Analog-Devices-AD6657ABBCZRL

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Analog-Devices-AD6657ABBCZRL
Quad IF Receiver  
Data Sheet  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
AVDD  
AGND  
DRVDD DRGND  
11-bit, 200 MSPS output data rate per channel  
Integrated noise shaping requantizer  
Performance with NSR enabled  
SNR: 76.0 dBFS in 40 MHz band to 70 MHz at 185 MSPS  
SNR: 73.6 dBFS in 60 MHz band to 70 MHz at 185 MSPS  
SNR: 72.8 dBFS in 65 MHz band to 70 MHz at 185 MSPS  
Performance with NSR disabled  
SNR: 66.5 dBFS to 70 MHz at 185 MSPS  
SFDR: 88 dBc to 70 MHz at 185 MSPS  
Low power: 1.2 W at 185 MSPS  
1.8 V analog supply operation  
1.8 V LVDS (ANSI-644 levels) output  
1-to-8 integer clock divider  
Internal ADC voltage reference  
1.75 V p-p analog input range (programmable to 2.0 V p-p)  
Differential analog inputs with 800 MHz bandwidth  
95 dB channel isolation/crosstalk  
AD6657A  
DCO±AB  
DO±AB  
14  
14  
14  
14  
11  
VIN+A  
VIN–A  
VCMA  
VIN+B  
VIN–B  
VCMB  
VIN+C  
VIN–C  
VCMC  
VIN+D  
VIN–D  
VCMD  
PIPELINE  
ADC  
NOISE SHAPING  
REQUANTIZER  
PORT A  
11  
11  
11  
NOISE SHAPING  
REQUANTIZER  
PIPELINE  
ADC  
D10±AB  
DCO±CD  
DO±CD  
NOISE SHAPING  
REQUANTIZER  
PIPELINE  
ADC  
PORT B  
NOISE SHAPING  
REQUANTIZER  
PIPELINE  
ADC  
D10±CD  
MODE  
SYNC  
PDWN  
REFERENCE  
CLOCK  
DIVIDER  
SERIAL PORT  
Serial port control  
User-configurable built-in self test (BIST) capability  
Energy saving power-down modes  
SCLK SDIO  
CSB  
CLK+ CLK–  
Figure 1.  
APPLICATIONS  
Communications  
Diversity radio and smart antenna (MIMO) systems  
Multimode digital receivers (3G)  
WCDMA,
L
T
E, CDMA2000  
WiMAX, TD-SCDMA  
I/Q demodulation systems  
General-purpose software radios  
Each ADC output is connected internally to an NSR block. The  
integrated NSR circuitry allows for improved SNR performance in  
a smaller frequency band within the Nyquist bandwidth. The  
device supports two different output modes selectable via the  
external MODE pin or the serial port interface (SPI).  
GENERAL DESCRIPTION  
Th

n 11-bit, 200 MSPS, quad channel intermediate  
frequency (IF) receiver specifically designed to support multiple  
antenna systems in telecommunication applications where high  
dynamic range performance, low power, and small size are desired.  
With the NSR feature enabled, the outputs of the ADCs are  
processed such that the

upports enhanced SNR per-  
formance within a limited portion of the Nyquist bandwidth while  
maintaining an 11-bit output resolution. The NSR block can be  
programmed to provide a bandwidth of either 22%, 33%, or 36% of  
the sample clock. For example, with a sample clock rate of  
185 MSPS, th

can achieve up to 76.0 dBFS SNR for a  
40 MHz bandwidth in the 22% mode, up to 73.6 dBFS SNR for a  
60 MHz bandwidth in the 33% mode, or up to 72.8 dBFS SNR for a  
65 MHz bandwidth in the 36% mode.  
The device consists of four high performance ADCs and NSR  
digital blocks. Each ADC consists of a multistage, differential  
pipelined architecture with integrated output error correction  
logic. The ADC features a wide bandwidth switched capacitor  
sampling network within the first stage of the differential pipeline.  
An integrated voltage reference eases design considerations. A  
duty cycle stabilizer (DCS) compensates for variations in the  
ADC clock duty cycle, allowing the converters to maintain  
excellent performance.  
(General Description continued on Page 3)  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registere
d
t
rademarks ar
e
t
he property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700
 
©2011–2014 Analog Devices, Inc. All rights reserved.  
 
 
 
 

AD6657A  
Data Sheet  
TABLE OF CONTENTS  
REVISION HISTORY  
2/14—Rev. 0 to Rev. A  
Changed DCO to Data Skew (t

SKEW

) Parameter Unit from ns to  
ps, Table 4 ……………………………………………………………………………… 9  
10/11—Revision 0: Initial Version  
Rev. A | Page 2 of 36  
 

Data Sheet  
AD6657A  
With the NSR block disabled, the ADC data is provided directly to  
the output with a resolution of 11 bits. The

can achieve  
up to 66.5 dBFS SNR for the entire Nyquist bandwidth when  
operated in this mode. This allows the

to be used in  
telecommunication applications such as a digital predistortion  
observation path where wider bandwidths are used.  
(CSP_BGA) that is specified over the industrial temperature  
range of −40°C to +85°C.  
PRODUCT HIGHLIGHTS  
1. Four
 
analog-to-digital converters (ADCs) are contained in  
a small, space-saving, 10 mm × 10 mm × 1.4 mm, 144-ball  
CSP_BGA package.  
2. Pin
 
selectable noise shaping requantizer (NSR) function  
that allows for improved SNR within a reduced bandwidth  
of up to 65 MHz at 185 MSPS.  
After digital signal processing, multiplexed output data is  
routed into two 11-bit output ports such that the maximum  
digital data rate (DDR) is 400 Mbps. These outputs are set at  
1.8 V LVDS and support ANSI-644 levels.  
3. LVDS
 
digital output interface configured for low cost  
The

receiver digitizes a wide spectrum of IF frequencies.  
Each receiver is designed for simultaneous reception of a separate  
antenna. This IF sampling architecture greatly reduces component  
cost and complexity compared with traditional analog techniques  
or less integrated digital methods.  
FPGA families.  
4. 230
 
mW per ADC core power consumption.  
5. Operation
 
from a single 1.8 V supply.  
6. Standard
 
SPI that supports various product features and  
functions, such as data formatting (offset binary or twos  
complement), NSR, power-down, test modes, and voltage  
reference mode.  
7. On-chip
 
integer 1-to-8 input clock divider and multichip  
sync function to support a wide range of clocking schemes  
and multichannel subsystems.  
Flexible power-down options allow significant power savings.  
Programming for device setup and control is accomplished  
using a 3-wire SPI-compatible serial interface with numerous  
modes to support board level system testing.  
The

is available in a Pb-free, RoHS compliant,  
144-ball, 10 mm × 10 mm chip scale package ball grid array  
Rev. A | Page 3 of 36  
 

AD6657A  
Data Sheet  
SPECIFICATIONS  
DC SPECIFICATIONS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f

S

= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless  
otherwise noted.  
Table 1.  
Parameter  
Temperature  
Min  
Typ  
Max  
Unit  
RESOLUTION  
Full  
11  
Bits  
ACCURACY  
No Missing Codes  
Offset Error  
Gain Error  
Differential Nonlinearity (DNL)

Integral Nonlinearity (I

MATCHING CHARACTERISTIC  
Offset Error  
Full  
Full  
Full  
Full  
Full  
Guaranteed  
+0.1  
+11  
0.1  
0.17  
−0.9  
+4  
−0.4  
−0.55  
+0.9  
+18  
+0.4  
+0.55  
mV  
% FSR  
LSB  
LSB  
Full  
Full  
−5  
0
+3  
+2.1  
+11  
+8  
mV  
% FSR  
Gain Error  
TEMPERATURE DRIFT  
Offset Error  
Gain Error  
Full  
Full  
2
40  
ppm/°C  
ppm/°C  
ANALOG INPUT  
Input Range  
Full  
Full  
Full  
Full  
1.4  
1.75  
0.95  
20  
2.0  
V p-p  
V
kΩ  
pF  
Input Common-Mode Voltage  
Input Resistance (Differential)  
Input Capacitance

POWER SUPPLIES  
Supply Voltage  
AVDD  
5
Full  
Full  
1.7  
1.7  
1.8  
1.8  
1.9  
1.9  
V
V
DRVDD  
Supply Current  
I

AVD

Full  
Full  
466  
170  
510  
183  
mA  
mA  
I

DRV

1

(1.8 V LVDS)  
POWER CONSUMPTION  
Sine Wave Inpu

Standby Power

Power-Down Power  
Full  
Full  
Full  
1145  
129  
3.8  
1247  
10  
mW  
mW  
mW  

1

Measured with a 10 MHz, 0 dBFS sine wave, with 100 Ω termination on each LVDS output pair.  

2

Input capacitance refers to the effective capacitance between one differential input pin and AGND.  

3

Standby power is measured with a dc input and the CLKx pins inactive (set to AVDD or AGND).  
Rev. A | Page 4 of 36  
 
 
 
 

Data Sheet  
AD6657A  
AC SPECIFICATIONS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f

S

= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless  
otherwise noted.  
Table 2.  
Parameter

Temperature Min  
Typ  
Max  
Unit  
SIGNAL-TO-NOISE-RATIO (SNR)—NSR DISABLED  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
f

IN

= 170 MHz  
25°C  
25°C  
25°C  
25°C  
Full  
25°C  
66.6  
66.5  
66.5  
66.3  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
65.6  
f

IN

= 250 MHz  
65.9  
SIGNAL-TO-NOISE-RATIO (SNR)—NSR ENABLED  
22% BW Mode  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
f

IN

= 170 MHz  
25°C  
25°C  
25°C  
25°C  
Full  
76.0  
75.7  
75.7  
74.3  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
72.9  
71.3  
70.7  
64.6  
f

IN

= 250 MHz  
33% BW Mode  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
25°C  
72.8  
25°C  
25°C  
25°C  
25°C  
Full  
73.6  
73.6  
73.3  
72.5  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
f

IN

= 170 MHz  
f

IN

= 230 MHz  
36% BW Mode  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
25°C  
71.2  
25°C  
25°C  
25°C  
25°C  
Full  
72.8  
72.6  
72.6  
71.8  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
f

IN

= 170 MHz  
f

IN

= 250 MHz  
SIGNAL-TO-NOISE-AND DISTORTION (SINAD)  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
25°C  
70.8  
25°C  
25°C  
25°C  
25°C  
Full  
65.5  
65.5  
65.5  
65.3  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
dBFS  
f

IN

= 170 MHz  
f

IN

= 250 MHz  
EFFECTIVE NUMBER OF BITS (ENOB)  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
25°C  
64.8  
25°C  
25°C  
25°C  
25°C  
25°C  
10.6  
10.6  
10.6  
10.6  
10.5  
Bits  
Bits  
Bits  
Bits  
Bits  
f

IN

= 170 MHz  
f

IN

= 250 MHz  
Rev. A | Page 5 of 36  
 

AD6657A  
Data Sheet  
Parameter

Temperature Min  
Typ  
Max  
Unit  
WORST SECOND OR THIRD HARMONIC  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
f

IN

= 170 MHz  
25°C  
25°C  
25°C  
25°C  
Full  
−94  
−91  
−88  
−90  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
−80  
f

IN

= 250 MHz  
25°C  
−83  
SPURIOUS-FREE DYNAMIC RANGE (SFDR)  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
f

IN

= 170 MHz  
25°C  
25°C  
25°C  
25°C  
Full  
25°C  
94  
91  
88  
90  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
80  
f

IN

= 250 MHz  
83  
WORST OTHER HARMONIC (FOURTH THROUGH EIGHTH)  
f

IN

= 10 MHz  
f

IN

= 50 MHz  
f

IN

= 70 MHz  
f

IN

= 170 MHz  
25°C  
25°C  
25°C  
25°C  
Full  
−94  
−95  
−94  
−94  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
−80  
f

IN

= 250 MHz  
25°C  
−90  
TWO TONE SFDR (−7 dBFS)  
f

IN1

= 169 MHz, f

IN2

= 172 MHz  
CROSSTALK

25°C  
Full  
89  
dBc  
dB  
95  
ANALOG INPUT BANDWIDTH  
25°C  
800  
MHz  

1

See th

Understanding High Speed ADC Testing and Evaluation
, for a complete set of definitions.  

