Analog-Devices-AD6657ABBCZRL
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Quad IF Receiver
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
AVDD
AGND
DRVDD DRGND
11-bit, 200 MSPS output data rate per channel
Integrated noise shaping requantizer
Performance with NSR enabled
SNR: 76.0 dBFS in 40 MHz band to 70 MHz at 185 MSPS
SNR: 73.6 dBFS in 60 MHz band to 70 MHz at 185 MSPS
SNR: 72.8 dBFS in 65 MHz band to 70 MHz at 185 MSPS
Performance with NSR disabled
SNR: 66.5 dBFS to 70 MHz at 185 MSPS
SFDR: 88 dBc to 70 MHz at 185 MSPS
Low power: 1.2 W at 185 MSPS
1.8 V analog supply operation
1.8 V LVDS (ANSI-644 levels) output
1-to-8 integer clock divider
Internal ADC voltage reference
1.75 V p-p analog input range (programmable to 2.0 V p-p)
Differential analog inputs with 800 MHz bandwidth
95 dB channel isolation/crosstalk
AD6657A
DCO±AB
DO±AB
14
14
14
14
11
VIN+A
VIN–A
VCMA
VIN+B
VIN–B
VCMB
VIN+C
VIN–C
VCMC
VIN+D
VIN–D
VCMD
PIPELINE
ADC
NOISE SHAPING
REQUANTIZER
PORT A
11
11
11
NOISE SHAPING
REQUANTIZER
PIPELINE
ADC
D10±AB
DCO±CD
DO±CD
NOISE SHAPING
REQUANTIZER
PIPELINE
ADC
PORT B
NOISE SHAPING
REQUANTIZER
PIPELINE
ADC
D10±CD
MODE
SYNC
PDWN
REFERENCE
CLOCK
DIVIDER
SERIAL PORT
Serial port control
User-configurable built-in self test (BIST) capability
Energy saving power-down modes
SCLK SDIO
CSB
CLK+ CLK–
Figure 1.
APPLICATIONS
Communications
Diversity radio and smart antenna (MIMO) systems
Multimode digital receivers (3G)
WCDMA,
L
T
E, CDMA2000
WiMAX, TD-SCDMA
I/Q demodulation systems
General-purpose software radios
Each ADC output is connected internally to an NSR block. The
integrated NSR circuitry allows for improved SNR performance in
a smaller frequency band within the Nyquist bandwidth. The
device supports two different output modes selectable via the
external MODE pin or the serial port interface (SPI).
GENERAL DESCRIPTION
frequency (IF) receiver specifically designed to support multiple
antenna systems in telecommunication applications where high
dynamic range performance, low power, and small size are desired.
With the NSR feature enabled, the outputs of the ADCs are
formance within a limited portion of the Nyquist bandwidth while
maintaining an 11-bit output resolution. The NSR block can be
programmed to provide a bandwidth of either 22%, 33%, or 36% of
the sample clock. For example, with a sample clock rate of
40 MHz bandwidth in the 22% mode, up to 73.6 dBFS SNR for a
60 MHz bandwidth in the 33% mode, or up to 72.8 dBFS SNR for a
65 MHz bandwidth in the 36% mode.
The device consists of four high performance ADCs and NSR
digital blocks. Each ADC consists of a multistage, differential
pipelined architecture with integrated output error correction
logic. The ADC features a wide bandwidth switched capacitor
sampling network within the first stage of the differential pipeline.
An integrated voltage reference eases design considerations. A
duty cycle stabilizer (DCS) compensates for variations in the
ADC clock duty cycle, allowing the converters to maintain
excellent performance.
(General Description continued on Page 3)
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registere
d
t
rademarks ar
e
t
he property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2011–2014 Analog Devices, Inc. All rights reserved.
AD6657A
Data Sheet
TABLE OF CONTENTS
REVISION HISTORY
2/14—Rev. 0 to Rev. A
Changed DCO to Data Skew (t
SKEW
) Parameter Unit from ns to
ps, Table 4 ……………………………………………………………………………… 9
10/11—Revision 0: Initial Version
Rev. A | Page 2 of 36
Data Sheet
AD6657A
With the NSR block disabled, the ADC data is provided directly to
up to 66.5 dBFS SNR for the entire Nyquist bandwidth when
telecommunication applications such as a digital predistortion
observation path where wider bandwidths are used.
