Ampleon-BLM8G0710S-15PBY
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BLM8G0710S-15PB;
BLM8G0710S-15PBG
LDMOS 2-stage power MMIC
Rev. 5 — 28 September 2018
Product data sheet
1. Product
profile
1.1 General
description
The BLM8G0710S-15PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state
of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general
purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz.
Available in gull wing or straight lead outline.
Table 1.
Performance
Typical RF performance at T
case
= 25
°
C; I
Dq1
= 15 mA; I
Dq2
= 60 mA.
T
e
st signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability on CCDF; per section
unless otherwise specified in a class-AB production circuit.
Test signal
f
V
DS
(V)
28
P
L(AV)
(W)
G
p
η
D
ACPR
5M
(dBc)
41
(MHz)
957.5
(dB)
36
(%)
27
single carrier W-CDMA
1.5
1.2 Features
and benefits
Designed for broadband operation (frequency 700 MHz to 1000 MHz)
High section-to-section isolation enabling multiple combinations
Integrated temperature compensated bias
Biasing of individual stages is externally accessible
Integrated ESD protection
Excellent thermal stability
High power gain
On-chip matching for ease of use
For RoHS compliance see the product details on the Ampleon website
1.3 Applications
RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency
range. Possible circuit topologies are the following as also depicted in
Section 8.1
:
Dual section or single ended
Doherty
Quadrature combined
Push-pull
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
2. Pinning
information
2.1 Pinning
pin 1 index
V
DS(A1)
V
GS(A2)
V
GS(A1)
RF_IN_A
n.c.
1
2
3
4
5
6
7
RF_OUT_ V
DS(A2)
16
n.c.
n.c.
n.c.
n.c.
n.c.
8
9
10
11
12
13
14
RF_IN_B
V
GS(B1)
RF_OUT_ V
DS(B2)
15
V
GS(B2)
V
DS(B1)
amp00601
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1.
Pin configuration
2.2 Pin
description
Table 2.
Symbol
V
DS(A1)
V
GS(A2)
V
GS(A1)
RF_IN_A
n.c.
Pin description
Pin
1
Description
drain-source voltage of stage (A1)
gate-source voltage of stage (A2)
gate-source voltage of stage (A1)
RF input section A
2
3
4
5
not connected
n.c.
6
not connected
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
11
12
13
14
not connected
RF_IN_B
V
GS(B1)
V
GS(B2)
V
DS(B1)
RF input section B
gate-source voltage of stage (B1)
gate-source voltage of stage (B2)
drain-source voltage of stage (B1)
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
2 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Table 2.
Symbol
Pin description
…continued
Pin
Description
RF_OUT_B/V
DS(B2)
RF_OUT_A/V
DS(A2)
GND
15
16
RF output section B / drain-source voltage of stage (B2)
RF output section A / drain-source voltage of stage (A2)
flange RF
ground
3. Ordering
information
Table 3.
Ordering information
Type number
Package
Name Description
plastic, heatsink small outline package;
Version
BLM8G0710S-15PB
–
SOT1211-3
16 leads (flat)
BLM8G0710S-15PBG –
plastic, heatsink small outline package; 16 leads
SOT1212-3
4. Block
diagram
V
DS(A1)
RF_IN_A
RF_OUT_A / V
DS(A2)
V
V
TEMPERATURE
COMPENSATED BIAS
GS(A1)
GS(A2)
V
TEMPERATURE
COMPENSATED BIAS
GS(B1)
V
GS(B2)
RF_IN_B
RF_OUT_B / V
DS(B2)
V
DS(B1)
aaa-009323
Fig 2.
Block diagram
5. Limiting
values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
Parameter
Conditions
Min
Max
65
Unit
V
drain-source voltage
gate-source voltage
storage temperature
junction temperature
case temperature
–
V
GS
0.5 +13
V
T
stg
65
+150
C
[1]
T
j
–
–
225
150
C
C
T
case
[1] Continuous
use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
3 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
6. Thermal
characteristics
Table 5.
Thermal characteristics
Measured for total device.
Symbol Parameter
Conditions
Value Unit
[1]
R
th(j-c)
thermal resistance from junction to case
final stage; T
case
= 90
C; P
L
= 1.26 W
driver stage; T
case
= 90
C; P
L
= 1.26 W
2.41
7.5
K/W
K/W
[1]
[1] When
operated with a CW signal.