2

Crosstalk is measured at 155 MHz with −1 dBFS on one channel and no input on the alternate channel.  
Rev. A | Page 6 of 36  
 

Data Sheet  
AD6657A  
DIGITAL SPECIFICATIONS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f

S

= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless  
otherwise noted.  
Table 3.  
Parameter  
Temperature Min  
Typ  
Max  
Unit  
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)  
Logic Compliance  
CMOS/LVDS/LVPECL  
0.9  
Internal Common-Mode Bias  
Differential Input Voltage  
Input Voltage Range  
High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
V
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
0.2  
AGND − 0.3  
3.6  
AVDD + 0.2  
V p-p  
V
1.2  
0
−10  
−10  
8
2.0  
0.8  
+10  
+10  
12  
V
V
µA  
µA  
kΩ  
pF  
10  
4
Input Capacitance  
SYNC INPUT  
Logic Compliance  
Internal Bias  
CMOS  
0.9  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
V
Input Voltage Range  
High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
AGND  
1.2  
AGND  
−100  
−100  
12  
AVDD  
AVDD  
0.6  
V
V
V
+100  
+100  
20  
µA  
µA  
kΩ  
pF  
16  
1
Input Capacitance  
LOGIC INPUT (CSB)

High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
Full  
Full  
Full  
Full  
Full  
1.22  
0
−10  
40  
2.1  
0.6  
+10  
132  
V
V
µA  
µA  
kΩ  
pF  
26  
2
Input Capacitance  
LOGIC INPUT (SCLK)

High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
Full  
Full  
Full  
Full  
Full  
1.22  
0
−92  
−10  
2.1  
0.6  
−135  
+10  
V
V
µA  
µA  
kΩ  
pF  
26  
2
Input Capacitance  
LOGIC INPUT/OUTPUT (SDIO

High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
Full  
Full  
Full  
Full  
Full  
1.22  
0
−10  
38  
2.1  
0.6  
+10  
128  
V
V
µA  
µA  
kΩ  
pF  
26  
5
Input Capacitance  
Rev. A | Page 7 of 36  
 

AD6657A  
Data Sheet  
Parameter  
Temperature Min  
Typ  
Max  
Unit  
LOGIC INPUT (MO

High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
Full  
Full  
Full  
Full  
Full  
1.22  
0
−10  
40  
2.1  
0.6  
+10  
132  
V
V
µA  
µA  
kΩ  
pF  
26  
2
Input Capacitance  
LOGIC INPUT (PDWN

High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
Input Resistance  
Full  
Full  
Full  
Full  
Full  
Full  
1.22  
0
−90  
−10  
2.1  
0.6  
−134  
+10  
V
V
µA  
µA  
kΩ  
pF  
26  
5
Input Capacitance  
DIGITAL OUTPUTS (LVDS)  
Differential Output Voltage (V

OD

)  
Output Offset Voltage (V

OS

)  
Full  
Full  
247  
1.125  
454  
1.375  
mV  
V

1

Pull up.  

2

Pull down.  
Rev. A | Page 8 of 36  
 

Data Sheet  
AD6657A  
SWITCHING SPECIFICATIONS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f

S

= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless  
otherwise noted.  
Table 4.  
Parameter  
Temperature Min  
Typ  
Max  
Unit  
CLOCK INPUT PARAMETERS  
Input Clock Rate  
Full  
625  
200  
MHz  
MSPS  
ns  
ns  
ps rms  
Conversion Rate

Full  
Full  
Full  
Full  
40  
185  
2.7  
1.3  
CLK Pulse Width High (t

CH

)

Aperture Delay (t

A

)

Aperture Uncertainty (Jitter, t

J

)  
0.13  
DATA OUTPUT PARAMETERS  
Data Propagation Delay (t

PD

)

Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
3.0  
3.1  
−41  
4.9  
4.9  
+33  
ns  
ns  
ps  
Cycles  
Cycles  
µs  
4.0  
4.0  
+6.1  
9
12  
0.5  
310  
2
DCO Propagation Delay (t

DCO  

DCO to Data Skew (t

SKEW  

Pipeline Delay (Latency)  
With NSR Enabled  
Wake-Up Time (from Standby)

Wake-Up Time (from Power Down

OUT-OF-RANGE RECOVERY TIME  
µs  
Cycles  

1

Conversion rate is the clock rate after the divider.  

2

S

for details.  

3

Wake-up time is dependent on the value of the decoupling capacitors.  
Data Output Timing Diagram  
t

A  

N – 1  
N + 4  
N + 5  
N
N + 3  
VIN  
N + 1  
N + 2  
t

CH  

t

CL  

1/
f

S  

CLK+  
CLK–  
t

DCO  

DCO+  
DCO–  
t

SKEW  

t

PD  

D10+AB (MSB)  
D10–AB (MSB)  
D10A  
D0A  
D10B  
D0B  
D10A  
D10B  
D10A  
D10B  
D0B  
D10A  
D0A  
D10B  
D0B  
D10A  
D0A  
D10B  
D0B  
D10A  
D0A  
D10B  
D0B  
D10A  
D0A  
D10B  
D0B  
D0+AB (LSB)  
D0–AB (LSB)  
D0A  
D0B  
D0A  
Figure 2. Data Output Timing (Timing for Channel C and Channel D Is Identical to Timing for Channel A and Channel B)  
Rev. A | Page 9 of 36  
 
 
 

AD6657A  
Data Sheet  
TIMING SPECIFICATIONS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f

S

= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless  
otherwise noted.  
Table 5.  
Parameter  
Description  
Min  
Typ  
Max  
Unit  
SYNC TIMING REQUIREMENTS  
S

for details  
t

SSYNC  

t

HSYNC  

SYNC to rising edge of CLK setup time  
SYNC to rising edge of CLK hold time  
S

for details, except where noted  
Setup time between the data and the rising edge of SCLK  
Hold time between the data and the rising edge of SCLK  
Period of the SCLK  
Setup time between CSB and SCLK  
Hold time between CSB and SCLK  
SCLK pulse width high  
0.24  
0.40  
ns  
ns  
SPI TIMING REQUIREMENTS  
t

DS  

t

DH  

t

CLK  

t

S  

2
2
40  
2
2
10  
10  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t

H  

t

HIGH  

t

LOW  

t

EN_SDIO  

SCLK pulse width low  
Time required for the SDIO pin to switch from an input to  
an output relative to the SCLK falling edge (not pictured in  
t

DIS_SDIO  

Time required for the SDIO pin to switch from an output to  
an input relative to the SCLK rising edge (not pictured in  
10  
ns  
Sync Input Timing Diagram  
CLK+  
t

SSYNC  

t

HSYNC  

SYNC  
Figure 3. SYNC Input Timing Requirements  
Rev. A | Page 10 of 36  
 
 
 

Data Sheet  
AD6657A  
ABSOLUTE MAXIMUM RATINGS  
THERMAL CHARACTERISTICS  
Table 6.  
The values in

are per JEDEC JESD51-7 and JEDEC  
JESD25-5 for a 2S2P test board. Typical θ

JA

is specified for a  
4-layer printed circuit board (PCB) with a solid ground plane.  
As shown i

airflow improves heat dissipation, which  
reduces θ

JA

. In addition, metal in direct contact with the  
package leads from metal traces, through holes, ground, and  
power planes reduces θ

JA

.  
Parameter  
Rating  
AVDD to AGND  
DRVDD to AGND  
VIN+x, VIN−x to AGND  
CLK+, CLK− to AGND  
SYNC to AGND  
VCMx to AGND  
CSB to AGND  
SCLK to AGND  
−0.3 V to +2.0 V  
−0.3 V to +2.0 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to AVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
−0.3 V to DRVDD + 0.2 V  
Table 7.  
Airflow  
Velocity  
SDIO to AGND  
Package Type  
θ

JA  

θ

JC  

8.9  
θ

JB  

6.6  
Unit  
°C/W  
°C/W  
°C/W  
PDWN to AGND  
MODE to AGND  
Digital Outputs to AGND  
DCO+AB, DCO−AB, DCO+CD,  
DCO−CD to AGND  
Operating Temperature Range  
(Ambient)  
Maximum Junction Temperature  
Under Bias  
144-Ball CSP_BGA  
0 m/s  
1 m/s  
2.5 m/s  
26.9  
24.2  
23.0  

1

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).  

2

Per MIL-STD 883, Method 1012.1.  
−40°C to +85°C  
150°C  

3

Per JEDEC JESD51-8 (still air).  
The values in

are from simulations. The PCB is a JEDEC  
multilayer board. Thermal performance for actual applications  
requires careful inspection of the conditions in the application  
to determine whether they are similar to those assumed in these  
calculations.  
Storage Temperature Range  
(Ambient)  
−65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 8.  
Airflow  
Velocity  
Package Type  
Ψ

JB  

Ψ

JT  

Unit  
°C/W  
°C/W  
°C/W  
144-Ball CSP_BGA  
0 m/s  
14.4  
14.0  
13.9  
0.23  
0.50  
0.53  
1 m/s  
2.5 m/s  
ESD CAUTION  
Rev. A | Page 11 of 36  
 
 
 
 
 
 

