Alpha—Omega-Semicon-AON2392

Part #Alpha—Omega-Semicon-AON2392
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Alpha—Omega-Semicon-AON2392
AON2392  
100V N-Channel AlphaSGT

TM  

General Description  
Product Summary  
• Trench Power AlphaSGT

TM

technology  
• Low R

DS(ON)  

• Logic driven  
• RoHS and Halogen-Free Compliant  
V

DS  

100V  
I

D

(at V

GS

=10V)  
R

DS(ON)

(at V

GS

=10V)  
8A  
< 32mΩ  
< 39mΩ  
R

DS(ON)

(at V

GS

=4.5V)  
Applications  
• Home Automation and IoT  
• VOIP applications  
DFN 2x2C  
D
Top View  
Bottom View  
D
S
G
G
Pin 1  
S
Pin 1  
Orderable Part Number  
Package Type  
Form  
Tape & Reel  
Minimum Order Quantity  
AON2392  
DFN2x2C  
3000  
Absolute Maximum Ratings
 
T

A

=25°C unless otherwise noted  
Parameter  
Symbol  
V

DS  

Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
100  
V
V
V

GS  

±20  
T

A

=25°C  
T

A

=70°C  
8
Continuous Drain  
Current  
I

D  

A
6
32  
Pulsed Drain Current

C  

I

DM  

P

D  

T

A

=25°C  
T

A

=70°C  
4.1  
W
Power Dissipation

B  

2.6  
Junction and Storage Temperature Range  
T

J

, T

STG  

-55 to 150  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
25  
Max  
30  
Units  
°C/W  
°C/W  
Maximum Junction-to-Ambient

A  

t ≤
 
10s  
R

θ
JA  

Maximum Junction-to-Ambient

A D  

Steady-State  
45  
55  
Rev.1.0: January 2016  
Page 1 of 5  

AON2392  
Electrical Characteristics (T

J

=25°C unless otherwise noted)  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
I

D

=250
µ
A, V

GS

=0V  
BV

DSS  

Drain-Source Breakdown Voltage  
100  
V
V

DS

=100V, V

GS

=0V  
1
5
I

DSS  

Zero Gate Voltage Drain Current  
µA  
T

J

=55°C  
V

DS

=0V, V

GS

=±20V  
I

GSS  

Gate-Body leakage current  
Gate Threshold Voltage  
±100  
2.4  
32  
nA  
V
V

GS(th)  

V

DS

=V

GS,

I

D

=250
µ
A  
1.4  
1.85  
26  
V

GS

=10V, I

D

=8A  
mΩ  
R

DS(ON)  

Static Drain-Source On-Resistance  
T

J

=125°C  
46  
57  
V

GS

=4.5V, I

D

=6A  
V

DS

=5V, I

D

=8A  
I

S

=1A, V

GS

=0V  
31  
39  
mΩ  
S
g

FS  

V

SD  

I

S  

Forward Transconductance  
Diode Forward Voltage  
25  
0.74  
1
5
V
Maximum Body-Diode Continuous Current  
A
DYNAMIC PARAMETERS  
C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
840  
64  
4
pF  
pF  
pF  
Ω
V

GS

=0V, V

DS

=50V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
f=1MHz  
1.4  
SWITCHING PARAMETERS  
Q

g

(10V)  
Q

g

(4.5V)  
Q

gs  

Total Gate Charge  
12.8  
6.1  
2.1  
1.8  
11  
7
25  
12  
nC  
nC  
nC  
nC  
nC  
ns  
Total Gate Charge  
V

GS

=10V, V

DS

=50V, I

D

=8A  
V

GS

=0V, V

DS

=50V  
Gate Source Charge  
Gate Drain Charge  
Q

gd  

Q

oss  

t

D(on)  

t

r  

Output Charge  
Turn-On DelayTime  
Turn-On Rise Time  
V

GS

=10V, V

DS

=50V, R

L

=5.85
Ω
,  
R

GEN

=3
Ω  
8
ns  
t

D(off)  

t

f  

Turn-Off DelayTime  
24  
3
ns  
Turn-Off Fall Time  
ns  
t

rr  

I

F

=8A, di/dt=500A/
µ
s  
I

F

=8A, di/dt=500A/
µ
s  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
20  
70  
ns  
Q

rr  

nC  
A. The value of R

θ
JA

is measured with the device mounted on 1in

2

FR-4 board with 2oz. Copper, in a still air environment with T

A

=25
°
C. The  
value in any given application depends on the user’s specific board design.  
B. The power dissipation P