7. Characteristics
Table 6.
DC characteristics
T
case
= 25
°
C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Final stage
V
(BR)DSS
drain-source breakdown voltage
V
GS
= 0 V; I
D
= 0.12 mA
65
1.6
1.6
–
–
–
V
V
V
%
V
GSq
gate-source quiescent voltage
V
DS
= 28 V; I
D
= 60 mA
V
DS
= 28 V; I
D
= 60 mA
40
C
T
case
+85
C
2.1
2.6
2
2.5
3.6
–
[1]
[1]
I
Dq
/
T
quiescent drain current variation
with temperature
I
DSS
I
DSX
I
GSS
drain leakage current
drain cut-off current
gate leakage current
V
GS
= 0 V; V
DS
= 28 V
V
GS
= 5.65 V; V
DS
= 10 V
V
GS
= 1 V; V
DS
= 0 V
–
–
–
–
1.4
–
A
A
2.2
–
140
nA
Driver stage
V
(BR)DSS
drain-source breakdown voltage
V
GS
= 0 V; I
D
= 0.03 mA
V
DS
= 28 V; I
D
= 15 mA
V
DS
= 28 V; I
D
= 15 mA
40
C
T
case
+85
C
65
1.6
1.6
–
–
–
V
V
V
%
V
GSq
gate-source quiescent voltage
2.1
2.6
2
2.5
3.5
–
[2]
[2]
I
Dq
/
T
quiescent drain current variation
with temperature
I
DSS
I
GSS
drain leakage current
gate leakage current
V
GS
= 0 V; V
DS
= 28 V
V
GS
= 1 V; V
DS
= 0 V
–
–
–
–
1.4
A
140
nA
[1] In
production circuit with 1.3 k
gate feed resistor.
[2] In
production circuit with 1.2 k
gate feed resistor.
Table 7.
Typical RF performance at f = 957.5 MHz; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA (driver stage); I
Dq2
= 60 mA (final stage);
L(AV)
= 1.5 W. Unless otherwise specified, measured in an Ampleon straight lead production circuit.
RF Characteristics
P
Symbol Parameter
Test signal: single carrier W-CDMA
[1]
Conditions
Min
Typ
Max
Unit
G
p
power gain
f = 730.5 MHz
f = 957.5 MHz
f = 730.5 MHz
f = 957.5 MHz
–
36
36
23
27
–
dB
dB
%
34.5
–
37.5
D
drain efficiency
–
–
22.5
%
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
4 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Table 7.
Typical RF performance at f = 957.5 MHz; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA (driver stage); I
Dq2
= 60 mA (final stage);
L(AV)
= 1.5 W. Unless otherwise specified, measured in an Ampleon straight lead production circuit.
RF Characteristics
…continued
P
Symbol Parameter
RL
in
input return loss
Conditions
Min
Typ
18
16
38.7
41
8.8
Max
Unit
dB
f = 730.5 MHz
f = 957.5 MHz
–
–
–
10
dB
ACPR
5M
adjacent channel power ratio
f = 730.5 MHz
–
–
dBc
dBc
dB
(5 MHz)
f = 957.5 MHz
–
36
PAR
O
output peak-to-average ratio
f = 730.5 MHz
f = 957.5 MHz
–
–
–
7
8.1
dB
Test signal: CW
[2]
s21
s
21
2
phase response difference
between sections
10
–
–
+10
deg
insertion power gain difference
between sections
0.5
+0.5 dB
[1] 3GPP
test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability on CCD
F
.
[2] f
= 957.5 MHz.
8. Application
information
Table 8.
Typical performance
T
e
st signal: 1-tone CW; RF performance at T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA unless otherwise specified,
measured in an Ampleon wideband f = 700 MHz to 1000 MHz class AB application circuit.