AD6657A  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
1
2
3
4
5
6
7
8
9
10  
11  
12  
A
B
C
D
E
F
AGND  
AGND  
VIN+D  
VIN–D  
AGND  
AGND  
VIN+C  
AGND  
AGND  
VCMD  
AVDD  
AGND  
VIN–C  
VCMC  
AGND  
AGND  
AVDD  
AGND  
AGND  
AGND  
CSB  
AVDD  
AVDD  
SDIO  
AVDD  
AVDD  
AGND  
CLK–  
AVDD  
SCLK  
AVDD  
AVDD  
AGND  
CLK+  
AVDD  
PDWN  
AVDD  
AVDD  
AGND  
AVDD  
AVDD  
SYNC  
AVDD  
AVDD  
AGND  
AGND  
AGND  
MODE  
AVDD  
AVDD  
AGND  
VIN–B  
VCMB  
AGND  
AGND  
AVDD  
AGND  
VIN+B  
AGND  
AGND  
VCMA  
AVDD  
AGND  
AGND  
AGND  
VIN+A  
VIN–A  
AGND  
AGND  
AVDD  
AVDD  
AGND  
G
H
J
DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND  
DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD  
D0–CD  
D0+CD  
D1–CD  
D1+CD  
D2–CD  
D2+CD  
D3–CD  
D3+CD  
D4–CD  
D4+CD  
D5–CD  
D5+CD  
D6–CD  
D6+CD  
D7–CD  
D7+CD  
D8–CD D10–CD D0–AB  
D8+CD D10+CD D0+AB  
D9–CD DCO–CD D1–AB  
D9+CD DCO+CD D1+AB  
D2–AB  
D2+AB  
D3–AB  
D3+AB  
D4–AB  
D4+AB  
D5–AB  
D5+AB  
D6–AB  
D6+AB  
D7–AB  
D7+AB  
D8–AB D10–AB  
D8+AB D10+AB  
D9–AB DCO–AB  
D9+AB DCO+AB  
K
L
M
Figure 4. Pin Configuration (Top View)  
Table 9. Pin Function Descriptions  
Pin No.  
Mnemonic  
Type  
Description  
A5, A8, B5 to B8, D4 to  
D9, E2 to E11  
AVDD  
Supply  
Analog Power Supply. 1.8 V nominal.  
A1, A4, A9, A12, B1, B2,  
B4, B9, B11, B12, C2, C3,  
C10, C11, D3, D10, E1,  
E12, F1 to F12  
AGND  
Ground  
Analog Ground.  
H1 to H12  
G1 to G12  
A7  
DRVDD  
DRGND  
CLK+  
Supply  
Ground  
Input  
Digital Output Driver Supply. 1.8 V nominal.  
Digital Output Driver Ground.  
ADC Clock Input—True.  
A6  
CLK−  
Input  
ADC Clock Input—Complement.  
C12  
D12  
D11  
A11  
A10  
B10  
A2  
A3  
B3  
C1  
D1  
D2  
K7  
J7  
M7  
L7  
K8  
J8  
M8  
L8  
K9  
VIN+A  
VIN−A  
VCMA  
VIN+B  
VIN−B  
VCMB  
Input  
Input  
Output  
Input  
Input  
Output  
Input  
Input  
Output  
Input  
Input  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Differential Analog Input Pin (+) for Channel A.  
Differential Analog Input Pin (−) for Channel A.  
Common-Mode Level Bias Output for Analog Input Channel A.  
Differential Analog Input Pin (+) for Channel B.  
Differential Analog Input Pin (−) for Channel B.  
Common-Mode Level Bias Output for Analog Input Channel B.  
Differential Analog Input Pin (+) for Channel C.  
Differential Analog Input Pin (−) for Channel C.  
Common-Mode Level Bias Output for Analog Input Channel C.  
Differential Analog Input Pin (+) for Channel D.  
VIN+C  
VIN−C  
VCMC  
VIN+D  
VIN−D  
VCMD  
D0+AB  
D0−AB  
D1+AB  
D1−AB  
D2+AB  
D2−AB  
D3+AB  
D3−AB  
D4+AB  
D4−AB  
Differential Analog Input Pin (−) for Channel D.  
Common-Mode Level Bias Output for Analog Input Channel D.  
Channel A and Channel B LVDS Output Data 0—True.  
Channel A and Channel B LVDS Output Data 0—Complement.  
Channel A and Channel B LVDS Output Data 1—True.  
Channel A and Channel B LVDS Output Data 1—Complement.  
Channel A and Channel B LVDS Output Data 2—True.  
Channel A and Channel B LVDS Output Data 2—Complement.  
Channel A and Channel B LVDS Output Data 3—True.  
Channel A and Channel B LVDS Output Data 3—Complement.  
Channel A and Channel B LVDS Output Data 4—True.  
Channel A and Channel B LVDS Output Data 4—Complement.  
Rev. A | Page 12 of 36  
J9  
 

Data Sheet  
AD6657A  
Pin No.  
M9  
L9  
Mnemonic  
D5+AB  
D5−AB  
D6+AB  
D6−AB  
D7+AB  
D7−AB  
D8+AB  
D8−AB  
D9+AB  
D9−AB  
D10+AB  
D10−AB  
DCO+AB  
DCO−AB  
D0+CD  
D0−CD  
D1+CD  
D1−CD  
D2+CD  
D2−CD  
D3+CD  
D3−CD  
D4+CD  
D4−CD  
D5+CD  
D5−CD  
D6+CD  
D6−CD  
D7+CD  
D7−CD  
D8+CD  
D8−CD  
D9+CD  
D9−CD  
D10+CD  
D10−CD  
DCO+CD  
DCO−CD  
MODE  
Type  
Description  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Input  
Channel A and Channel B LVDS Output Data 5—True.  
Channel A and Channel B LVDS Output Data 5—Complement.  
Channel A and Channel B LVDS Output Data 6—True.  
Channel A and Channel B LVDS Output Data 6—Complement.  
Channel A and Channel B LVDS Output Data 7—True.  
Channel A and Channel B LVDS Output Data 7—Complement.  
Channel A and Channel B LVDS Output Data 8—True.  
Channel A and Channel B LVDS Output Data 8—Complement.  
Channel A and Channel B LVDS Output Data 9—True.  
Channel A and Channel B LVDS Output Data 9—Complement.  
Channel A and Channel B LVDS Output Data 10—True.  
Channel A and Channel B LVDS Output Data 10—Complement.  
Data Clock LVDS Output for Channel A and Channel B—True.  
Data Clock LVDS Output for Channel A and Channel B—Complement.  
Channel C and Channel D LVDS Output Data 0—True.  
Channel C and Channel D LVDS Output Data 0—Complement.  
Channel C and Channel D LVDS Output Data 1—True.  
Channel C and Channel D LVDS Output Data 1—Complement.  
Channel C and Channel D LVDS Output Data 2—True.  
Channel C and Channel D LVDS Output Data 2—Complement.  
Channel C and Channel D LVDS Output Data 3—True.  
Channel C and Channel D LVDS Output Data 3—Complement.  
Channel C and Channel D LVDS Output Data 4—True.  
Channel C and Channel D LVDS Output Data 4—Complement.  
Channel C and Channel D LVDS Output Data 5—True.  
Channel C and Channel D LVDS Output Data 5—Complement.  
Channel C and Channel D LVDS Output Data 6—True.  
Channel C and Channel D LVDS Output Data 6—Complement.  
Channel C and Channel D LVDS Output Data 7—True.  
Channel C and Channel D LVDS Output Data 7—Complement.  
Channel C and Channel D LVDS Output Data 8—True.  
Channel C and Channel D LVDS Output Data 8—Complement.  
Channel C and Channel D LVDS Output Data 9—True.  
Channel C and Channel D LVDS Output Data 9—Complement.  
Channel C and Channel D LVDS Output Data 10—True.  
Channel C and Channel D LVDS Output Data 10—Complement.  
Data Clock LVDS Output for Channel C and Channel D—True.  
Data Clock LVDS Output for Channel C and Channel D—Complement.  
Mode Select Pin. Logic low enables NSR; logic high disables NSR.  
Digital Synchronization Pin.  
K10  
J10  
M10  
L10  
K11  
J11  
M11  
L11  
K12  
J12  
M12  
L12  
K1  
J1  
M1  
L1  
K2  
J2  
M2  
L2  
K3  
J3  
M3  
L3  
K4  
J4  
M4  
L4  
K5  
J5  
M5  
L5  
K6  
J6  
M6  
L6  
C9  
C8  
SYNC  
Input  
C7  
PDWN  
Input  
Power-Down Input (Active High).  
C6  
SCLK  
Input  
SPI Clock.  
C5  
C4  
SDIO  
CSB  
Input/Output SPI
 
Data.  
Input SPI
 
Chip Select (Active Low).  
Rev. A | Page 13 of 36  

AD6657A  
Data Sheet  
TYPICAL PERFORMANCE CHARACTERISTICS  
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
s
ample rate = 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS, 32,000 sample, T

A

= 25°C,  
unless otherwise noted.  
0
–20  
–40  
0
–20  
–40  
185MSPS  
185MSPS  
10.3MHz @ –1dBFS  
SNR = 65.6dB (66.6dBFS)  
SFDR = 94.0dBc  
140.3MHz @ –1dBFS  
SNR = 65.4dB (66.4dBFS)  
SFDR = 90dBc  
–60  
–80  
–60  
–80  
SECOND HARMONIC  
THIRD HARMONIC  
THIRD HARMONIC  
SECOND HARMONIC  
–100  
–120  
–100  
–120  
0
0
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
0
0
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 5. Single Tone FFT, f

IN

= 10.3 MHz  
Figure 8. Single Tone FFT, f

IN

= 140.3 MHz  
0
–20  
–40  
0
–20  
–40  
185MSPS  
185MSPS  
50.3MHz @ –1dBFS  
SNR = 65.6dB (66.6dBFS)  
SFDR = 92.0dBc  
200.3MHz @ –1dBFS  
SNR = 64.9dB (65.9dBFS)  
SFDR = 84dBc  
–60  
–80  
–60  
–80  
THIRD HARMONIC  
SECOND HARMONIC  
SECOND HARMONIC  
THIRD HARMONIC  
–100  
–120  
–100  
–120  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 6. Single Tone FFT, f

IN

= 50.3 MHz  
Figure 9. Single Tone FFT, f

IN

= 200.3 MHz  
0
–20  
–40  
0
–20  
–40  
185MSPS  
185MSPS  
70.3MHz @ –1dBFS  
SNR = 65.5dB (66.5dBFS)  
SFDR = 88dBc  
230.3MHz @ –1dBFS  
SNR = 66.1dB (65.1dBFS)  
SFDR = 84dBc  
–60  
–80  
–60  
–80  
SECOND HARMONIC  
THIRD HARMONIC  
SECOND HARMONIC  
THIRD HARMONIC  
–100  
–120  
–100  
–120  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 7. Single Tone FFT, f

IN

= 70.3 MHz  
Figure 10. Single Tone FFT, f

IN

= 230.3 MHz  
Rev. A | Page 14 of 36  
 

Data Sheet  
AD6657A  
0
0
–20  
–40  
–60  
185MSPS  
230.3MHz @ –1dBFS  
NSR 33% BW MODE, TW = 17  
SNR = 70.8dB (72.5dBFS)  
SFDR = 93.7dBc  
185MSPS  
247.3MHz @ –1dBFS  
SNR = 66dB (65dBFS)  
SFDR = 83dBc  
–20  
–40  
–60  
SECOND HARMONIC  
THIRD HARMONIC  
SECOND HARMONIC  
THIRD HARMONIC  
–80  
–100  
–120  
–80  
–100  
–120  
–140  
0
0
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 11. Single Tone FFT, f

IN

= 247.3 MHz  
Figure 14. Single Tone FFT, f

IN

= 230.3 MHz, NSR Enabled  
in 33% BW Mode, Tuning Word = 17  
0
0
185MSPS  
185MSPS  
305.3MHz @ –1dBFS  
SNR = 64.9dB (65.9dBFS)  
SFDR = 80dBc  
230.3MHz @ –1dBFS  
NSR 36% BW MODE, TW = 14  
SNR = 70.3dB (71.3dBFS)  
SFDR = 93.4dBc  
–20  
–40  
–60  
–20  
–40  
–60  
THIRD HARMONIC  
THIRD HARMONIC  
–80  
–100  
–120  
SECOND HARMONIC  
–80  
–100  
–120  
–140  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 12. Single Tone FFT, f