(CSP_BGA) that is specified over the industrial temperature
range of −40°C to +85°C.
PRODUCT HIGHLIGHTS
1. Four
analog-to-digital converters (ADCs) are contained in
a small, space-saving, 10 mm × 10 mm × 1.4 mm, 144-ball
CSP_BGA package.
2. Pin
selectable noise shaping requantizer (NSR) function
that allows for improved SNR within a reduced bandwidth
of up to 65 MHz at 185 MSPS.
After digital signal processing, multiplexed output data is
routed into two 11-bit output ports such that the maximum
digital data rate (DDR) is 400 Mbps. These outputs are set at
1.8 V LVDS and support ANSI-644 levels.
3. LVDS
digital output interface configured for low cost
Each receiver is designed for simultaneous reception of a separate
antenna. This IF sampling architecture greatly reduces component
cost and complexity compared with traditional analog techniques
or less integrated digital methods.
FPGA families.
4. 230
mW per ADC core power consumption.
5. Operation
from a single 1.8 V supply.
6. Standard
SPI that supports various product features and
functions, such as data formatting (offset binary or twos
complement), NSR, power-down, test modes, and voltage
reference mode.
7. On-chip
integer 1-to-8 input clock divider and multichip
sync function to support a wide range of clocking schemes
and multichannel subsystems.
Flexible power-down options allow significant power savings.
Programming for device setup and control is accomplished
using a 3-wire SPI-compatible serial interface with numerous
modes to support board level system testing.
144-ball, 10 mm × 10 mm chip scale package ball grid array
Rev. A | Page 3 of 36
AD6657A
Data Sheet
SPECIFICATIONS
DC SPECIFICATIONS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 1.
Parameter
Temperature
Min
Typ
Max
Unit
RESOLUTION
Full
11
Bits
ACCURACY
No Missing Codes
Offset Error
Gain Error
MATCHING CHARACTERISTIC
Offset Error
Full
Full
Full
Full
Full
Guaranteed
+0.1
+11
0.1
0.17
−0.9
+4
−0.4
−0.55
+0.9
+18
+0.4
+0.55
mV
% FSR
LSB
LSB
Full
Full
−5
0
+3
+2.1
+11
+8
mV
% FSR
Gain Error
TEMPERATURE DRIFT
Offset Error
Gain Error
Full
Full
2
40
ppm/°C
ppm/°C
ANALOG INPUT
Input Range
Full
Full
Full
Full
1.4
1.75
0.95
20
2.0
V p-p
V
kΩ
pF
Input Common-Mode Voltage
Input Resistance (Differential)
POWER SUPPLIES
Supply Voltage
AVDD
5
Full
Full
1.7
1.7
1.8
1.8
1.9
1.9
V
V
DRVDD
Supply Current
Full
Full
466
170
510
183
mA
mA
POWER CONSUMPTION
Power-Down Power
Full
Full
Full
1145
129
3.8
1247
10
mW
mW
mW
1
Measured with a 10 MHz, 0 dBFS sine wave, with 100 Ω termination on each LVDS output pair.
2
Input capacitance refers to the effective capacitance between one differential input pin and AGND.
3
Standby power is measured with a dc input and the CLKx pins inactive (set to AVDD or AGND).
Rev. A | Page 4 of 36
Data Sheet
AD6657A
AC SPECIFICATIONS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 2.