Symbol Parameter
P
L(1dB)
output power at 1 dB gain compression
D
Conditions
Min Typ
Max Unit
f = 800 MHz
–
–
–
–
–
–
–
23.3
55
–
–
–
–
–
W
drain efficiency
power gain
at P
L(1dB)
; f = 800 MHz
P
L(AV)
= 4 W; f = 800 MHz
2-tone CW; P
L(AV)
= 10 W; f = 800 MHz
P
L(AV)
= 4 W
%
G
p
35
dB
B
video
G
flat
video bandwidth
gain flatness
190
1
MHz
dB
G/
T
s
12
2
gain variation with temperature
isolation
f = 800 MHz
0.022 –
dB/
C
dB
between sections A and B;
29
–
P
L(AV)
= 4 W; f = 800 MHz
K
Rollett stability factor
T =
40
C; f = 0.1 GHz to 3 GHz
–
3
–
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
5 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
40 mm
10
μ
F
100 pF
1.2 kΩ
1.3 kΩ
10
μ
F
3.9 pF
10
μ
F
10
μ
F
22 pF
40 mm
10
μ
F
10
μ
F
10
μ
F
1.3 kΩ
1.2 kΩ
100 pF
10
μ
F
amp00683
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
Fig 3.
Component layout for class-AB application circuit
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
6 of 22
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BLM8G0710S-15PB
Single ended class AB compact board
schematics 700-1000 MHz v1r0
10 μF
35 V
V
DS
28 V
100 pF
A
T
C600F
ferrite
V
GS
10 μF
50 V
BLM8G0710S-15PB
PathA
V
DS
28 V
V
V
1
2
3
4
DS(A1)
10 μF
35 V
1.3 kꢀ
1.2 kꢀ
GS(A2)
GS(A1)
V
10 μF
35 V
3.9 pF
A
T
C600F
Driver
clamped
RF sense FET
Final
clamped
RF sense FET
RF_IN_A
n.c.
5
6
7
n.c.
16
n.c.
22 pF
ATC600F
RF out
Driver
RF power FET
Final
RF power FET
RF in
100 ꢀ
Driver
RF power FET
Final
RF power FET
n.c.
n.c.
8
9
15
n.c.
10
11
RF_IN_B
Driver
clamped
RF sense FET
Final
clamped
RF sense FET
10 μF
6.3 V
1.2 kꢀ
1.3 kꢀ
V
12
13
14
DS(B2)
V
GS(B2)
10 μF
6.3 V
V
DS(B1)
10 μF
50 V
BLM8G0710S-15PB
PathB
ferrite
100 pF
ATC600F
10 μF
35 V
aaa-018672
Fig 4.
Electrical schematic
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
8.1 Possible
circuit topologies
-3 dB / Φ-0°
In A
Out A
Out
In
-3 dB / Φ-0°
In B
Out B
amp00514
Fig 5.
Dual section or single ended
Splitter
Combiner
In
-3 dB / Φ-0°
λ/4
λ/4
-3 dB / Φ-90°
Out
amp00603
Fig 6.
Doherty
3 dB Coupler
3 dB Coupler
In
-3 dB / Φ-0°
-3 dB / Φ-90°
Out
amp00515
Fig 7.
Quadrature combined
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
8 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Splitter
λ/2
Combiner
In
-3 dB / Φ-0°
λ/2
-3 dB / Φ-180°
Out
amp00516
Fig 8.
Push-pull
8.2 Ruggedness
in class-AB operation
The BLM8G0710S-15PB and BLM8G0710S-15PBG are capable of withstanding a load
mismatch corresponding to VSWR = 10 : 1 through all phases under the following
conditions: V
DS
= 32 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA; P
i
is corresponding to P
L(3dB)
under
Z
S
= 50
load; f = 840 MHz.
8.3 Impedance
information
Table 9.