IN

= 305.3 MHz  
Figure 15. Single Tone FFT, f

IN

= 230.3 MHz, NSR Enabled  
in 36% BW Mode, Tuning Word = 14  
0
–20  
–40  
–60  
100  
185MSPS  
140.3MHz @ –1dBFS  
NSR 22% BW MODE, TW = 28  
SNR = 73.4dB (74.9dBFS)  
SFDR = 91dBc  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
SFDR (dBFS)  
SNR (dBFS)  
THIRD HARMONIC  
SFDR (dBc)  
–80  
–100  
–120  
SNR (dBc)  
–140  
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
INPUT AMPLITUDE (dBFS)  
Figure 16. Single Tone SNR/SFDR vs. Input Amplitude (A

IN

),  
f

IN

= 70.3 MHz  
Figure 13. Single Tone FFT, f

IN

= 140.3 MHz, NSR Enabled  
in 22% BW Mode, Tuning Word = 28  
Rev. A | Page 15 of 36  

AD6657A  
Data Sheet  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
SFDR (dBFS)  
SFDR (dBc)  
SNR (dBFS)  
SFDR (dBc)  
SNR (dBFS)  
SNR (dBc)  
30.00 51.25 72.50 93.75
 
115.00 136.25 157.50 178.75 200.00  
SAMPLE RATE (MSPS)  
INPUT AMPLITUDE (dBFS)  
Figure 17. Single Tone SNR/SFDR vs. Input Amplitude (A

IN

),  
f

IN

= 140.3 MHz  
Figure 20. Single Tone SNR/SFDR vs. Sample Rate (f

S

),  
f

IN

= 70.3 MHz  
95  
95  
90  
SFDR (dBc)  
90  
85  
SFDR (dBc)  
85  
80  
75  
80  
75  
70  
65  
SNR (dBFS)  
70  
SNR (dBFS)  
60  
55  
65  
60  
50  
30.00 51.25 72.50 93.75
 
115.00 136.25 157.50 178.75 200.00  
SAMPLE RATE (MSPS)  
INPUT FREQUENCY (MHz)  
Figure 18. Single Tone SNR/SFDR vs. Input Frequency (f

IN

),  
1.75 V p-p Full Scale  
Figure 21. Single Tone SNR/SFDR vs. Sample Rate (f

S

),  
f

IN

= 140.3 MHz  
95  
0
185MSPS  
169.1MHz @ –7dBFS  
90  
172.1MHz @ –7dBFS  
SFDR = 88.5dBc  
–20  
SFDR (dBc)  
85  
80  
75  
70  
65  
60  
–40  
–60  
–80  
SNR (dBFS)  
–100  
–120  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
INPUT FREQUENCY (MHz)  
Figure 22. Two Tone FFT, f

IN1

= 169.1 MHz and f

IN2

= 172.1 MHz  
Figure 19. Single Tone SNR/SFDR vs. Input Frequency (f

IN

),  
2.0 V p-p Full Scale  
Rev. A | Page 16 of 36  

Data Sheet  
AD6657A  
0
–20  
–40  
–60  
0.20  
0.15  
0.10  
0.05  
0
SFDR (dBc)  
IMD3 (dBc)  
–0.05  
–80  
SFDR (dBFS)  
–0.10  
–0.15  
–0.20  
–100  
IMD3 (dBFS)  
–120  
–90  
–78  
–66  
–54  
–42  
–30  
–18  
–6  
N + 3  
2000  
0
500  
1000  
1500  
2000  
INPUT AMPLITUDE (dBFS)  
OUTPUT CODE  
Figure 23. Two Tone SFDR/IMD3 vs. Input Amplitude (A

IN

),  

IN1

= 169.1 MHz and f

IN2

= 172.1 MHz  
Figure 26. DNL, f

IN

= 30.3 MHz  
f
2,500,000  
2,000,000  
1,500,000  
1,000,000  
500,000  
0
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
N – 3  
N – 2  
N – 1  
N
N + 1  
N + 2  
30  
35  
40  
45  
50  
55  
60  
65  
70  
OUTPUT CODE  
DUTY CYCLE (%)  
Figure 24. Grounded Input Histogram  
Figure 27. SNR vs. Duty Cycle, f

IN

= 10.3 MHz  
1.0  
0.8  
0.6  
0.4  
0.2  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
0
500  
1000  
1500  
OUTPUT CODE  
Figure 25. INL, f

IN

= 30.3 MHz  
Rev. A | Page 17 of 36  

AD6657A  
Data Sheet  
EQUIVALENT CIRCUITS  
AVDD  
350
Ω  
30k
Ω  
SCLK  
OR  
PDWN  
VIN  
Figure 28. Equivalent Analog Input Circuit  
Figure 32. Equivalent SCLK and PDWN Input Circuit  
AVDD  
AVDD  
30
kΩ  
350
Ω  
AVDD  
AVDD  
0.9V  
CSB  
OR  
MODE  
15kΩ  
15kΩ  
CLK+  
CLK–  
Figure 29. Equivalent Clock Input Circuit  
Figure 33. Equivalent CSB and MODE Input Circuit  
DRVDD  
DRVDD  
V+  
V–  
DATAOUT–  
V–  
DATAOUT+  
V+  
350Ω  
SDIO  
30kΩ  
Figure 30. Equivalent LVDS Output Circuit  
Figure 34. Equivalent SDIO Circuit  
AVDD  
AVDD  
SYNC  
0.9V  
16kΩ  
0.9V  
Figure 31. Equivalent SYNC Input Circuit  
Rev. A | Page 18 of 36  
 

Data Sheet  
AD6657A  
THEORY OF OPERATION  
A small resistor in series with each input can help reduce the  
ADC ARCHITECTURE  
peak transient current required from the output stage of the  
driving source. A shunt capacitor can be placed across the  
inputs to provide dynamic charging currents. This passive  
network creates a low-pass filter at the ADC input; therefore,  
the precise values are dependent on the application.  
The

architecture consists of a quad front-end sample-  
and-hold circuit, followed by a pipelined, switched capacitor  
ADC. The quantized outputs from each stage are combined into  
a final 14-bit result in the digital correction logic. Alternately,  
the 14-bit result can be processed through the NSR block before  
it is sent to the digital correction logic.  
In intermediate frequency (IF) undersampling applications,  
any shunt capacitors should be reduced. In combination with  
the driving source impedance, the shunt capacitors limit the  
input bandwidth. For more information on this subject, see the  

AN-742 Application Note

Frequency Domain Response of  
Switched-Capacitor ADCs

A Resonant  
Approach to Interfacing Amplifiers to Switched-Capacitor ADCs
;  
and the
Analog Dialogue
article, “Transformer-Coupled Front-End  
for Wideband A/D Converters” (s

The pipelined architecture permits the first stage to operate on  
a new input sample and the remaining stages to operate on the  
preceding samples. Sampling occurs on the rising edge of the clock.  
Each stage of the pipeline, excluding the last, consists of a low  
resolution flash ADC connected to a switched-capacitor digital-  
to-analog converter (DAC) and an interstage residue amplifier  
(MDAC). The residue amplifier magnifies the difference between  
the reconstructed DAC output and the flash input for the next  
stage in the pipeline. One bit of redundancy is used in each stage  
to facilitate digital correction of flash errors. The last stage  
simply consists of a flash ADC.  
BIAS  
S
S
C
FB  
C
C
S
The input stage of each channel contains a differential sampling  
circuit that can be ac- or dc-coupled in differential or single-ended  
modes. The output staging block aligns the data, corrects errors,  
and passes the data to the output buffers. The output buffers are  
powered from a separate supply, allowing adjustment of the output  
drive current. During power-down, the output buffers go into a  
high impedance state.  
VIN+  
VIN–  
C
PAR1  
C
C
PAR2  
S
H
S
S
S
C
FB  
C
PAR1  
PAR2  
S
BIAS  
The

quad IF receiver can simultaneously digitize four  
channels, making it ideal for diversity reception and digital pre-  
distortion (DPD) observation paths in telecommunication systems.  
Figure 35. Switched Capacitor Input  
For best dynamic performance, match the source impedances  
driving the VIN+ and VIN− pins.  
Synchronization capability is provided to allow synchronized  
timing between multiple channels or multiple devices.  
An internal differential reference buffer creates positive and  
negative reference voltages that define the input div of the ADC  
Programming and control of the

are accomplished  
using a 3-wire SPI-compatible serial interface.  
core. The div of the ADC core is set by this buffer to 2 × V

REF  

.
Input Common Mode  
ANALOG INPUT CONSIDERATIONS  
The analog inputs of the

are not internally dc biased.  
In ac-coupled applications, the user must provide this bias  
externally. An on-board common-mode voltage reference is  
included in the design and is available from the VCMx pins.  
Optimum performance is achieved when the common-mode  
voltage of the analog input is set by the VCMx pin voltage  
(typically 0.5 ×
A
V
DD). The VCMx pins must be decoupled  
to ground by a 0.1 µF capacitor.  
The analog input to the

is a differential switched  
capacitor circuit that has been designed for optimum perfor-  
mance while processing a differential input signal.  
The clock signal alternatively switches the input between sample  
mode and hold mode (see

. When the input is switched  
to sample mode, the signal source must be capable of charging  
the sample capacitors and settling within 1/2 of a clock cycle.  
Rev. A | Page 19 of 36  
 
 
 
 

AD6657A  
Data Sheet  
Differential Input Configurations  
The signal characteristics must be considered when selecting  
a transformer. Most RF transformers saturate at frequencies  
below a few megahertz (MHz). Excessive signal power can also  
cause core saturation, which leads to distortion.  
Optimum performance is achieved when driving the

in a differential input configuration. For baseband applications,  
the

and

differential drivers  
provide excellent performance and a flexible interface to the ADC.  
At input frequencies in the second Nyquist zone and above, the  
noise performance of most amplifiers is not adequate to achieve  
the true SNR performance of the

For applications in  
which SNR is a key parameter, differential double balun coupling  
is the recommended input configuration (s

. In this  
configuration, the input is ac-coupled and the CML is provided to  
each input through a 33 Ω resistor. These resistors compensate  
for losses in the input baluns to provide a 50 Ω impedance to  
the driver.  
The output common-mode voltage of the

is easily  
set with the VCMx pin of the

(s

, and the  
driver can be configured in a Sallen-Key filter topology to provide  
band limiting of the input signal.  
15pF  
200Ω  
33Ω  
5pF  
15Ω  
15Ω  
90Ω  
VIN–  
VIN+  
AVDD  
ADC  
VCM  
76.8Ω  
VIN  
In the double balun and transformer configurations, the value  
of the input capacitors and resistors is dependent on the input  
frequency and source impedance and may need to be reduced  
or removed.

lists recommended values to set the RC  
network. At higher input frequencies, good performance can be  
achieved by using a ferrite bead in series with a resistor and  
removing the capacitors. However, these values are dependent  
on the input signal and should be used as a starting guide only.  
ADA4938-2  
0.1µF  
33Ω  
120Ω  
15pF  
200Ω  
Figure 36. Differential Input Configuration Using th