Temperature Min
Typ
Max
Unit
SIGNAL-TO-NOISE-RATIO (SNR)—NSR DISABLED
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
f
IN
= 170 MHz
25°C
25°C
25°C
25°C
Full
25°C
66.6
66.5
66.5
66.3
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
65.6
f
IN
= 250 MHz
65.9
SIGNAL-TO-NOISE-RATIO (SNR)—NSR ENABLED
22% BW Mode
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
f
IN
= 170 MHz
25°C
25°C
25°C
25°C
Full
76.0
75.7
75.7
74.3
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
72.9
71.3
70.7
64.6
f
IN
= 250 MHz
33% BW Mode
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
25°C
72.8
25°C
25°C
25°C
25°C
Full
73.6
73.6
73.3
72.5
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
f
IN
= 170 MHz
f
IN
= 230 MHz
36% BW Mode
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
25°C
71.2
25°C
25°C
25°C
25°C
Full
72.8
72.6
72.6
71.8
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
f
IN
= 170 MHz
f
IN
= 250 MHz
SIGNAL-TO-NOISE-AND DISTORTION (SINAD)
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
25°C
70.8
25°C
25°C
25°C
25°C
Full
65.5
65.5
65.5
65.3
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
f
IN
= 170 MHz
f
IN
= 250 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
25°C
64.8
25°C
25°C
25°C
25°C
25°C
10.6
10.6
10.6
10.6
10.5
Bits
Bits
Bits
Bits
Bits
f
IN
= 170 MHz
f
IN
= 250 MHz
Rev. A | Page 5 of 36
AD6657A
Data Sheet
Temperature Min
Typ
Max
Unit
WORST SECOND OR THIRD HARMONIC
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
f
IN
= 170 MHz
25°C
25°C
25°C
25°C
Full
−94
−91
−88
−90
dBc
dBc
dBc
dBc
dBc
dBc
−80
f
IN
= 250 MHz
25°C
−83
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
f
IN
= 170 MHz
25°C
25°C
25°C
25°C
Full
25°C
94
91
88
90
dBc
dBc
dBc
dBc
dBc
dBc
80
f
IN
= 250 MHz
83
WORST OTHER HARMONIC (FOURTH THROUGH EIGHTH)
f
IN
= 10 MHz
f
IN
= 50 MHz
f
IN
= 70 MHz
f
IN
= 170 MHz
25°C
25°C
25°C
25°C
Full
−94
−95
−94
−94
dBc
dBc
dBc
dBc
dBc
dBc
−80
f
IN
= 250 MHz
25°C
−90
TWO TONE SFDR (−7 dBFS)
f
IN1
= 169 MHz, f
IN2
= 172 MHz
25°C
Full
89
dBc
dB
95
ANALOG INPUT BANDWIDTH
25°C
800
MHz
1
See th
e
AN-835 Application Note
,
Understanding High Speed ADC Testing and Evaluation
, for a complete set of definitions.
2
Crosstalk is measured at 155 MHz with −1 dBFS on one channel and no input on the alternate channel.
Rev. A | Page 6 of 36
Data Sheet
AD6657A
DIGITAL SPECIFICATIONS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 3.
Parameter
Temperature Min
Typ
Max
Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
CMOS/LVDS/LVPECL
0.9
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
V
Full
Full
Full
Full
Full
Full
Full
Full
0.2
AGND − 0.3
3.6
AVDD + 0.2
V p-p
V
1.2
0
−10
−10
8
2.0
0.8
+10
+10
12
V
V
µA
µA
kΩ
pF
10
4
Input Capacitance
SYNC INPUT
Logic Compliance
Internal Bias
CMOS
0.9
Full
Full
Full
Full
Full
Full
Full
Full
V
Input Voltage Range
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
AGND
1.2
AGND
−100
−100
12
AVDD
AVDD
0.6
V
V
V
+100
+100
20
µA
µA
kΩ
pF
16
1
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.22
0
−10
40
2.1
0.6
+10
132
V
V
µA
µA
kΩ
pF
26
2
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.22
0
−92
−10
2.1
0.6
−135
+10
V
V
µA
µA
kΩ
pF
26
2
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.22
0
−10
38
2.1
0.6
+10
128
V
V
µA
µA
kΩ
pF
26
5
Input Capacitance
Rev. A | Page 7 of 36
AD6657A
Data Sheet
Parameter
Temperature Min
Typ
Max
Unit
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.22
0
−10
40
2.1
0.6
+10
132
V
V
µA
µA
kΩ
pF
26
2
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Full
Full
Full
Full
Full
Full
1.22
0
−90
−10
2.1
0.6
−134
+10
V
V
µA
µA
kΩ
pF
26
5
Input Capacitance
DIGITAL OUTPUTS (LVDS)
Differential Output Voltage (V
OD
)
Output Offset Voltage (V
OS
)
Full
Full
247
1.125
454
1.375
mV
V
1
Pull up.
2
Pull down.
Rev. A | Page 8 of 36
Data Sheet
AD6657A
SWITCHING SPECIFICATIONS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 4.