Typical impedance tuned for maximum output power
Measured load-pull data per section; test signal: pulsed CW; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
t
p
= 100
μ
s;
δ
= 10 %; Z
S
= 50
Ω
. Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
(MHz)
(
Ω
)
(dB)
(dBm) (%)
(deg)
(
Ω
)
(dB)
(dBm) (%)
(deg)
BLM8G0710S-15PB
680
700
720
740
760
780
800
820
840
860
880
900
920
940
960
17.5 + j5.9
14.3 + j5.8
14.3 + j5.7
15.4 + j7.2
15.4 + j7.2
16.1 + j4.6
14.2 + j5.9
14.1 + j5.9
14.1 + j5.9
16.0 + j4.6
18.3 + j3.6
18.2 + j3.6
18.2 + j3.7
18.2 + j3.8
18.3 + j3.8
36.4
36.4
36.3
36.4
35.9
35.2
34.9
34.8
34.8
34.7
34.7
34.9
35
40.9
40.7
40.6
40.7
40.6
40.7
40.6
40.7
40.8
40.8
40.9
40.9
40.9
40.8
40.8
57.9
53.9
53.4
57
11.1
9.9
9
14.2 + j6.0
16.1 + j4.4
16.3 + j4.1
14.2 + j5.9
16.1 + j4.6
16.1 + j4.6
16.0 + j4.5
16.0 + j4.5
16.0 + j4.6
18.3 + j3.7
18.3 + j3.6
18.2 + j3.6
18.2 + j3.7
18.2 + j3.8
16.0 + j4.7
36.1
36.4
36.3
36
41.7
41.6
41.6
41.6
41.6
41.6
41.6
41.7
41.7
41.8
41.8
41.8
41.8
41.8
41.7
58.6
58.6
58.1
58
12.5
10.6
9.5
9.7
9
8.7
8.5
6.9
6.2
5.4
5.2
4.2
3.4
2.9
3
57.2
54.3
53.4
54.4
54.7
54.7
55.4
55.4
54.8
54.7
54
35.6
35.2
34.9
34.7
34.7
34.7
34.7
34.9
35
58.4
58.5
58.3
58.9
58.8
59.8
59.8
59.4
58.9
58.7
58.5
7.6
6.2
5.4
5.3
3.7
3
2.4
2.6
4.1
5.2
35.2
35.2
4.1
4.5
35.2
35.3
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
9 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Table 9.
Typical impedance tuned for maximum output power
…continued
Measured load-pull data per section; test signal: pulsed CW; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
t
p
= 100
μ
s;
δ
= 10 %; Z
S
= 50
Ω
. Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
(MHz)
980
(
Ω
)
(dB)
35.1
34.9
(dBm) (%)
(deg)
5.1
5.6
(
Ω
)
(dB)
35.1
34.9
(dBm) (%)
(deg)
5.6
6.7
18.3 + j3.7
18.2 + j3.7
40.7
40.6
53.5
52.7
18.3 + j3.7
18.2 + j3.7
41.7
41.6
57.7
57.2
1000
BLM8G0710S-15PBG
700
720
740
760
780
800
820
0.84
860
880
900
920
940
960
980
1000
14.6 + j5.2
14.1 + j6.2
14.2 + j5.1
15.0 + j4.1
14.9 + j4.2
14.7 + j4.7
14.8 + j4.1
15.4 + j4.1
16.1 + j3.0
17.5 + j3.4
17.8 + j2.7
17.3 + j2.8
17.4 + j2.7
17.6 + j3.5
18.5 + j3.0
19.3 + j1.9
35.8
35.8
35.7
35.3
34.6
34.5
34.2
34.2
34.1
34.3
34.3
34.5
34.6
34.8
34.7
34.2
40.7
40.7
40.7
40.6
40.6
40.8
40.8
40.9
40.9
40.8
40.8
40.8
40.7
40.7
40.6
40.6
53.7
54.7
52.9
52.5
52.1
53.6
52.7
54
10.5
9
15.3 + j4.0
15.8 + j4.3
15.8 + j3.9
14.9 + j3.3
15.5 + j2.9
15.5 + j3.3
15.7 + j3.4
16.1 + j2.5
16.1 + j3.0
16.0 + j2.8
17.9 + j1.7
17.3 + j1.9
17.3 + j1.8
16.8 + j2.5
16.9 + j2.5
17.6 + j2.5
35.7
35.7
35.6
35.2
34.4
34.3
34.1
34
41.7
41.6
41.6
41.6
41.6
41.7
41.7
41.8
41.8
41.8
41.7
41.8
41.7
41.7
41.6
41.6
56.7
57.8
56.7
55.2
54.9
56.3
56.3
56.1
56.3
55.4
54.8
55
11.7
9.6
9.2
9.3
8.5
7.3
5.9
4.7
4.3
4.5
4.1
4.1
4.2
4.8
5.6
6.1
8
8.1
7.7
7
5.7
4.3
4
52.6
53.4
52.4
52.7
51.8
52.4
51.5
50.3
34.1
34.2
34.2
34.4
34.4
34.7
34.7
34.3
4
3.7
3.6
4
54.4
54.9
54.6
54.9
4.1
4.5
5
Table 10.