For baseband applications where SNR is a key parameter,  
differential transformer coupling is the recommended input  
configuration. An example is shown i

T
o
b
ias the  
analog input, the VCM voltage can be connected to the center  
tap of the secondary winding of the transformer.  
Table 10. Example RC Network  
Frequency  
Range  
(MHz)  
R1 Series  
(Each)  
R2 Series
 
C2 Shunt  
C2  
C1 Differential
 
(Each)  
(Each)  
R2  
0 to 100  
100 to 200  
100 to 300  
33 Ω  
10 Ω  
10 Ω

5 pF  
5 pF  
Remove  
15 Ω  
10 Ω  
66 Ω  
15 pF  
10 pF  
Remove  
VIN+  
R1  
2V p-p  
49.9Ω  
C1  
R1  
ADC  
VCM  
R2  

1

In this configuration, R1 is a ferrite bead with a value of 10 Ω @ 100 MHz.  
VIN–  
An alternative to using a transformer-coupled input at frequen-  
cies in the second Nyquist zone is to use the

differential  
driver (see

For more information, see the

data sheet.  
0.1µF  
C2  
Figure 37. Differential Transformer-Coupled Configuration  
C2  
0.1µF  
0.1µF  
0.1µF  
R1  
R2  
VIN+  
2V p-p  
33Ω  
33Ω  
P
S
S
P
C1  
R1  
ADC  
A
0.1µF  
R2  
VCM  
VIN–  
C2  
Figure 38. Differential Double Balun Input Configuration  
V
CC  
0.1µF  
0.1µF  
0Ω  
16  
1
8, 13  
11  
0.1µF  
0.1µF  
ANALOG INPUT  
R
R
VIN+  
200Ω  
2
C
ADC  
C
D
R
R
D
G
AD8352  
10  
3
4
5
200Ω  
VCM  
VIN–  
14  
0.1µF  
ANALOG INPUT  
0Ω  
0.1µF  
0.1µF  
Figure 39. Differential Input Configuration Using th

Rev. A | Page 20 of 36  
 
 
 
 
 
 

Data Sheet  
AD6657A  
ANALOG  
INPUT  
XFMR 1:4 Z  
ETC4-1T-7  
33Ω  
33Ω  
0.1µF  
0.1µF  
121Ω  
121Ω  
431nH  
3.0kΩ  
0.1µF  
0.1µF  
INPUT  
Z = 50Ω  
3.0pF  
ADC  
INTERNAL  
INPUT Z  
0.1µF  
VCM  
Figure 40. 1:4 Transformer Passive Configuration  
1000pF 180nH
 
220nH  
1µH  
1µH  
15pF  
165Ω  
VPOS  
AD6657A  
AD8376  
301Ω  
5.1pF  
3.9pF  
165Ω  
VCM  
1nF  
3.0kΩ║3.0pF  
1nF  
68nH  
180nH 220nH  
1000pF  
NOTES  
1. ALL INDUCTORS ARE COILCRAFT 0603CS COMPONENTS  
WITH THE EXCEPTION OF THE 1µH CHOKE INDU
C
T
ORS (0603LS).  
Figure 41. Active Front-End Configuration Using th

Figure 43

and

show two preferred methods for clocking  
the

(at clock rates of up to 625 MHz). A low jitter clock  
source is converted from a single-ended signal to a differential  
signal using either an RF balun or an RF transformer.  
For the popular IF band of 140 MHz,

shows an  
example of a 1:4 transformer passive configuration where a  
differential inductor is used to resonate with the internal input  
capacitance of th

This configuration realizes excellent  
noise and distortion performance.

shows an example  
of an active front-end configuration using the

dual vari-  
able gain amplifier (VGA). This configuration is recommended  
when signal gain is required.  
The RF balun configuration is recommended for clock frequencies  
between 125 MHz and 625 MHz, and the RF transformer config-  
uration is recommended for clock frequencies from 10 MHz to  
200 MHz. The back-to-back Schottky diodes across the trans-  
former/balun secondary limit clock excursions into the

to approximately 0.8 V p-p differential. This limit helps to prevent  
the large voltage swings of the clock from feeding through to  
other portions of the

yet preserves the fast rise and  
fall times of the signal that are critical to a low jitter performance.  
CLOCK INPUT CONSIDERATIONS  
For optimum performance, clock the

sample clock  
inputs, CLK+ and CLK−, with a differential signal. The signal is  
typically ac-coupled into the CLK+ and CLK− pins via a trans-  
former or capacitors. These pins are biased internally and require  
no external bias (see

ADT1-1WT, 1:1Z  
AVDD  
0.1µF  
0.1µF  
XFMR  
CLOCK  
INPUT  
CLK+  
ADC  
100Ω  
50Ω  
1.2V  
0.1µF  
CLK–  
CLK+  
CLK–  
SCHOTTKY  
DIODES:  
HSMS2822  
0.1µF  
2pF  
2pF  
Figure 43. Transformer-Coupled Differential Clock (Up to 200 MHz)  
Figure 42. Equivalent Clock Input Circuit  
1nF  
50Ω  
1nF  
0.1µF  
0.1µF  
CLOCK  
INPUT  
CLK+  
ADC  
CLK–  
Clock Input Options  
The

has a very flexible clock input structure. The  
clock input can be a CMOS, LVDS, LVPECL, or sine wave signal.  
Regardless of the type of signal being used, clock source jitter is  
of the most concern (see th

section).  
SCHOTTKY  
DIODES:  
HSMS2822  
Figure 44. Balun-Coupled Differential Clock (Up to 625 MHz)  
Rev. A | Page 21 of 36  
 
 
 
 
 
 

AD6657A  
Data Sheet  
CLK+ can be driven directly from a CMOS gate. Although  
If a low jitter clock source is not available, another option is to  
ac couple a differential PECL signal to the sample clock input  

AD9513

ck drivers offer excellent  
jitter performance.  
the CLK+ input circuit supply is
A
V
DD (1.8 V), this input is  
designed to withstand input voltages of up to 3.6
V
,
m
aking the  
selection of the drive logic voltage very flexible (see

V
CC  
1k
Ω  
1k
Ω  
OPTIONAL  
100
Ω  
0.1µF  
0.1µF  
0.1µF  
1
AD951x  
CMOS DRIVER  
CLOCK  
INPUT  
CLK+  
ADC  
CLK–  
0.1µF  
0.1µF  
50
Ω  
CLOCK  
INPUT  
CLK+  
ADC  
CLK–  
AD951x  
100
Ω
 
PECL DRIVER  
0.1µF  
0.1µF  
CLOCK  
INPUT  
1
50
Ω
RESISTOR IS OPTIONAL.  
240
Ω  
240
Ω  
50k
Ω  
50k
Ω  
Figure 48. Single-Ended 3.3 V CMOS Input Clock (Up to 200 MHz)  
Figure 45. Differential PECL Sample Clock (Up to 625 MHz)  
Input Clock Divider  

The

ontains an input clock divider with the ability to  
divide the input clock by integer values from 1 to 8.  
A third option is to ac couple a differential LVDS signal to the  
sample clock input pins, as shown in

The

drivers offer excellent jitter performance.  

The

ck divider can be synchronized using the  
external SYNC input. Bit 1 of Register 0x3A enables the clock  
divider to be resynchronized on every SYNC signal. A valid  
SYNC causes the clock divider to reset to its initial state. This  
synchronization feature allows multiple parts to have their clock  
dividers aligned to guarantee simultaneous input sampling.  
0.1µF  
0.1µF  
CLOCK  
INPUT  
CLK+  
ADC  
CLK–  
AD951x  
LVDS DRIVER  
100
Ω
 
0.1µF  
0.1µF  
CLOCK  
INPUT  
Clock Duty Cycle  
50k
Ω  
50k
Ω  
Typical high speed ADCs use both clock edges to generate  
a variety of internal timing signals and, as a result, may be  
sensitive to clock duty cycle. Commonly, a
 
5% tolerance is  
required on the clock duty cycle to maintain dynamic perfor-  
mance characteristics.  
Figure 46. Differential LVDS Sample Clock (Up to 625 MHz)  
In some applications, it may be acceptable to drive the sample  
clock inputs with a single-ended CMOS signal. In such applica-  
tions, drive the CLK+ pin directly from a CMOS gate, and  
bypass the CLK− pin to ground with a 0.1 μF capacitor in  
parallel with a 39 kΩ resistor (s

The

ontains a DCS that retimes the nonsampling  
(falling) edge, providing an internal clock signal with a nominal  
50% duty cycle. This allows the user to provide a wide range of  
clock input duty cycles without affecting the performance of the  

AD6657A

Noise and distortion performance are nearly flat for  
a wide range of duty cycles with the DCS enabled.  
V
CC  
OPTIONAL  
100
Ω  
0.1µF  
1
0.1µF  
1k
Ω  
1k
Ω  
AD951x  
CMOS DRIVER  
CLOCK  
INPUT  
CLK+  
ADC  
CLK–  
50
Ω  
Jitter in the rising edge of the input is of paramount concern and  
is not easily reduced by the internal stabilization circuit. The duty  
cycle control loop does not function for clock rates at less than  
40 MHz nominally. The loop has a time constant associated with  
it that must be considered in applications in which the clock  
rate can change dynamically. A wait time of 1.5 ꢀs to 5 ꢀs is  
required after a dynamic clock frequency increase or decrease  
before the DCS loop is relocked to the input signal. During the  
time period that the loop is not locked, the DCS loop is bypassed,  
and internal device timing is dependent on the duty cycle of the  
input clock signal.  
0.1µF  
39k
Ω  
1
50
Ω
RESISTOR IS OPTIONAL.  
Figure 47. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)  
Rev. A | Page 22 of 36  
 
 
 
 

Data Sheet  
AD6657A  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.60  
Jitter Considerations  
0.55  
High speed, high resolution ADCs are sensitive to the quality of  
the clock input. The degradation in SNR from the low frequency  
SNR (SNR

LF

) at a given input frequency (f

IN

) due to jitter (t

JRMS  

can be calculated by  
0.50  
I
AVDD  
0.45  
0.40  
)
0.9  
0.8  
0.7  
0.6  
0.5  
TOTAL POWER  
0.35  
0.30  
SNR

HF

= −10log[(2π ×
f

IN

×
t

JRMS

) +
 
10

(−SNR  

]
2
/10)  
LF  
0.25  
0.20  
In the equation, the rms aperture jitter represents the clock  
input jitter specification. IF undersampling applications are  
particularly sensitive to jitter, as shown in

80  
0.4  
0.3  
0.15  
I
DRVDD  
0.10  
0.05  
0
0.2  
0.1  
0
0.05ps  
30 40 50 60 70 80 90
 
10
0
1
1
0
1
2
0
1
3
0
1
4
0
1
5
0
1
6
0
1
7
0
1
8
0
1
90 200  
75  
SAMPLING FREQUENCY (MSPS)  
Figure 50. Power and Current vs. Sampling Frequency  
70  
0.20ps  
By asserting PDWN (either through the SPI port or by asserting  
the PDWN pin high), the

is placed in power-down  
mode. In this state, the ADC typically dissipates 4.5 m
W
.  
During power-down, the output drivers are placed in a high  
impedance state. Asserting the PDWN pin low returns the  

