Alpha—Omega-Semicon-AO7800

Part #Alpha—Omega-Semicon-AO7800
Download 
Alpha—Omega-Semicon-AO7800
AO7800  
Dual N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AO7800 uses advanced trench technology to  
provide excellent R

DS(ON)

, low gate charge and  
operation with gate voltages as low as 1.8V, in the  
small SOT323 footprint. It can be used for a wide  
variety of applications, including load switching, low  
current inverters and low current DC-DC converters.It  
is ESD protected.
Standard Product AO7800 is Pb-  
free (meets ROHS & Sony 259 specifications).  
AO7800L is a Green Product ordering option.  
AO7800 and AO7800L are electrically identical.  
V

DS

(V) = 20V  
I

D

= 0.9 A (V

GS

= 4.5V)  
R

DS(ON)

< 300m
Ω
(V

GS

= 4.5V)  
R

DS(ON)

< 350m
Ω
(V

GS

= 2.5V)  
R

DS(ON)

< 450m
Ω
(V

GS

= 1.8V)  
SC-70-6  
(SOT-323)  
Top View  
D2  
S2  
D1  
S1  
G2  
G1  
1
2
3
6
5
4
S1  
G1  
D2  
D1  
G2  
S2  
Absolute Maximum Ratings
 
T

A

=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
V

DS  

Drain-Source Voltage  
20  
V
V

GS  

Gate-Source Voltage  
Continuous Drain  
Current

A  

±8  
0.9  
V
A
T

A

=25°C  
T

A

=70°C  
I

D  

0.7  
Pulsed Drain Current

B  

I

DM  

5
T

A

=25°C  
T

A

=70°C  
0.3  
P

D  

W
Power Dissipation

A  

0.19  
-55 to 150  
T

J

, T

STG  

Junction and Storage Temperature Range  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient

A  

Maximum Junction-to-Ambient

A  

Maximum Junction-to-Lead

C  

Symbol  
Typ  
360  
400  
300  
Max  
415  
460  
350  
Units  
°C/W  
°C/W  
°C/W  
t
≤
10s  
R

θ
JA  

Steady-State  
Steady-State  
R

θ
JL  

Alpha Omega Semiconductor, Ltd.  

AO7800  
Electrical Characteristics (T

J

=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BV

DSS  

Drain-Source Breakdown Voltage  
I

D

=250
µ
A, V

GS

=0V  
20  
V
V

DS

=16V, V

GS

=0V  
1
5
I

DSS  

Zero Gate Voltage Drain Current  
µ
A  
µ
A  
T

J

=55°C  
I

GSS  

Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
V

DS

=0V, V

GS

=±8V  
25  
0.9  
V

GS(th)  

I

D(ON)  

V

DS

=V

GS

I

D

=250
µ
A  
0.5  
5
0.75  
V
A
V

GS

=4.5V, V

DS

=5V  

GS

=4.5V, I

D

=0.9A  
V
181  
253  
237  
317  
2.6  
300  
350  
350  
450  
m
Ω  
T

J

=125°C  
R

DS(ON)  

Static Drain-Source On-Resistance  
m
Ω  
m
Ω  
V

GS

=2.5V, I

D

=0.75A  
V

GS

=1.8V, I

D

=0.7A  
V

DS

=5V, I

D

=0.8A  
g

FS  

V

SD  

I

S  

Forward Transconductance  
Diode Forward Voltage  
S
V
A
I

S

=0.5A,V

GS

=0V  
0.69  
1
Maximum Body-Diode Continuous Current  
0.4  
DYNAMIC PARAMETERS  
C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
101  
17  
14  
3
120  
pF  
pF  
pF  
Ω
V

GS

=0V, V

DS

=10V, f=1MHz  

GS

=0V, V

DS

=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
V
4
SWITCHING PARAMETERS  
Q

g  

Q

gs  

Q

gd  

t

D(on)  

t

r  

Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
1.57  
0.13  
0.36  
3.2  
1.9  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V

GS

=4.5V, V

DS

=10V, I

D

=0.8A  
V

GS

=5V, V

DS

=10V, R

L

=12.5
Ω
,  
4
R

GEN

=6
Ω  
t

D(off)  

t

f  

15.5  
2.4  
t

rr  

I

F

=0.8A, dI/dt=100A
/
µ
s  
I

F

=0.8A, dI/dt=100A
/
µ
s  
8.1  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
6.7  
1.6  
ns  
nC  
Q

rr  

A: The value of R

θ
JA

is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with
T

A

=25°C. The  
value in any given application depends on the user’s specific board design. The current rating is based on the t
≤
10s thermal resistance rating.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The
R

θ
JA

is the sum of the thermal impedence from junction to lead
R

θ
JL

and lead to ambient.  
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 8
0
µ
s pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in

2

FR-4 board with 2oz. Copper, in a still air environment with
T

A

=25°C. The SOA  
curve provides a single pulse rating.  
Rev 3 : July 2003  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS.
 
AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  

AO7800  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
4
3
2
1
0
10  
10V  
8V  
V

DS

=5V  
5V  
4V  
8
6
4
2
0
25°C  
125°C  
3.5V  
3V  
2.5V  
V

GS

=2V  
0
1
2
3
4
5
0
0.5  
1
1.5  
V

GS

(Volts)  
2
2.5  
3
V

DS

(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
480  
440  
400  
360  
320  
280  
240  
200  
160  
1.8  
1.6  
1.4  
1.2  
1
V

GS

=1.8V  
V

GS

=1.8V  
I
0 7A  
V

GS

=2.5V  
I

D

=0.75A  
V

GS

=4.5V  
I

D

=0.9A  
V

GS

=2.5V  
V

GS

=4.5V  
0.8  
0
1
2

D

(A)  
3
4
0
25  
50  
75  
100  
125  
150  
175  
I
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage  
500  
460  
420  
380  
340  
300  
260  
220  
180  
140  
1E+01  
1E+00  
1E-01  
1E-02  
1E-03  
1E-04  
1E-05  
125°C  
I

D

=0.9A  
125°C  
25°C  
25°C  
1
2
3
4
5
6
7
8
0.0  
0.4  
0.8  
V

SD

(Volts)  
Figure 6: Body-Diode Characteristics  
1.2  
1.6  
2.0  
V

GS

(Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  

AO7800  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
200  
5
4
3
2
1
0
V

DS

=10V  
I

D

=0.9A  
150  
100  
50  
C

iss  

C

oss  

C

rss  

0
0
5
10  

DS

(Volts)  
15  
20  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
V
Q

g

(nC)  
Figure 8: Capacitance Characteristics  
Figure 7: Gate-Charge Characteristics  
10.0  
T

J(Max)

=150°C, T

A

=25°C  
16  
12  
8
T

J(Max)

=150°C  
T

A

=25°C  
10
µ
s  
R

DS(ON)  

limited  
100
µ
s  
10ms  
0.1s  
1ms  
1.0  
0.1  
0.0  
1s  
4
10s  
1
DC  
0
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
10  
100  
Pulse Width (s)  
V

DS

(Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
10  
D=T

on

/T  

J,PK

=T

A

+P

DM

.Z

θ
JA

.R

θ
JA  

R

θ
JA

=415°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
1
0.1  
P

D  

T

on  

T
Single Pulse  
0.001  
0.01  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
Alpha & Omega Semiconductor, Ltd.