Typical impedance tuned for maximum power added efficiency
Measured load-pull data per section; test signal: pulsed CW; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
t
p
= 100
μ
s;
δ
= 10 %; Z
S
= 50
Ω
. Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
(MHz)
(
Ω
)
(dB) (dBm)
(%)
(deg)
(
Ω
)
(dB) (dBm)
(%)
(deg)
BLM8G0710S-15PB
680
700
720
740
760
780
800
820
840
860
21.4 + j15.6
37.4
20.7 + j20.5
38
20.1 + j22.8
38
18.4 + j18.1
37.6
21.1 + j18.1
37.1
21.1 + j18.1
36.8
17.9 + j20.2
36.8
17.8 + j20.2
36.6
18.2 + j18.1
36.4
18.7 + j16.1
36.2
39.7
38.8
38.3
39.1
39.1
39.1
38.6
38.8
39.2
39.7
63.9
63.7
63.5
64
11.6
10.6
9.6
9.7
7.9
6.6
6.5
5.8
5.3
4.6
18.4 + j18.2
37.7
23.8 + j16.8
37.7
21.1 + j18.1
37.7
21.1 + j18.1
37.5
18.7 + j16.1
37.1
21.1 + j18.1
36.8
20.6 + j20.5
36.7
18.6 + j16.0
36.3
21.0 + j18.1
36.3
18.3 + j18.2
36.4
40
66.4
66.6
66.5
66.9
67
14.8
9.6
10.1
9.3
10
40.2
40
40
63.8
63.3
62.8
63.7
64
40.3
40
66.2
66.2
67.3
67.4
67.6
6.4
4.7
5.5
3.4
4.2
39.6
40.4
40.2
40.1
64.3
BLM8G0710S-15PB_S-15PBG
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V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
10 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Table 10.
Typical impedance tuned for maximum power added efficiency
…continued
Measured load-pull data per section; test signal: pulsed CW; T
case
= 25
°
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
t
p
= 100
μ
s;
δ
= 10 %; Z
S
= 50
Ω
. Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
Z
L
G
p(max)
P
L
η
add
AM-PM
conversion
(MHz)
880
900
920
940
960
980
1000
680
700
720
740
760
780
(
Ω
)
(dB) (dBm)
(%)
(deg)
4.3
3.8
4.6
5.5
5.6
5.6
6.3
11.6
10.6
9.6
9.7
7.9
6.6
(
Ω
)
(dB) (dBm)
(%)
(deg)
3.5
4.1
2.7
4.7
4.7
4.9
5.5
14.8
9.6
10.1
9.3
10
17.9 + j20.1
36.6
18.3 + j18.1
36.6
16.3 + j14.9
36.6
15.4 + j19.2
37
15.4 + j19.2
37
15.9 + j17.2
36.7
13.6 + j17.6
36.6
21.4 + j15.6
37.4
20.7 + j20.5
38
20.1 + j22.8
38
18.4 + j18.1
37.6
21.1 + j18.1
37.1
21.1 + j18.1
36.8
39
64.4
64.4
63.4
63.3
63.2
62.5
61.4
63.9
63.7
63.5
64
17.9 + j20.1
36.6
16.4 + j14.9
36.4
18.6 + j16.0
36.5
15.9 + j17.2
36.9
15.4 + j19.2
37
15.9 + j17.2
36.7
16.4 + j14.9
36.3
18.4 + j18.2
37.7
23.8 + j16.8
37.7
21.1 + j18.1
37.7
21.1 + j18.1
37.5
18.7 + j16.1
37.1
21.1 + j18.1
36.8
39.8
40.7
40.5
40.1
39.7
40.1
40.5
40
67.3
67.1
66.2
65.7
66.1
65.5
65.3
66.4
66.6
66.5
66.9
67
39.4
39.8
38.9
38.9
39.2
38.7
39.7
38.8
38.3
39.1
39.1
39.1
40.2
40
40
63.8
63.3
40.3
40
66.2
6.4
BLM8G0710S-15PBG
18.8 + j16.8
37.2
700
720
740
760
780
800
820
840
860
880
900
920
940
960
980
1000
39.2
39.1
39.3
39.1
39.2
39.5
39.3
39.4
39.4
39.4
39.2
39.4
39.3
39.3
39.3
39.1
60.9
61.7
61.2
60.8
60.4
61.1
61.1
62.1
61.6
60.7
60.5
60.7
59.9
59.3
59.1
59.2
11.4
9.8
9.3
8.7