AD6657A

to its normal operating mode. Note that PDWN is  
referenced to the digital output driver supply (DRVDD) and  
should not exceed that supply voltage.  
65  
0.50ps  
60  
55  
50  
1.00ps  
1.50ps  
1
10  
100  
1k  
INPUT FREQUENCY (MHz)  
Low power dissipation in power-down mode is achieved by  
shutting down the reference, reference buffer, biasing networks,  
and clock. Internal capacitors are discharged when entering  
power-down mode and must be recharged when returning to  
normal operation. As a result, wake-up time is related to the  
time spent in power-down mode; shorter power-down cycles  
result in proportionally shorter wake-up times.  
Figure 49. SNR vs. Input Frequency and Jitter  
In cases where aperture jitter may affect the dynamic range of  
the

treat the clock input as an analog signal. Separate  
power supplies for clock drivers should be separated from the  
ADC output driver supplies to avoid modulating the clock signal  
with digital noise. Low jitter, crystal controlled oscillators make  
the best clock sources. If the clock is generated from another type  
of source (by gating, dividing, or another method), it should be  
retimed by the original clock at the last step. Refer to the

tion about jitter performance as it relates to ADCs (available at  
When using the SPI port interface, the user can place the ADC  
in power-down mode or standby mode. Standby mode allows  
the user to keep the internal reference circuitry powered when  
faster wake-up times are required. See th

Descriptions

section for more details.  
CHANNEL/CHIP SYNCHRONIZATION  
POWER DISSIPATION AND STANDBY MODE  
The

has a SYNC input that offers the user flexible  
synchronization options for synchronizing the clock divider. The  
clock divider sync feature is useful for guaranteeing synchronized  
sample clocks across multiple ADCs.  
The power dissipated by the

is proportional to its clock  
rate (s

. The digital power dissipation does not vary  
significantly because it is determined primarily by the DRVDD  
supply and the bias current of the LVDS drivers.  
The SYNC input is internally synchronized to the sample clock;  
however, to ensure that there is no timing uncertainty between  
multiple parts, externally synchronize the SYNC input signal to  
the input clock signal, meeting the setup and hold times shown  
i

rive the SYNC input using a single-ended CMOS  
type signal.  
Reducing the capacitive load presented to the output drivers can  
minimize digital power consumption. The data in

was  
obtained using the same operating conditions as those used in  
the

section, with a 5 pF  
load on each output driver.  
Rev. A | Page 23 of 36  
 
 
 
 
 

AD6657A  
Data Sheet  
Minimize the length of the output data lines and minimize the  
loads placed on them to reduce transients within th

because these transients can degrade converter dynamic per-  
formance.  
DIGITAL OUTPUTS  
The

output drivers are configured to interface with  
LVDS outputs using a DRVDD supply voltage of 1.8
V
.
T
he  
output bits are DDR LVDS as shown in

Applications  
that require the ADC to drive large capacitive loads or large  
fanouts may require external buffers or latches.  
The lowest typical conversion rate of th

is 40 MSPS.  
At clock rates below 40 MSPS, dynamic performance can degrade.  
Data Clock Output (DCO)  
As described in the

,
Interfacing to  
High Speed ADCs via SPI
, the data format can be selected for  
offset binary or twos complement when using the SPI control.  
The

provides a data clock output (DCO) signal  
intended for capturing the data in an external register. The  
output data for Channel A and Channel C is valid when DCO  
is high; the output data for Channel B and Channel D is valid  
when DCO is low (see

TIMING  
The

provides latched data with a latency of  
nine clock cycles. Data outputs are available one propagation  
delay (t

PD

) after the rising edge of the clock signal.  
Table 11. Output Data Format  
Input (V)  
Condition (V)  
< −V

REF

− 0.5 LSB  
= −V

REF  

Offset Binary Output Mode  
Twos Complement Mode  
100 0000 0000  
100 0000 0000  
000 0000 0000  
011 1111 1111  
VIN+ − VIN−  
VIN+ − VIN−  
VIN+ − VIN−  
VIN+ − VIN−  
VIN+ − VIN−  
000 0000 0000  
000 0000 0000  
100 0000 0000  
111 1111 1111  
111 1111 1111  
= 0  
= +V

REF

− 1.0 LSB  
> +V

REF

− 0.5 LSB  
011 1111 1111  
Rev. A | Page 24 of 36  
 
 

Data Sheet  
AD6657A  
NOISE SHAPING REQUANTIZER  
The

features a noise shaping requantizer (NSR) to allow  
higher than an 11-bit SNR to be maintained in a subset of the  
Nyquist band. The harmonic performance of the receiver is  
unaffected by the NSR feature.  

Figure 51

t

show the typical spectrum that can be  
expected from th

in the 22% BW mode for three  
different tuning words.  
0
185MSPS  
140.3MHz @ –1dBFS  
When enabled, the NSR contributes an additional 0.6 dB of  
loss to the input signal, such that a 0 dBFS input is reduced to  
−0.6 dBFS at the output pins.  
NSR 22% BW MODE, TW = 13  
SNR = 73.4dB (75.0dBFS)  
SFDR = 91dBc  
–20  
–40  
–60  
The NSR feature can be independently controlled per channel  
via the SPI or via the MODE pin.  
THIRD HARMONIC  
–80  
–100  
–120  
Two different bandwidth modes are provided; the mode can be  
selected from the SPI port. In each of the two modes, the center  
frequency of the band can be tuned such that IFs can be placed  
anywhere in the Nyquist band.  
22% BW MODE (>40 MHz at 184.32 MSPS)  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
The first bandwidth mode offers excellent noise performance  
over 22% of the ADC sample rate (44% of the Nyquist band)  
and can be centered by setting the NSR mode bits in the NSR  
control register (Address 0x3C) to 000. In this mode, the useful  
frequency range can be set using the 6-bit tuning word in the  
NSR tuning word register (Address 0x3E).  
Figure 51. 22% BW Mode, Tuning Word = 13  
0
–20  
–40  
–60  
185MSPS  
140.3MHz @ –1dBFS  
NSR 22% BW MODE, TW = 28  
SNR = 73.4dB (75.0dBFS)  
SFDR = 91dBc  
There are 57 possible tuning words (TW); each step is 0.5% of  
the ADC sample rate. The following three equations describe  
the left band edge (f

0

), the channel center (f

CENTER

), and the right  
band edge (f

1

), respectively.  
THIRD HARMONIC  
–80  
–100  
–120  
f

0

=
f

ADC

× .005 ×
TW  
f

CENTER

=
f

0

+ 0.11 ×
f

ADC  

f

1

=
f

0

+ 0.22 ×
f

ADC  

–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 52. 22% BW Mode, Tuning Word = 28 (f

S

/4 Tuning)  
0
185MSPS  
140.3MHz @ –1dBFS  
NSR 22% BW MODE, TW = 41  
SNR = 73.4dB (75.0dBFS)  
SFDR = 91dBc  
–20  
–40  
–60  
THIRD HARMONIC  
–80  
–100  
–120  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 53. 22% BW Mode, Tuning Word = 41  
Rev. A | Page 25 of 36  
 
 
 
 

AD6657A  
Data Sheet  
0
–20  
–40  
–60  
33% BW MODE (>60 MHz AT 184.32 MSPS)  
185MSPS  
140.3MHz @ –1dBFS  
NSR 33% BW MODE, TW = 17  
SNR = 70.9dB (72.5dBFS)  
SFDR = 91dBc  
The second bandwidth mode offers excellent noise performance  
over 33% of the ADC sample rate (66% of the Nyquist band)  
and can be centered by setting the NSR mode bits in the NSR  
control register (Address 0x3C) to 001. In this mode, the useful  
frequency range can be set using the 6-bit tuning word in the  
NSR tuning word register (Address 0x3E).  
THIRD HARMONIC  
–80  
–100  
–120  
There are 34 possible tuning words (TW); each step is 0.5% of  
the ADC sample rate. The following three equations describe  
the left band edge (f

0

), the channel center (f

CENTER

), and the right  
band edge (f

1

), respectively.  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
f

0

=
f

ADC

× .005 ×
TW  
f

CENTER

=
f

0

+ 0.165 ×
f

ADC  

Figure 56. 33% BW Mode, Tuning Word = 17  
f

1

=
f

0

+ 0.33 ×
f

ADC  

Figure 54

t

show the typical spectrum that can be  
expected from th

in the 33% BW mode for three  
different tuning words.  
0
185MSPS  
140.3MHz @ –1dBFS  
NSR 33% BW MODE, TW = 5  
SNR = 70.9dB (72.5dBFS)  
SFDR = 91dBc  
–20  
–40  
–60  
THIRD HARMONIC  
–80  
–100  
–120  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 54. 33% BW Mode, Tuning Word = 5  
0
–20  
–40  
–60  
185MSPS  
140.3MHz @ –1dBFS  
NSR 33% BW MODE, TW = 17  
SNR = 71.1dB (72.7dBFS)  
SFDR = 91dBc  
THIRD HARMONIC  
–80  
–100  
–120  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 55. 33% BW Mode, Tuning Word = 17 (f

S

/4 Tuning)  
Rev. A | Page 26 of 36  
 
 
 

Data Sheet  
AD6657A  
0
–20  
–40  
–60  
36% BW MODE (>65 MHz AT 184.32 MSPS)  
185MSPS  
140.3MHz @ –1dBFS  
NSR 36% BW MODE, TW = 28  
SNR = 70.4dB (72.0dBFS)  
SFDR = 91dBc  
The third bandwidth mode offers excellent noise performance  
over 36% of the ADC sample rate (72% of the Nyquist band)  
and can be centered by setting the NSR mode bits in the NSR  
control register (Address 0x3C) to 010. In this mode, the useful  
frequency range can be set using the 6-bit tuning word in the  
NSR tuning register (Address 0x3E).  
THIRD HARMONIC  
–80  
–100  
–120  
There are 28 possible tuning words (TW); each step is 0.5% of  
the ADC sample rate. The following three equations describe  
the left band edge (f

0

), the channel center (f

CENTER

), and the right  
band edge (f

1

), respectively.  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
f

0

=
f

ADC

× .005 ×
TW  
f

CENTER

=
f

0

+ 0.18 ×
f

ADC  

Figure 59. 36% BW Mode, Tuning Word = 28  
f

1

=
f

0

+ 0.36 ×
f

ADC  

MODE PIN  

Figure 57

t

show the typical spectrum that can be  
expected from th

in the 36% BW mode for three  
different tuning words.  
The MODE pin input allows convenient control of the NSR  
feature. A logic low enables NSR mode and a logic high sets the  
receiver to a straight 11-bit mode with NSR disabled. By default,  
the MODE pin is pulled high internally to disable the NSR.  
0
185MSPS  
140.3MHz @ –1dBFS  
NSR 36% BW MODE, TW = 0  
SNR = 70.4dB (72.0dBFS)  
SFDR = 91dBc  
–20  
–40  
–60  
Each channel can be individually configured to ignore the  
MODE pin state by writing to Bit 4 of the NSR control register  
at Address 0x3C. Use of the NSR control register in conjunction  
with the MODE pin allows for very flexible control of the NSR  
feature on a per channel basis.  
THIRD HARMONIC  
–80  
–100  
–120  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 57. 36% BW Mode, Tuning Word = 0  
0
–20  
–40  
–60  
185MSPS  
140.3MHz @ –1dBFS  
NSR 36% BW MODE, TW = 14  
SNR = 70.4dB (72.0dBFS)  
SFDR = 91dBc  
THIRD HARMONIC  
–80  
–100  
–120  
–140  
0
9.25 18.50
 