Parameter
Temperature Min
Typ
Max
Unit
CLOCK INPUT PARAMETERS
Input Clock Rate
Full
625
200
MHz
MSPS
ns
ns
ps rms
Full
Full
Full
Full
40
185
2.7
1.3
Aperture Uncertainty (Jitter, t
J
)
0.13
DATA OUTPUT PARAMETERS
Full
Full
Full
Full
Full
Full
Full
Full
3.0
3.1
−41
4.9
4.9
+33
ns
ns
ps
Cycles
Cycles
µs
4.0
4.0
+6.1
9
12
0.5
310
2
DCO Propagation Delay (t
DCO
DCO to Data Skew (t
SKEW
Pipeline Delay (Latency)
With NSR Enabled
OUT-OF-RANGE RECOVERY TIME
µs
Cycles
1
Conversion rate is the clock rate after the divider.
3
Wake-up time is dependent on the value of the decoupling capacitors.
Data Output Timing Diagram
t
A
N – 1
N + 4
N + 5
N
N + 3
VIN
N + 1
N + 2
t
CH
t
CL
1/
f
S
CLK+
CLK–
t
DCO
DCO+
DCO–
t
SKEW
t
PD
D10+AB (MSB)
D10–AB (MSB)
D10A
D0A
D10B
D0B
D10A
D10B
D10A
D10B
D0B
D10A
D0A
D10B
D0B
D10A
D0A
D10B
D0B
D10A
D0A
D10B
D0B
D10A
D0A
D10B
D0B
D0+AB (LSB)
D0–AB (LSB)
D0A
D0B
D0A
Figure 2. Data Output Timing (Timing for Channel C and Channel D Is Identical to Timing for Channel A and Channel B)
Rev. A | Page 9 of 36
AD6657A
Data Sheet
TIMING SPECIFICATIONS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 5.
Parameter
Description
Min
Typ
Max
Unit
SYNC TIMING REQUIREMENTS
t
SSYNC
t
HSYNC
SYNC to rising edge of CLK setup time
SYNC to rising edge of CLK hold time
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
SCLK pulse width high
0.24
0.40
ns
ns
SPI TIMING REQUIREMENTS
t
DS
t
DH
t
CLK
t
S
2
2
40
2
2
10
10
10
ns
ns
ns
ns
ns
ns
ns
ns
t
H
t
HIGH
t
LOW
t
EN_SDIO
SCLK pulse width low
Time required for the SDIO pin to switch from an input to
an output relative to the SCLK falling edge (not pictured in
t
DIS_SDIO
Time required for the SDIO pin to switch from an output to
an input relative to the SCLK rising edge (not pictured in
10
ns
Sync Input Timing Diagram
CLK+
t
SSYNC
t
HSYNC
SYNC
Figure 3. SYNC Input Timing Requirements
Rev. A | Page 10 of 36
Data Sheet
AD6657A
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
JESD25-5 for a 2S2P test board. Typical θ
JA
is specified for a
4-layer printed circuit board (PCB) with a solid ground plane.
reduces θ
JA
. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θ
JA
.
Parameter
Rating
AVDD to AGND
DRVDD to AGND
VIN+x, VIN−x to AGND
CLK+, CLK− to AGND
SYNC to AGND
VCMx to AGND
CSB to AGND
SCLK to AGND
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
Table 7.
Airflow
Velocity
SDIO to AGND
Package Type
θ
JA
θ
JC
8.9
θ
JB
6.6
Unit
°C/W
°C/W
°C/W
PDWN to AGND
MODE to AGND
Digital Outputs to AGND
DCO+AB, DCO−AB, DCO+CD,
DCO−CD to AGND
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
144-Ball CSP_BGA
0 m/s
1 m/s
2.5 m/s
26.9
24.2
23.0
1
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
2
Per MIL-STD 883, Method 1012.1.
−40°C to +85°C
150°C
3
Per JEDEC JESD51-8 (still air).
multilayer board. Thermal performance for actual applications
requires careful inspection of the conditions in the application
to determine whether they are similar to those assumed in these
calculations.
Storage Temperature Range
(Ambient)
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 8.