8.1
7.7
6
19.8 + j14.0
37
19.8 + j15.2
36.9
19.0 + j14.7
37
19.7 + j17.0
36.9
18.3 + j16.1
36.1
18.0 + j15.6
36
19.0 + j16.0
35.7
17.7 + j15.6
35.6
15.9 + j15.7
35.8
15.9 + j14.7
35.8
15.6 + j15.4
36
15.9 + j14.7
36.1
16.0 + j14.8
36.2
15.5 + j14.4
36.3
14.8 + j14.7
36.2
14.6 + j14.0
35.8
40.5
40.4
40.4
40
63.4
64.4
63.9
63.6
63.2
64.1
64.2
64.8
64.1
63
11.8
10.3
10.4
8.6
8.4
7.6
5
19.3 + j17.3
37
18.3 + j16.0
37.1
18.5 + j16.6
36.9
18.3 + j16.1
36.1
17.0 + j15.1
36
18.1 + j16.5
35.8
16.9 + j16.1
35.7
16.8 + j16.1
35.8
16.1 + j15.4
35.9
15.7 + j16.2
36.1
16.0 + j15.5
36.2
16.2 + j15.7
36.2
15.6 + j15.3
36.3
15.7 + j15.2
36.2
14.8 + j15.6
35.8
40.1
40.3
40.3
40.4
40.2
40.4
40.2
40.4
40.3
40.3
40.2
40.4
5.4
4.8
5.3
5.1
4.6
4.6
4.5
4.7
4.5
4.3
5.6
5.6
5
62.9
63.1
62.4
62.3
62.5
62.8
4.1
4
4.3
4
4.5
BLM8G0710S-15PB_S-15PBG
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© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
11 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
8.4 Graphs
aaa-017814
aaa-017815
40
30
20
10
0
0
38
0
G
(1)
RL
G
RL
in
(dB)
p
in
p
(dB)
(dB)
(dB)
-10
-20
-30
-40
36
34
32
30
-10
-20
-30
-40
(1)
(2)
(2)
200
400
600
800
1000
f (MHz)
1200
700
750
800
850
900
950
1000
f (MHz)
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
P
L
= 0.2 W. Per section.
P
L
= 0.2 W. Per section.
(1) magnitude
of G
p
(2) magnitude
of RL
in
(1) magnitude
of G
p
(2) magnitude
of RL
in
Fig 9.
Wideband power gain and input return loss as
function of frequency; typical values
Fig 10.
In-band power gain and input return loss as
function of frequency; typical values
aaa-017816
aaa-017817
40
38
36
34
32
80
60
40
20
0
5
G
η
φ
/φ
p
D
s21 s21(norm)
(deg)
2.5
(dB)
(%)
(
(
1
1
)
)
(
(
2
2
)
)
(
(
3
3
)
)
(
(
4
4
)
)
0
-2.5
-5
(4)
(3)
(2)
(1)
G
p
-7.5
η
D
-10
20
25 27.5 30 32.5 35 37.5 40 42.5 45
(dBm)
25
30
35
40
45
P
L
P
(dBm)
L
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA.
Normalized at P
L
= 26 dBm; T
case
= 25
C; V
DS
= 28 V;
Per section.
I
Dq1
= 15 mA; I
Dq2
= 60 mA. Per section.
(1) f
= 700 MHz
(2) f
= 800 MHz
(3) f
= 900 MHz
(4) f
= 1000 MHz
(1) f
= 700 MHz
(2) f
= 800 MHz
(3) f
= 900 MHz
(4) f
= 1000 MHz
Fig 11.
Power gain and drain efficiency as function of
output power; typical values
Fig 12.
Normalized phase response as a function of
output power; typical values
BLM8G0710S-15PB_S-15PBG
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© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
12 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
aaa-017818
-10
IMD
(dB
c
c
)
)
(1)
(2)
IMD3
-30
IMD5
IMD7
(1)
(2)
-50
-70
-90
(1)
(2)
2
3
1
10
10
10
tone spacing (MHz)
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA; f = 881 MHz; 2-tone CW; P
L
= 5 W. Per section.