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50  
FREQUENCY (MHz)  
Figure 58. 36% BW Mode, Tuning Word = 14 (f

S

/4 Tuning)  
Rev. A | Page 27 of 36  
 
 
 
 

AD6657A  
Data Sheet  
BUILT-IN SELF TEST (BIST) AND OUTPUT TEST  
The

includes built-in test features designed to verify  
the integrity of each channel and to facilitate board-level debug-  
ging. A built-in self test (BIST) feature is included that verifies  
the integrity of the digital datapath of the

arious  
output test options are also provided to place predictable values  
on the outputs of the

The outputs are not disconnected during this test, so the PN  
sequence can be observed as it runs. The PN sequence can be  
continued from its last value or reset from the beginning, based  
on the value programmed in Register 0x0E, Bit 2. The BIST  
signature result varies based on the channel configuration.  
OUTPUT TEST MODES  
BIST  
The output test options are shown in

When an output  
test mode is enabled, the analog section of the receiver is dis-  
connected from the digital back-end blocks, and the test pattern  
is run through the output formatting block. Some of the test  
patterns are subject to output formatting. The seed value for the  
PN sequence tests can be forced if the PN reset bits are used to  
hold the generator in reset mode by setting Bit 4 or Bit 5 of  
Register 0x0D. These tests can be performed with or without an  
analog signal (if present, the analog signal is ignored), but they  
require an encode clock. For more information, see the

Application Note

Interfacing to High Speed ADCs via SPI
.  
The BIST is a thorough test of the digital portion of the selected  

AD6657A

signal path. When enabled, the test runs from an  
internal pseudorandom noise (PN) source through the digital  
datapath starting at the ADC block output. The BIST sequence  
runs for 512 cycles and stops. The BIST signature value for the  
selected channel is written to Register 0x24 and Register 0x25.  
If more than one channel is BIST enabled, the channel that  
is first according to alphabetical order is written to the BIST  
signature registers. For example, if Channel B and Channel C  
are BIST enabled, the results from Channel B are written to the  
BIST signature registers.  
Rev. A | Page 28 of 36  
 
 
 

Data Sheet  
AD6657A  
SERIAL PORT INTERFACE (SPI)  
The

serial port interface (SPI) allows the user to con-  
figure the receiver for specific functions or operations through a  
structured internal register space. The SPI provides added flexibility  
and customization, depending on the application. Addresses are  
accessed via the serial port and can be written to or read from  
via the port. Memory is organized into bytes that can be further  
divided into fields, which are documented in the

section. For detailed operational information, see the

Application Note

Interfacing to High Speed ADCs via SPI
.  
During an instruction phase, a 16-bit instruction is transmitted.  
The first bit of the first byte in a serial data transfer frame indicates  
whether a read command or a write command is issued. Data  
follows the instruction phase, and its length is determined by  
the W0 and W1 bits. All data is composed of 8-bit words.  
The instruction phase determines whether the serial frame is a  
read or write operation, allowing the serial port to be used both  
to program the chip and to read the contents of the on-chip  
memory. If the instruction is a read operation, the serial data  
input/output (SDIO) pin changes direction from an input to an  
output at the appropriate point in the serial frame.  
CONFIGURATION USING THE SPI  
Three pins define the SPI of th

CLK, SDIO, and  
CSB (s

. SCLK (a serial clock) is used to synchronize  
the read and write data presented from and to the

SDIO (serial data input/output) is a bidirectional pin that allows  
data to be sent to and read from the internal memory map  
registers. CSB (chip select bar) is an active low control that  
enables or disables the read and write cycles.  
Data can be sent in MSB first mode or in LSB first mode. MSB  
first is the default mode on power-up and can be changed via  
the SPI port configuration register. For more information about  
this and other features, see the

Inter-  
facing to High Speed ADCs via SPI
.  
HARDWARE INTERFACE  
Table 12. Serial Port Interface Pins  
The pins described in

constitute the physical interface  
between the user
’
s programming device and the serial port of  
the

The SCLK pin and the CSB pin function as  
inputs when using the SPI interface. The SDIO pin is  
bidirectional, functioning as an input during the write phase  
and as an output during readback.  
Pin  
Function  
SCLK  
Serial clock. Serial shift clock input. SCLK is used to  
synchronize serial interface reads and writes.  
SDIO  
CSB  
Serial data input/output. Bidirectional pin that serves  
as an input or an output, depending on the instruction  
being sent and the relative position in the timing frame.  
Chip select bar (active low). This control gates the read  
and write cycles.  
The SPI interface is flexible enough to be controlled by either  
FPGAs or microcontrollers. One method for SPI configuration  
is described in detail in

Micro-  
controller-Based Serial Port Interface (SPI) Boot Circuit
.  
The falling edge of the CSB pin, in conjunction with the rising  
edge of the SCLK pin, determines the start of the framing. An  
example of the serial timing can be found in

(for  
symbol definitions, see

The SPI port should not be active during periods when the full  
dynamic performance of the

is required. Because the  
SCLK signal, the CSB signal, and the SDIO signal are typically  
asynchronous to the ADC clock, noise from these signals can  
degrade

performance. If the on-board SPI bus is used  
for other devices, it may be necessary to provide buffers between  
this bus and the

to prevent these signals from transi-  
tioning at the receiver inputs during critical sampling periods.  
CSB can be held low indefinitely, which permanently enables  
the device; this is called streaming. CSB can stall high between  
bytes to allow for additional external timing. When CSB is tied  
high, SPI functions are placed in high impedance mode.  
t

H  

t

DS  

t

HIGH  

t

CLK  

t

S  

t

DH  

t

LOW  

CSB  
SCLK  
SDIO  
DON’T  
CARE  
DON’T CARE  
DON’T  
CARE  
R/W  
W1  
W0  
A12  
A11  
A10  
A9  
A8  
A7  
D5  
D4  
D3  
D2  
D1  
D0  
DON’T CARE  
Figure 60. Serial Port Interface Timing Diagram  
Rev. A | Page 29 of 36  
 
 
 
 
 

AD6657A  
Data Sheet  
MEMORY MAP  
Logic Levels  
An explanation of logic level terminology follows:  
READING THE MEMORY MAP REGISTER TABLE  
Each row in the memory map register table has eight bit loca-  
tions (see

. The memory map is roughly divided into  
four sections: the chip configuration registers (Address 0x00  
and Address 0x01); the channel index and transfer registers  
(Address 0x05 and Address 0xFF); the ADC function registers,  
including setup, control, and test (Address 0x08 to Address 0x25);  
and the digital feature control registers (Address 0x3A to  
Address 0x3E).  
•
“Bit is set” is synonymous with “bit is set to Logic 1” or  
“writing Logic 1 for the bit
.
”  
•
“Clear a bit” is synonymous with “bit is set to Logic 0” or  
“writing Logic 0 for the bit
.
”  
Transfer Register Map  
Address 0x08 to Address 0x3E are shadowed. Writes to these  
addresses do not affect part operation until a transfer command  
is issued by writing 0x01 to Address 0xF
F
,
t
hereby setting the  
transfer bit. This allows these registers to be updated internally  
and simultaneously when the transfer bit is set. The transfer bit  
is autoclearing.  
The memory map register table (s

provides the  
default hexadecimal value for each hexadecimal address shown.  
The column with the heading (MSB) Bit 7 is the start of the  
default hexadecimal value given. The

Interfacing to High Speed ADCs via SPI
, documents the functions  
controlled by Register 0x00 to Register 0xF
F
.
T
he remaining  
registers, Register 0x3A to Register 0x3E, are documented in  
Channel Specific Registers  
Some channel setup functions, such as the NSR control func-  
tion, can be programmed differently for each channel. In these  
cases, channel address locations are internally duplicated for  
each channel. These registers and bits are designated in

as local. Local registers and bits can be accessed by setting the  
appropriate channel bits in Register 0x05.  
Open Locations  
All address and bit locations that are not included

are  
not currently supported for this device. Unused bits of a valid  
address location should be written with 0s. Writing to these  
locations is required only when part of an address location is  
open (for example, Address 0x18). If the entire address location  
is open (for example, Address 0x13), this address location should  
not be written.  
If multiple channel bits are set, the subsequent write affects the  
registers of all selected channels. In a read cycle, select a single  
channel only to read one of the registers. If multiple channels are  
selected during a SPI read cycle, the device returns the value for  
Channel A only. Registers and bits designated as global i

affect the entire device or the channel features for which there are  
no independent per channel settings. The settings in Register 0x05  
do not affect the global registers and bits.  
Default Values  
After th

is reset, critical registers are loaded with  
default values. The default values for the registers are given in  
the memory map register table (s

Rev. A | Page 30 of 36  
 
 

Data Sheet  
AD6657A  
MEMORY MAP REGISTER TABLE  
All address and bit locations that are not included in

are not currently supported for this device.  
Table 13. Memory Map Registers  
Default  
Value  
(Hex)  
Addr. Register  
(Hex) Name  
(MSB)  
Bit 7  
(LSB)  
Bit 0  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Comments  
Chip Configuration Registers  
0x00  
SPI port  
configuration  
(global)  
Open  
LSB first  
Soft reset  
1
Soft reset  
LSB first  
Open  
0x18  
Nibbles are  
mirrored so  
that LSB first  
or MSB first  
mode is set  
correctly,  
1
regardless of  
shift mode.  
To control  
this register,  
all channel  
index bits in  
Register 0x05  
must be set.  
0x01  
Chip ID  
(global)  
8-bit chip ID, Bits[7:0]  

AD6657A

= 0x7B (default)  
0x7B  
Read only.  
Channel Index and Transfer Registers  
0x05  
Channel  
index  
Enable  
output  
port for  
Enable  
output  
port for  
Open  
Open  
Channel D
 
Channel C  
Channel B
 
Channel A
 
0xCF  
Bits are set to  
determine  
which  
enable  
enable  
enable  
enable  
Channel C
 
Channel A  
and and  
Channel D
 
Channel B  
channel on  
the chip  
receives the  
next write  
command;  
applies to  
local  
registers.  
0xFF  
Transfer  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
SW  
0x00  
0x00  
Synchro-  
nously  
transfers  
data from  
the master  
shift register  
to the slave.  
transfer  
1 = on  
0 = off  
(default)  
ADC Function Registers  
External  
power-  
down pin  
function  
(global)  
0 = full  
power-  
down  
Internal power-down  
mode (local)  
00 = normal operation  
(default)  
Determines  
generic  
modes of  
chip opera-  
tion.  
0x08  
Power modes
 
