Alpha—Omega-Semicon-AO6420

Part #Alpha—Omega-Semicon-AO6420
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Alpha—Omega-Semicon-AO6420
AO6420  
60V N-Channel MOSFET  
General Description  
Product Summary  
The AO6420 uses advanced trench technology to  
provide excellent R

DS(ON)

and low gate charge. This  
device is suitable for use as a load switch or in PWM  
applications.  
V

DS

(V) = 60V  
I

D

= 4.2A (V

GS

= 10V)  
R

DS(ON)

< 60m
Ω
(V

GS

= 10V)  
R

DS(ON)

< 75m
Ω
(V

GS

= 4.5V)  
TSOP6  
D
Top View  
Bottom View  
Top View  
D
D
D
D
1
2
6
5
G
3
S
4
G
S
Pin1  
Absolute Maximum Ratings
 
T

A

=25
°
C
u
nless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
V

DS  

60  
V
Gate-Source Voltage  
V

GS  

±20  
4.2  
V
A
T

A

=25
°
C  
T

A

=70
°
C  
Continuous Drain  
Current

A,F  

I

D  

3.4  
Pulsed Drain Current

B  

I

DM  

20  
T

A

=25
°
C  
T

A

=70
°
C  
2.00  
P

D  

W
°C  
Power Dissipation  
1.28  
Junction and Storage Temperature Range  
T

J

, T

STG  

-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
48  
Max  
62.5  
110  
40  
Units  
°
C
/W  
°
C
/W  
°
C
/W  
Maximum Junction-to-Ambient

A  

Maximum Junction-to-Ambient

A  

t
≤
10s  
R

θ
JA  

Steady-State  
Steady-State  
74  
Maximum Junction-to-Lead

C  

R

θ
JL  

35  
Alpha & Omega Semiconductor, Ltd.  

AO6420  
N Channel Electrical Characteristics (T

J

=25
°
C
u
nless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
I

D

=250
µ
A, V

GS

=0V  
BV

DSS  

Drain-Source Breakdown Voltage  
60  
V
V

DS

=60V, V

GS

=0V  
1
5
I

DSS  

Zero Gate Voltage Drain Current  
µ
A  
T

J

=55
°
C  
V

DS

=0V, V

GS

= ±20V  
V

DS

=V

GS

I

D

=250
µ
A  
V

GS

=10V, V

DS

=5V  
I

GSS  

Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
100  
3
nA  
V
V

GS(th)  

I

D(ON)  

1
2.3  
20  
A
V

GS

=10V, I

D

=4.2A  
50  
85  
60  
75  
m
Ω  
R

DS(ON)  

Static Drain-Source On-Resistance  
T

J

=125
°
C  
V

GS

=4.5V, I

D

=3A  
V

DS

=5V, I

D

=4.2A  
I

S

=1A,V

GS

=0V  
60  
m
Ω  
S
g

FS  

V

SD  

I

S  

Forward Transconductance  
Diode Forward Voltage  
13  
0.78  
1
3
V
Maximum Body-Diode Continuous Current  
A
DYNAMIC PARAMETERS  
C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
450  
60  
540  
2
pF  
pF  
pF  
Ω
V

GS

=0V, V

DS

=30V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
25  
V

GS

=0V, V

DS

=0V, f=1MHz  
1.65  
SWITCHING PARAMETERS  
Q

g

(10V) Total
 
Gate Charge  
Q

g

(4.5V) Total
 
Gate Charge  
9.5  
4.3  
1.6  
2.2  
5.1  
2.6  
15.9  
2
11.5  
5.5  
nC  
nC  
nC  
nC  
ns  
V

GS

=10V, V

DS

=30V, I

D

=4.2A  
Q

gs  

Q

gd  

t

D(on)  

t

r  

Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
7
4
V

GS

=10V, V

DS

=30V, R

L

=7
Ω
,  
ns  
R

GEN

=3
Ω  
t

D(off)  

t

f  

20  
3
ns  
ns  
t

rr  

I

F

=4.2A, dI/dt=100A/
µ
s  
I

F

=4.2A, dI/dt=100A/
µ
s  
25.1  
28.7  
35  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Q

rr  

nC  
A: The value of R

θ
JA

is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with T

A

=25
°
C. The  
value in any
 
given application depends on the user’s specific board design. The current rating is based on the t
 
≤
10s thermal resistance rating.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The R

θ
JA

is the sum of the thermal impedence from junction to lead R

θ
JL

and lead to ambient.  
D. The static characteristics in Figures 1 to 6 are obtained using <300
µ
s pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in

2

FR-4 board with 2oz. Copper, in a still air environment with T

A

=25
°
C. The SOA  
curve provides a single pulse rating.  
F.The current rating is based on the t
 
≤
10s thermal resistance rating.  
Rev2: Feb. 2012  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS.
 
AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  

AO6420  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL  
20  
15  
10  
5
15  
10  
5
10.0V  
V

DS

=5V  
5.0V  
4.5V  
125
°
C  
4.0V  
25
°
C  
V

GS

=3.5V  
3
0
0
0
1
2
4
5
2
2.5  
3
3.5  
V

GS

(Volts)  
4
4.5  
5
V

DS

(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
100  
90  
80  
70  
60  
50  
40  
30  
20  
2
VGS=10  
I

D

=4.2A  
1.8  
1.6  
1.4  
1.2  
1
V

GS

=4.5V  
V

GS

=4.5V  
I

D

=3A  
V

GS

=10V  
0.8  
0
5
10  
15  
20  
0
25  
50  
75  
100  
125  
150  
175  
I

D

(A)  
Temperature (
°
C
)  
Figure 4: On-Resistance vs. Junction Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
160  
140  
120  
100  
80  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
I

D

=4.2A  
125
°
C  
125
°
C  
25
°
C  
25
°
C  
60  
40  
0.0  
0.2  
0.4  
V

SD

(Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
2
4
6
8
10  
V

GS

(Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  

AO6420  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL  
10  
8
800  
600  
400  
200  
0
V

DS

=30V  
I

D

= 4.2A  
C

iss  

6
4
C

oss  

2
C

rss  

0
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
60  
Q

g

(nC)  
V

DS

(Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
40  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
30  
20  
10  
0
10
µ
s  
R

DS(ON)  

limited  
100
µ
s  
1ms  
10ms  
0.1s  
1s  
0.1  
DC  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
10s  
100  
0.0  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
Pulse Width (s)  
V

DS

(Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
10  
1
D=T

on

/T  
T

J,PK

=T

A

+P

DM

.Z

θ
JA

.R

θ
JA  

In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R

θ
JA

=110
°
C/W  
P

D  

0.1  
T

on  

T
Single Pulse  
0.01  
0.01  
0.00001  
0.0001  
0.001  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
Alpha & Omega Semiconductor, Ltd.