(1) IMD
low
(2) IMD
high
Fig 13.
Intermodulation distortion as a function of tone spacing; typical values
aaa-017819
aaa-017820
-20
ACPR
(dBc)
50
40
30
20
10
0
60
48
36
24
12
0
2
η
|s
|
12
D
(%)
(dB)
-30
-40
-50
-60
-70
ACP
R
R
5M
η
D
AC
P
P
R
R
31
10M
33
25
27
29
35
37
39
41
500
600
700
800
900 1000
1100 1200
f (MHz)
P
(dBm)
L
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 16 mA; I
Dq2
= 60 mA;
f = 900 MHz; 1-carrier W-CDMA; test model 1;
PAR = 9.9 dB at 0.01 % probability on CCD
F
.
P
er
section.
T
case
= 25
C; V
DS
= 28 V; I
Dq1
= 15 mA; I
Dq2
= 60 mA;
measured on evaluation board.
Fig 14.
Adjacent channel power ratio and drain
efficiency as function of output power;
typical values
Fig 15.
Isolation as a function of frequency;
typical values
BLM8G0710S-15PB_S-15PBG
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© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
13 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
9. Package
outline
SOT1211-3
(18.01)
(2.15)
(15.44)
7.45
(0.75)
E
0.10 (4)
A
15
16
0.05 A
L
R1.38
16.00
P
2.00 0.1
Z
R0.16 max.
0.10
1
14
metal protrusion 4x
(ground) in corners (2)
1.57 (5)
0.22 0.05
1.50
B
1.00
(12x)
0.25 B
0.35 (14x) (3)
L
+
–
0.08
0.03
20.75(1)
0.05 B
L
3.92
R1.00
R0.32
B
20.57
(0.20) molding compound around
the perimeter of the heatsink
R0.60(4x)
pin 17 (6)
0.25 B
5.50 (3)
L
Min. 15.5
Min. 18.5
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1211-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 1 of 2
Fig 16.
Package outline SOT1211-3 (sheet 1 of 2)
BLM8G0710S-15PB_S-15PBG
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© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
14 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
SOT1211-3
Drawing Notes
Description
Items
(1)
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm. max.
At all other areas the
mold protrusion is maximum 0.15 mm per side. See also detail B.
(2)
(3)
(4)
(5)
(6)
(7)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
The lead coplanarity over all leads is 0.1 mm maximum.
Dimension is measured 0.5 mm from the edge of the top package body.
The hatched area indicates the exposed metal heatsink.
The leads and exposed heatsink are plated with matte Tin (Sn).
location of metal protrusion (2)
DETAIL
A
SCALE 25:1
B
A
lead dambar
location
DETAIL
B
SCALE 50:1
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1211-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 2 of 2
Fig 17.
Package outline SOT1211-3 (sheet 2 of 2)
BLM8G0710S-15PB_S-15PBG
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© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
15 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
SOT1212-3
(18.01)
(15.44)
7.45
(2.15)
(0.75)
A
0.05 A
L
16
15
R1.38
16
P
2 0.1
Z
R0.16 max.
14
1
metal protrusion 4x
C
1.5
(ground) in corners (2)
1
(12x)
0.25 B
L
0.35 (14x) (3)
20.75 (1)
0.05 B
L
DETAIL
C
+
–
.08
.03
3.92
SCALE 25:1
R1
H
R0.32
20.57
B
0.10
(0.20) compound rim all around the
perimeter of the heatsink
+
–
4°
3°
3.0°
+0.06
0.00
(6)
–
0.02
Gage plane
pin 17 (4)
0.35 (7)
Seating plane
R0.60 (4x)
0.25 B
5.5 (3)
L
Min. 15.5
Min. 18.5
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1212-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 1 of 2
Fig 18.
Package outline SOT1212-3 (sheet 1 of 2)
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
16 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
SOT1212-3
Drawing Notes
Description
Items
(1)
Dimensions are excluding mold protrusion.
Areas located adjacent to the leads have a maximum mold protrusion of 0.25
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the
mold protrusion is maximum 0.15 mm per side. See also detail B.
(2)
(3)
(4)
(5)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
The hatched area indicated the exposed heatsink.
The leads and exposed heatsink are plated with matte Tin (Sn).
Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the
heatsink is higher than the bottom of the lead.