Airflow
Velocity
Package Type
Ψ
JB
Ψ
JT
Unit
°C/W
°C/W
°C/W
144-Ball CSP_BGA
0 m/s
14.4
14.0
13.9
0.23
0.50
0.53
1 m/s
2.5 m/s
ESD CAUTION
Rev. A | Page 11 of 36
AD6657A
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
A
B
C
D
E
F
AGND
AGND
VIN+D
VIN–D
AGND
AGND
VIN+C
AGND
AGND
VCMD
AVDD
AGND
VIN–C
VCMC
AGND
AGND
AVDD
AGND
AGND
AGND
CSB
AVDD
AVDD
SDIO
AVDD
AVDD
AGND
CLK–
AVDD
SCLK
AVDD
AVDD
AGND
CLK+
AVDD
PDWN
AVDD
AVDD
AGND
AVDD
AVDD
SYNC
AVDD
AVDD
AGND
AGND
AGND
MODE
AVDD
AVDD
AGND
VIN–B
VCMB
AGND
AGND
AVDD
AGND
VIN+B
AGND
AGND
VCMA
AVDD
AGND
AGND
AGND
VIN+A
VIN–A
AGND
AGND
AVDD
AVDD
AGND
G
H
J
DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND DRGND
DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD DRVDD
D0–CD
D0+CD
D1–CD
D1+CD
D2–CD
D2+CD
D3–CD
D3+CD
D4–CD
D4+CD
D5–CD
D5+CD
D6–CD
D6+CD
D7–CD
D7+CD
D8–CD D10–CD D0–AB
D8+CD D10+CD D0+AB
D9–CD DCO–CD D1–AB
D9+CD DCO+CD D1+AB
D2–AB
D2+AB
D3–AB
D3+AB
D4–AB
D4+AB
D5–AB
D5+AB
D6–AB
D6+AB
D7–AB
D7+AB
D8–AB D10–AB
D8+AB D10+AB
D9–AB DCO–AB
D9+AB DCO+AB
K
L
M
Figure 4. Pin Configuration (Top View)
Table 9. Pin Function Descriptions
Pin No.
Mnemonic
Type
Description
A5, A8, B5 to B8, D4 to
D9, E2 to E11
AVDD
Supply
Analog Power Supply. 1.8 V nominal.
A1, A4, A9, A12, B1, B2,
B4, B9, B11, B12, C2, C3,
C10, C11, D3, D10, E1,
E12, F1 to F12
AGND
Ground
Analog Ground.
H1 to H12
G1 to G12
A7
DRVDD
DRGND
CLK+
Supply
Ground
Input
Digital Output Driver Supply. 1.8 V nominal.
Digital Output Driver Ground.
ADC Clock Input—True.
A6
CLK−
Input
ADC Clock Input—Complement.
C12
D12
D11
A11
A10
B10
A2
A3
B3
C1
D1
D2
K7
J7
M7
L7
K8
J8
M8
L8
K9
VIN+A
VIN−A
VCMA
VIN+B
VIN−B
VCMB
Input
Input
Output
Input
Input
Output
Input
Input
Output
Input
Input
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Differential Analog Input Pin (+) for Channel A.
Differential Analog Input Pin (−) for Channel A.
Common-Mode Level Bias Output for Analog Input Channel A.
Differential Analog Input Pin (+) for Channel B.
Differential Analog Input Pin (−) for Channel B.
Common-Mode Level Bias Output for Analog Input Channel B.
Differential Analog Input Pin (+) for Channel C.
Differential Analog Input Pin (−) for Channel C.
Common-Mode Level Bias Output for Analog Input Channel C.
Differential Analog Input Pin (+) for Channel D.
VIN+C
VIN−C
VCMC
VIN+D
VIN−D
VCMD
D0+AB
D0−AB
D1+AB
D1−AB
D2+AB
D2−AB
D3+AB
D3−AB
D4+AB
D4−AB
Differential Analog Input Pin (−) for Channel D.
Common-Mode Level Bias Output for Analog Input Channel D.
Channel A and Channel B LVDS Output Data 0—True.
Channel A and Channel B LVDS Output Data 0—Complement.
Channel A and Channel B LVDS Output Data 1—True.
Channel A and Channel B LVDS Output Data 1—Complement.
Channel A and Channel B LVDS Output Data 2—True.
Channel A and Channel B LVDS Output Data 2—Complement.
Channel A and Channel B LVDS Output Data 3—True.
Channel A and Channel B LVDS Output Data 3—Complement.
Channel A and Channel B LVDS Output Data 4—True.
Channel A and Channel B LVDS Output Data 4—Complement.
Rev. A | Page 12 of 36
J9
Data Sheet
AD6657A
Pin No.
