97
—
—
80
mΩ
mΩ
R
Drain-Source On-State Resistance
DS(on)
=-4.5V, I
=-8A
D
126
97
Dynamic Characteristics
—
—
—
—
—
—
C
C
C
Input Capacitance
Output Capacitance
iss
1450
48
pF
pF
pF
VDS=-25V,VGS=0V,
F=1MHZ
oss
Reverse Transfer Capacitance
Gate resistance
rss
35
=0V,
=0V,f=1.0MHz
VGS
VDS
Rg
Switching Times
Turn-on Delay Time
—
—
—
Ω
—
—
—
—
—
—
—
—
—
—
—
—
—
—
t
d(on)
9.7
5.5
29
nS
nS
nS
nS
nC
nC
nC
t
r
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VGS=-10V,VDS=-30V,
R
L
=
3Ω,RGEN=3Ω
t
d(off)
t
f
6
Q
g
23.7
2.1
7.2
VGS=-10V,
VDS=-30V, ID=-10A
Q
gs
gd
Q
Source-Drain Diode Characteristics
Source-Drain Current(Body Diode)
I
—
—
—
—
—
-14
-1.2
—
SD
A
Forward on Voltage
VGS=0V,IS=-10A
V
SD
—
V
ns
34
37
t
Reverse Recovery Time
Reverse Recovery Charge
IF=-10A , dI/dt=100A/µs ,
rr
TJ=25
℃
nc
—
Q
rr
Notes 1.The maximum current rating is packag
e
l
imited.
Notes
Notes2.RepetitiveRating
:
P
ulsewidthlimitedbymaximumjunctio
n
t
emperature
3.EAS condition: T
=25
℃
J
2
VER2.5
AGM60P85AP
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
Figure 3. Power Dissipation
Figure 4. Drain Current
Figure 5. BV
DSS
vs Junction Temperature
Figure 6. R
DS(ON)
vs Junction Temperature
3
VER2.5
AGM60P85AP
Figure 7. Gate Charge Waveforms
Figure 8. Capacitance
Figure 9. Body-Diode Characteristics
Figure 10. Maximum Safe Operating Area
4
VER2.5
AGM60P85AP
1) E
AS
Test Circuits
2) Gate
Charge Test Circuit
3) Switch
Time Test Circuit
5
VER2.5
AGM60P85AP
●Dimensions
(
PDFN
3
.
3
×
3
.
3
)
MILLIMETER
Typ.
b
SYMBOL
D
MIN
MAX
A
A1
A2
D
0.700
0.800
0.900
0.152 REF.
0~0.05
3.100
D1
3.000
2.300
2.900
3.150
1.320
0.200
0.550
0.300
0.180
3.200
2.600
3.100
3.450
1.720
0.400
0.750
0.500
0.480
D1
E
2.450
3.000
E1
E2
b
3.300
1.520
0.300
e
0.650
L
0.400
L1
L2
L3
H
0.330
L3
L2
0~0.100
0~0.100
0.415
e
0.315
0.515
©
ꢀe
ꢁꢂe
ꢁꢃe
©
6
VER2.5
AGM60P85AP
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequences.Do not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the first version issued on July 20th, 2023. This document
replaces all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
7
VER2.5