D

is based on T

J(MAX)

=150
°
C, using
≤
10s junction-to-ambient thermal resistance.  
C. Repetitive
 
rating, pulse width limited by junction temperature T

J(MAX)

=150
°
C. Ratings are based on low frequency and duty cycles to keep  
initialT

J

=25
°
C.  
D. The R

θ
JA

is the sum of the thermal impedance from junction to lead R

θ
JL

and lead to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300
µ
s pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in

2

FR-4 board with  
2oz. Copper, assuming a maximum junction temperature of T

J(MAX)

=150
°
C. The SOA curve provides a single pulse rating.  
APPLICATIONS OR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT  
ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS.
 
AOS RESERVES THE RIGHT TO IMPROVE  
PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev.1.0: January 2016  
Page 2 of 5  

AON2392  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
35  
35  
30  
25  
20  
15  
10  
5
10V  
4V  
V

DS

=5V  
30  
25  
20  
15  
10  
5
3.5V  
4.5V  
6V  
125
°
C  
3V  
25
°
C  
V

GS

=2.5V  
4
0
0
1
2
3
4
5
0
1
2
3
5
V

GS

(Volts)  
V

DS

(Volts)  
Figure 2: Transfer Characteristics (Note E)  
Figure 1: On-Region Characteristics (Note E)  
50  
40  
30  
20  
10  
2.2  
2
V

GS

=10V  
I

D

=8A  
1.8  
1.6  
1.4  
1.2  
1
V

GS

=4.5V  
V

GS

=10V  
V

GS

=4.5V  
I

D

=6A  
0.8  
0
25  
50  
75  
100  
125  
150  
175  
0
3
6
9
12  
15  
I

D

(A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
80  
60  
40  
20  
0
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
I

D

=8A  
125
°
C  
125
°
C  
25
°
C  
25
°
C  
2
4
6
8
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
V

GS

(Volts)  
V

SD

(Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Figure 6: Body-Diode Characteristics  
(Note E)  
Rev.1.0: January 2016  
Page 3 of 5  

AON2392  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
1000  
V

DS

=50V  
I

D

=8A  
C

iss  

8
800  
600  
400  
200  
0
6
4
2
C

rss  

C

oss  

0
0
5
10  
15  
20  
0
20  
40  
60  
80  
100  
Q

g

(nC)  
V

DS

(Volts)  
Figure 8: Capacitance Characteristics  
Figure 7: Gate-Charge Characteristics  
100.0  
10.0  
1.0  
1000  
100  
10  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
10
µ
s  
R

DS(ON)  

limited  
100
µ
s  
1ms  
10ms  
0.1  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
DC  
0.0  
1
0.01  
0.1  
1
10  
100  
1000  
0.0001 0.001
 
0.01  
0.1  
1
10  
100  
1000  
V

DS

(Volts)  
Pulse Width (s)  
V

GS

> or equal to 4.5V  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
10  
1
D=T

on

/T  
T

J,PK

=T

A

+P

DM

.Z

θ
JA

.R

θ
JA  

In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R

θ
JA

=55
°
C/W  
0.1  
P

DM  

0.01  
0.001  
Single Pulse  
0.001  
T

on  

T
1E-05  
0.0001  
0.01  
Pulse Width (s)  
0.1  
1
10  
100  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev.1.0: January 2016  
Page 4 of 5  

AON2392  
Figure A: Gate Charge Test Circuit & Waveforms  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
–
–
DUT  
Vgs  
Ig  
Charge  
Figure B: Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
–
Vgs  
Vgs  
t

d(on)  

t
r
t

d(off)  

t
f
t

on  

t

off  

Figure C: Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
E

AR

= 1/2 L
I

A

2

R  

BV

DSS  

Vds  
Id  
Vds  
+
Vgs  
Vdd  
I

AR  

Vgs  
VDC  
Id  
Rg  
–
DUT  
Vgs  
Vgs  
Figure D: Diode Recovery Test Circuit & Waveforms  
Q

rr

= –
 
Idt  
Vds +  
Vds –  
Ig  
DUT  
Vgs  
Isd  
t

rr  

L
I

F  

Isd  
Vgs  
dI/dt  
I

RM  

+
Vdd  
VDC  
Vdd  
–
Vds  
Rev.1.0: January 2016  
Page 5 of 5