M9
L9
Mnemonic
D5+AB
D5−AB
D6+AB
D6−AB
D7+AB
D7−AB
D8+AB
D8−AB
D9+AB
D9−AB
D10+AB
D10−AB
DCO+AB
DCO−AB
D0+CD
D0−CD
D1+CD
D1−CD
D2+CD
D2−CD
D3+CD
D3−CD
D4+CD
D4−CD
D5+CD
D5−CD
D6+CD
D6−CD
D7+CD
D7−CD
D8+CD
D8−CD
D9+CD
D9−CD
D10+CD
D10−CD
DCO+CD
DCO−CD
MODE
Type
Description
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Input
Channel A and Channel B LVDS Output Data 5—True.
Channel A and Channel B LVDS Output Data 5—Complement.
Channel A and Channel B LVDS Output Data 6—True.
Channel A and Channel B LVDS Output Data 6—Complement.
Channel A and Channel B LVDS Output Data 7—True.
Channel A and Channel B LVDS Output Data 7—Complement.
Channel A and Channel B LVDS Output Data 8—True.
Channel A and Channel B LVDS Output Data 8—Complement.
Channel A and Channel B LVDS Output Data 9—True.
Channel A and Channel B LVDS Output Data 9—Complement.
Channel A and Channel B LVDS Output Data 10—True.
Channel A and Channel B LVDS Output Data 10—Complement.
Data Clock LVDS Output for Channel A and Channel B—True.
Data Clock LVDS Output for Channel A and Channel B—Complement.
Channel C and Channel D LVDS Output Data 0—True.
Channel C and Channel D LVDS Output Data 0—Complement.
Channel C and Channel D LVDS Output Data 1—True.
Channel C and Channel D LVDS Output Data 1—Complement.
Channel C and Channel D LVDS Output Data 2—True.
Channel C and Channel D LVDS Output Data 2—Complement.
Channel C and Channel D LVDS Output Data 3—True.
Channel C and Channel D LVDS Output Data 3—Complement.
Channel C and Channel D LVDS Output Data 4—True.
Channel C and Channel D LVDS Output Data 4—Complement.
Channel C and Channel D LVDS Output Data 5—True.
Channel C and Channel D LVDS Output Data 5—Complement.
Channel C and Channel D LVDS Output Data 6—True.
Channel C and Channel D LVDS Output Data 6—Complement.
Channel C and Channel D LVDS Output Data 7—True.
Channel C and Channel D LVDS Output Data 7—Complement.
Channel C and Channel D LVDS Output Data 8—True.
Channel C and Channel D LVDS Output Data 8—Complement.
Channel C and Channel D LVDS Output Data 9—True.
Channel C and Channel D LVDS Output Data 9—Complement.
Channel C and Channel D LVDS Output Data 10—True.
Channel C and Channel D LVDS Output Data 10—Complement.
Data Clock LVDS Output for Channel C and Channel D—True.
Data Clock LVDS Output for Channel C and Channel D—Complement.
Mode Select Pin. Logic low enables NSR; logic high disables NSR.
Digital Synchronization Pin.
K10
J10
M10
L10
K11
J11
M11
L11
K12
J12
M12
L12
K1
J1
M1
L1
K2
J2
M2
L2
K3
J3
M3
L3
K4
J4
M4
L4
K5
J5
M5
L5
K6
J6
M6
L6
C9
C8
SYNC
Input
C7
PDWN
Input
Power-Down Input (Active High).
C6
SCLK
Input
SPI Clock.
C5
C4
SDIO
CSB
Input/Output SPI
Data.
Input SPI
Chip Select (Active Low).
Rev. A | Page 13 of 36
AD6657A
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
A
V
DD = 1.8
V
,
D
RVDD = 1.8
V
,
s
ample rate = 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS, 32,000 sample, T
A
= 25°C,
unless otherwise noted.