(6)
(7)
Gage plane (foot length) to be measured from the seating plane.
location of metal protrusion (2)
B
DETAIL
A
SCALE 25:1
A
lead dambar
location
DETAIL
B
SCALE 50:1
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1212-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 2 of 2
Fig 19.
Package outline SOT1212-3 (sheet 2 of 2)
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
17 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
10. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the
ANSI/ESD S20.20
,
IEC/ST 61340-5
,
JESD625-A
or
equivalent standards.
Table 11.
ESD sensitivity
ESD model
Class
C0B
[1]
1B
[2]
Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002
Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001
[1] CDM
classification C0B is granted to any part that passes after exposure to an ESD pulse of 125
V
.
[2] HBM
classification 1B is granted to any part that passes after exposure to an ESD pulse of 500
V
.
11. Abbreviations
Table 12.
Abbreviations
Acronym
AM
Description
Amplitude Modulation
3GPP
CCDF
CW
3rd Generation Partnership Project
Complementary Cumulative Distribution Function
Continuous Wave
DPCH
ESD
Dedicated Physical CHannel
ElectroStatic Discharge
GEN8
LDMOS
MMIC
MTF
Eighth Generation
Laterally Diffused Metal Oxide Semiconductor
Monolithic Microwave Integrated Circuit
Median Time to Failure
PAR
Peak-to-Average Ratio
PM
Phase Modulation
RoHS
VSWR
W-CDMA
Restriction of Hazardous Substances
Voltage Standing Wave Ratio
Wideband Code Division Multiple Access
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
18 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
12. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
20180928 Product
data sheet
Change notice
Supersedes
– BLM8G0710S-15PB_
BLM8G0710S-15PB_S-15PBG v.5
S-15PBG v.4
Modifications
•
Section 9 on page 14
: package outline versions updated
BLM8G0710S-15PB_S-15PBG v.4
20180418
20150909
20150901
20150831
20150702
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Preliminary data sheet
–
–
–
–
–
BLM8G0710S-15PB_
S-15PBG v.3
BLM8G0710S-15PB_S-15PBG v.3
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BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
19 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
13. Legal information
13.1 Data
sheet status
Document status
[1][2]
Product status
[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet
Qualification
Product [short] data sheet
Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
Ampleon product can reasonably be expected to result in personal injury,
13.2 Definitions
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Draft —
The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Applications —
Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Short data sheet —
A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Product specification —
The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
13.3 Disclaimers
Limited warranty and liability —
Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
Limiting values —
Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including – without limitation – lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale —
Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
T
e
rms and conditions of commercial sale
of Ampleon.
No offer to sell or license —
Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes —
Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Export control —
This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use —
Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
20 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
Non-automotive qualified products —
Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
Translations —
A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’s warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’s specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’s standard warranty and Ampleon’s product
specifications.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
14. Contact information
BLM8G0710S-15PB_S-15PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.
V
.
2
018. All rights reserved.
Product data sheet
Rev. 5 — 28 September 2018
21 of 22
BLM8G0710S-15PB(G)
LDMOS 2-stage power MMIC
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . .
1
Features and benefit
s
. . . . . . . . . . . . . . . . . . . .
1
Applications .
. . . . . . . . . . . . . . . . . . . . . . . . . .
1
2
2.1
2.2
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . .
2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
Pin description
. . . . . . . . . . . . . . . . . . . . . . . . .
2
3
4
5
6
7
Ordering informatio
n
. . . . . . . . . . . . . . . . . . . . .
3
Block diagram
. . . . . . . . . . . . . . . . . . . . . . . . . .
3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
3
Thermal characteristics. . . . . . . . . . . . . . . . . . .
4
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
4
8
Application information. . . . . . . . . . . . . . . . . . .
5
Possible circuit topologies
. . . . . . . . . . . . . . . .
8
Ruggedness in class-AB operation. . . . . . . . . .
9
Impedance information . . . . . . . . . . . . . . . . . . .
9
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
8.1
8.2
8.3
8.4
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
14
Handling information. . . . . . . . . . . . . . . . . . . .
18
Abbreviation
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
1
8
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . .
1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . .
20
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
20
Definition
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
0
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
21
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . .
21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Ampleon Netherlands B.
V
.
2018.
All rights reserved.
Date of release: 28 September 2018
Document identifier: BLM8G0710S-15PB_S-15PBG