Open  
01 = full power-down  
10 = standby  
1 =  
standby  
0x0B  
0x0C  
Clock divide  
(global)  
Open  
Open  
Open  
Open  
Clock divide phase  
Clock divide ratio  
0x00  
0x01  
000 = 0 input clock cycles delayed  
001 = 1 input clock cycle delayed  
010 = 2 input clock cycles delayed  
000 = divide by 1  
001 = divide by 2  
010 = divide by 3  
011 = divide by 4  
100 = divide by 5  
101 = divide by 6  
110 = divide by 7  
111 = divide by 8  
Shuffle mode  
(local)  
Open  
Open  
Open  
Open  
Shuffle mode enable  
00 = shuffle disabled  
Enables or  
disables  
shuffle  
01 = shuffle enabled  
mode.  
Rev. A | Page 31 of 36  
 
 

AD6657A  
Data Sheet  
Default  
Addr. Register  
(Hex) Name  
(MSB)  
Bit 7  
(LSB)  
Bit 0  
Value  
(Hex)  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Comments  
Output test mode  
000 = off (normal operation)  
0x00  
When set,  
the test data  
is placed on  
the output  
pins in place  
of normal  
data.  
0x0D  
Test mode  
(local)  
Open  
Open  
Reset  
long PN  
generator generator  
0 = on  
1 = off  
(default)  
Reset  
short PN  
Open  
001 = midscale short  
010 = positive FS  
011 = negative FS  
0 = on  
1 = off  
(default)  
100 = alternating checkerboard  
101 = PN sequence long  
110 = PN sequence short  
111 = 1/0 word toggle  
0x0E  
0x10  
BIST enable  
(local)  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
BIST reset  
0 = on  
1 = off  
Open  
BIST  
0x00  
0x00  
When Bit 0  
is set, the  
built-in self  
test function  
is initiated.  
enable  
1 = on  
0 = off  
(default)  
(default)  
Offset adjust  
(local)  
Offset adjustment in LSBs from +127 to −128  
(twos complement format)  
011111 = +31 LSB  
011110 = +30 LSB  
011101 = +29 LSB  
…
Device offset  
trim.  
000010 = +2 LSB  
000001 = +1 LSB  
000000 = 0 LSB  
…
111111 = −1 LSB  
111110 = −2 LSB  
111101 = −3 LSB  
…
100001 = −31 LSB  
100000 = −32 LSB  
Output mode
 
Open  
(local)  
Open  
Open  
Open  
Open  
Output  
enable  
bar  
(local)  
1 = off  
0 = on  
Open  
Output  
invert  
(local)  
1 = on  
0 = off  
Output format (local)  
00 = offset binary  
01 = twos  
0x00  
0x01  
Configures  
the outputs  
and the  
format of  
the data.  
0x14  
0x15  
complement  
Output  
adjust  
(local)  
Open  
Open  
Output port LVDS drive current  
0000 = 3.72 mA  
Output  
current  
adjustments.  
0001 = 3.5 mA (default)  
0010 = 3.3 mA  
0011 = 2.96 mA  
0100 = 2.82 mA  
0101 = 2.57 mA  
0110 = 2.27 mA  
0111 = 2.0 mA  
1000 = 2.0 mA  
0x16  
0x17  
Clock phase  
control  
(local)  
Invert  
DCO clock  
0 = off  
1 = on  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
Open  
0x00  
0x00  
When Bit 7  
is set, clock  
polarity is  
reversed.  
DCO output  
delay  
(local)  
DCO  
Output port DCO clock delay  
Enable DCO  
delay and set  
the delay  
time.  
delay  
enable  
0 = off  
1 = on  
00000 = 100 ps additional delay on the DCO pin  
00001 = 200 ps additional delay on the DCO pin  
00010 = 300 ps additional delay on the DCO pin  
…
11101 = 3.0 ns additional delay on the DCO pin  
11110 = 3.1 ns additional delay on the DCO pin  
11111 = 3.2 ns additional delay on the DCO pin  
0x18  
V

REF

select  
Open  
Open  
Open  
Internal V

REF

full-scale adjustment  
Main reference full-scale V

REF

adjustment  
01111: internal 2.087 V p-p  
…
0x00  
Select  
adjustments  
for V

REF  

(global)  
.
00001: internal 1.772 V p-p  
00000: internal 1.75 V p-p  
…
11111: internal 1.727 V p-p  
…
10000: internal 1.383 V p-p  
Rev. A | Page 32 of 36  

Data Sheet  
AD6657A  
Default  
Value  
(Hex)  
Addr. Register  
(Hex) Name  
(MSB)  
Bit 7  
(LSB)  
Bit 0  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Comments  
0x24  
BIST  
BIST Signature[7:0]  
0x00  
Read only.  
signature LSB  
(local)  
0x25  
BIST signa-  
ture MSB  
(local)  
BIST Signature[15:8]  
0x00  
Read only.  
Digital Feature Control Registers  
Master  
sync  
enable  
0 = off  
1 = on  
0x00  
0x00  
Control  
0x3A  
0x3C  
Sync control  
(global)  
Open  
Open  
Open  
Open  
Open  
Open  
Clock divider  
sync mode  
0 = conti-  
Clock  
divider  
sync  
enable  
0 = off  
1 = on  
register to  
synchronize  
the clock  
divider.  
nuous  
1 = next sync  
mode, next  
rising edge of  
sync resets  
clock divider  
NSR control  
(local)  
Open  
Open  
MODE  
pin  
disable  
0 =  
MODE  
pin used  
1 =  
MODE  
pin dis-  
abled  
NSR mode  
NSR  
Noise  
000 = 22% BW mode  
001 = 33% BW mode  
010 = 36% BW mode  
enable  
0 = off  
1 = on  
(used only  
if  
Bit 4 = 1;  
otherwise  
ignored)  
shaping  
requantizer  
(NSR)  
controls.  
0x3E  
NSR tuning  
word  
(local)  
Open  
Open  
NSR tuning word  
Equations for the tuning word are dependent on the NSR mode.  
0x1C  
NSR  
frequency  
tuning word.  
NSR Control (Register 0x3C)  
MEMORY MAP REGISTER DESCRIPTIONS  
Bits[7:5]—Reserved  
For additional information about functions controlled  
in Register 0x00 to Register 0xF
F
,
s
ee the

Note

Interfacing to High Speed ADCs via SPI
.  
Bit 4—MODE Pin Disable  
Bit 4 specifies whether the selected channels are to be controlled  
by the MODE pin. Local registers act on the channels that are  
selected by the channel index register (Address 0x05).  
Sync Control (Register 0x3A)  
Bits[7:3]—Reserved  
Bit 2—Clock Divider Sync Mode  
Bits[3:1]—NSR Mode  
Bit 2 selects the mode of the clock divider sync function. When  
Bit 2 is low, continuous sync mode is enabled. When Bit 2 is  
high, the clock divider is reset on the next rising edge of the  
sync signal. Subsequent rising edges of the sync signal are  
ignored.  
Bits[3:1] determine the bandwidth (BW) mode of the NSR.  
When Bits[3:1] are set to 000, the NSR is configured for a 22%  
BW mode that provides enhanced SNR performance over 22%  
of the sample rate. When Bits[3:1] are set to 001, the NSR is  
configured for a 33% BW mode that provides enhanced SNR  
performance over 33% of the sample rate. When Bits[3:1] are  
set to 010, the NSR is configured for a 36% BW mode that pro-  
vides enhanced SNR performance over 36% of the sample rate.  
Bit 1—Clock Divider Sync Enable  
Bit 1 gates the sync pulse to the clock divider. The sync signal is  
enabled when Bit 1 is high and Bit 0 is high. This is continuous  
sync mode.  
Bit 0—NSR Enable  
The NSR is enabled when Bit 0 is high and disabled when Bit 0  
is low. Bit 0 is ignored unless the MODE pin disable bit (Bit 4)  
is set.  
Bit 0—Master Sync Enable  
Bit 0 must be high to enable any of the sync functions. If  
the sync capability is not used, this bit should remain low  
to conserve power.  
Rev. A | Page 33 of 36  
 

AD6657A  
Data Sheet  
NSR Tuning Word (Register 0x3E)  
Bits[7:6]—Reserved  
there are 28 possible tuning words. For either mode, each step  
represents 0.5% of the ADC sample rate. For the equations used  
to calculate the tuning word based on the BW mode of  
operation, see the

section.  
Bits[5:0]—NSR
T
u
ning
W
o
rd  
The NSR tuning word sets the band edges of the NSR band. In  
22% BW mode, there are 57 possible tuning words; in 33% BW  
mode, there are 34 possible tuning words; in 36% BW mode,  
Rev. A | Page 34 of 36  

Data Sheet  
AD6657A  
APPLICATIONS INFORMATION  
VCMx Pins  
DESIGN GUIDELINES  
The VCMx pins are provided to set the common-mode level  
of the analog inputs. Decouple the VCMx pins to ground with a  
0.1 μF capacitor, as shown in

Before starting the design and layout of the

in a  
system, it is recommended that the designer become familiar  
with these guidelines, which discuss the special circuit  
connections and layout requirements needed for certain pins.  
SPI Port  
Power and Ground Recommendations  
The SPI port should not be active during periods when the full  
dynamic performance of the

is required. Because the  
SCLK signal, the CSB signal, and the SDIO signal are typically  
asynchronous to the ADC clock, noise from these signals can  
degrade

performance. If the on-board SPI bus is used  
for other devices, it may be necessary to provide buffers between  
this bus and the

to prevent these signals from transi-  
tioning at the receiver inputs during critical sampling periods.  
When connecting power to th

it is recommended  
that two separate 1.8 V supplies be used. Use one supply for  
analog (
A
V
DD); use a separate supply for the digital outputs  
(DRVDD). The AVDD and DRVDD supplies should be isolated  
with separate decoupling capacitors. Several different decoupling  
capacitors can be used to cover both high and low frequencies.  
Locate these capacitors close to the point of entry at the PCB  
level and close to the pins of the part, with minimal trace length.  
A single PCB ground plane is sufficient when using the

With proper decoupling and smart partitioning of the PCB  
analog, digital, and clock sections, optimum performance is  
easily achieved.  
Rev. A | Page 35 of 36  
 
 

AD6657A  
Data Sheet  
PACKAGING AND ORDERING INFORMATION  
OUTLINE DIMENSIONS  
10.10  
A1 BALL  
CORNER  
10.00 SQ  
9.90  
A1 BALL  
CORNER  
12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
8.80  
BSC SQ  
G
H
J
0.80  
K
L
M
0.60  
REF  
TOP VIEW  
DETAIL A  
BOTTOM VIEW  
*
1.40 MAX  
0.65 MIN  
DETAIL A  
0.25 MIN  
0.50  
0.45  
0.40  
COPLANARITY  
0.20  
SEATING  
PLANE  
BALL DIAMETER  
*
COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1  
WITH EXCEPTION TO PACKAGE HEIGHT.  
Figure 61. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]  
(BC-144-1)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model

Temperature Range  
Package Description  
Package Option  
BC-144-1  
BC-144-1  
AD6657ABBCZ  
AD6657ABBCZRL  
AD6657AEBZ  
−40°C to +85°C  
−40°C to +85°C  
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]  
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]  
Evaluation Board  

1

Z = RoHS Compliant Part.  
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D09684-0-2/14(A)  
Rev. A | Page 36 of 36