0
–20
–40
0
–20
–40
185MSPS
185MSPS
10.3MHz @ –1dBFS
SNR = 65.6dB (66.6dBFS)
SFDR = 94.0dBc
140.3MHz @ –1dBFS
SNR = 65.4dB (66.4dBFS)
SFDR = 90dBc
–60
–80
–60
–80
SECOND HARMONIC
THIRD HARMONIC
THIRD HARMONIC
SECOND HARMONIC
–100
–120
–100
–120
0
0
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
0
0
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 5. Single Tone FFT, f
IN
= 10.3 MHz
Figure 8. Single Tone FFT, f
IN
= 140.3 MHz
0
–20
–40
0
–20
–40
185MSPS
185MSPS
50.3MHz @ –1dBFS
SNR = 65.6dB (66.6dBFS)
SFDR = 92.0dBc
200.3MHz @ –1dBFS
SNR = 64.9dB (65.9dBFS)
SFDR = 84dBc
–60
–80
–60
–80
THIRD HARMONIC
SECOND HARMONIC
SECOND HARMONIC
THIRD HARMONIC
–100
–120
–100
–120
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 6. Single Tone FFT, f
IN
= 50.3 MHz
Figure 9. Single Tone FFT, f
IN
= 200.3 MHz
0
–20
–40
0
–20
–40
185MSPS
185MSPS
70.3MHz @ –1dBFS
SNR = 65.5dB (66.5dBFS)
SFDR = 88dBc
230.3MHz @ –1dBFS
SNR = 66.1dB (65.1dBFS)
SFDR = 84dBc
–60
–80
–60
–80
SECOND HARMONIC
THIRD HARMONIC
SECOND HARMONIC
THIRD HARMONIC
–100
–120
–100
–120
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 7. Single Tone FFT, f
IN
= 70.3 MHz
Figure 10. Single Tone FFT, f
IN
= 230.3 MHz
Rev. A | Page 14 of 36
Data Sheet
AD6657A
0
0
–20
–40
–60
185MSPS
230.3MHz @ –1dBFS
NSR 33% BW MODE, TW = 17
SNR = 70.8dB (72.5dBFS)
SFDR = 93.7dBc
185MSPS
247.3MHz @ –1dBFS
SNR = 66dB (65dBFS)
SFDR = 83dBc
–20
–40
–60
SECOND HARMONIC
THIRD HARMONIC
SECOND HARMONIC
THIRD HARMONIC
–80
–100
–120
–80
–100
–120
–140
0
0
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 11. Single Tone FFT, f
IN
= 247.3 MHz
Figure 14. Single Tone FFT, f
IN
= 230.3 MHz, NSR Enabled
in 33% BW Mode, Tuning Word = 17
0
0
185MSPS
185MSPS
305.3MHz @ –1dBFS
SNR = 64.9dB (65.9dBFS)
SFDR = 80dBc
230.3MHz @ –1dBFS
NSR 36% BW MODE, TW = 14
SNR = 70.3dB (71.3dBFS)
SFDR = 93.4dBc
–20
–40
–60
–20
–40
–60
THIRD HARMONIC
THIRD HARMONIC
–80
–100
–120
SECOND HARMONIC
–80
–100
–120
–140
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 12. Single Tone FFT, f
IN
= 305.3 MHz
Figure 15. Single Tone FFT, f
IN
= 230.3 MHz, NSR Enabled
in 36% BW Mode, Tuning Word = 14
0
–20
–40
–60
100
185MSPS
140.3MHz @ –1dBFS
NSR 22% BW MODE, TW = 28
SNR = 73.4dB (74.9dBFS)
SFDR = 91dBc
90
80
70
60
50
40
30
20
10
0
SFDR (dBFS)
SNR (dBFS)
THIRD HARMONIC
SFDR (dBc)
–80
–100
–120
SNR (dBc)
–140
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
INPUT AMPLITUDE (dBFS)
Figure 16. Single Tone SNR/SFDR vs. Input Amplitude (A
IN
),
f
IN
= 70.3 MHz
Figure 13. Single Tone FFT, f
IN
= 140.3 MHz, NSR Enabled
in 22% BW Mode, Tuning Word = 28
Rev. A | Page 15 of 36
AD6657A
Data Sheet
100
90
80
70
60
50
40
30
20
10
0
100
95
90
85
80
75
70
65
60
55
50
SFDR (dBFS)
SFDR (dBc)
SNR (dBFS)
SFDR (dBc)
SNR (dBFS)
SNR (dBc)
30.00 51.25 72.50 93.75
115.00 136.25 157.50 178.75 200.00
SAMPLE RATE (MSPS)
INPUT AMPLITUDE (dBFS)
Figure 17. Single Tone SNR/SFDR vs. Input Amplitude (A
IN
),
f
IN
= 140.3 MHz
Figure 20. Single Tone SNR/SFDR vs. Sample Rate (f
S
),
f
IN
= 70.3 MHz
95
95
90
SFDR (dBc)
90
85
SFDR (dBc)
85
80
75
80
75
70
65
SNR (dBFS)
70
SNR (dBFS)
60
55
65
60
50
30.00 51.25 72.50 93.75
115.00 136.25 157.50 178.75 200.00
SAMPLE RATE (MSPS)
INPUT FREQUENCY (MHz)
Figure 18. Single Tone SNR/SFDR vs. Input Frequency (f
IN
),
1.75 V p-p Full Scale
Figure 21. Single Tone SNR/SFDR vs. Sample Rate (f
S
),
f
IN
= 140.3 MHz
95
0
185MSPS
169.1MHz @ –7dBFS
90
172.1MHz @ –7dBFS
SFDR = 88.5dBc
–20
SFDR (dBc)
85
80
75
70
65
60
–40
–60
–80
SNR (dBFS)
–100
–120
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
INPUT FREQUENCY (MHz)
Figure 22. Two Tone FFT, f
IN1
= 169.1 MHz and f
IN2
= 172.1 MHz
Figure 19. Single Tone SNR/SFDR vs. Input Frequency (f
IN
),
2.0 V p-p Full Scale
Rev. A | Page 16 of 36
Data Sheet
AD6657A
0
–20
–40
–60
0.20
0.15
0.10
0.05
0
SFDR (dBc)
IMD3 (dBc)
–0.05
–80
SFDR (dBFS)
–0.10
–0.15
–0.20
–100
IMD3 (dBFS)
–120
–90
–78
–66
–54
–42
–30
–18
–6
N + 3
2000
0
500
1000
1500
2000
INPUT AMPLITUDE (dBFS)
OUTPUT CODE
Figure 23. Two Tone SFDR/IMD3 vs. Input Amplitude (A
IN
),
IN1
= 169.1 MHz and f
IN2
= 172.1 MHz
Figure 26. DNL, f
IN
= 30.3 MHz
f
2,500,000
2,000,000
1,500,000
1,000,000
500,000
0
69
68
67
66
65
64
63
62
61
60
N – 3
N – 2
N – 1
N
N + 1
N + 2
30
35
40
45
50
55
60
65
70
OUTPUT CODE
DUTY CYCLE (%)
Figure 24. Grounded Input Histogram
Figure 27. SNR vs. Duty Cycle, f
IN
= 10.3 MHz
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
500
1000
1500
OUTPUT CODE
Figure 25. INL, f
IN
= 30.3 MHz
Rev. A | Page 17 of 36
AD6657A
Data Sheet
EQUIVALENT CIRCUITS
AVDD
350
Ω
30k
Ω
SCLK
OR
PDWN
VIN
Figure 28. Equivalent Analog Input Circuit
Figure 32. Equivalent SCLK and PDWN Input Circuit
AVDD
AVDD
30
kΩ
350
Ω
AVDD
AVDD
0.9V
CSB
OR
MODE
15kΩ
15kΩ
CLK+
CLK–
Figure 29. Equivalent Clock Input Circuit
Figure 33. Equivalent CSB and MODE Input Circuit
DRVDD
DRVDD
V+
V–
DATAOUT–
V–
DATAOUT+
V+
350Ω
SDIO
30kΩ
Figure 30. Equivalent LVDS Output Circuit
Figure 34. Equivalent SDIO Circuit
AVDD
AVDD
SYNC
0.9V
16kΩ
0.9V
Figure 31. Equivalent SYNC Input Circuit
Rev. A | Page 18 of 36
Data Sheet
AD6657A
THEORY OF OPERATION
A small resistor in series with each input can help reduce the
ADC ARCHITECTURE
peak transient current required from the output stage of the
driving source. A shunt capacitor can be placed across the
inputs to provide dynamic charging currents. This passive
network creates a low-pass filter at the ADC input; therefore,
the precise values are dependent on the application.
and-hold circuit, followed by a pipelined, switched capacitor
ADC. The quantized outputs from each stage are combined into
a final 14-bit result in the digital correction logic. Alternately,
the 14-bit result can be processed through the NSR block before
it is sent to the digital correction logic.
In intermediate frequency (IF) undersampling applications,
any shunt capacitors should be reduced. In combination with
the driving source impedance, the shunt capacitors limit the
input bandwidth. For more information on this subject, see the
Approach to Interfacing Amplifiers to Switched-Capacitor ADCs
;
and the
Analog Dialogue
article, “Transformer-Coupled Front-End
The pipelined architecture permits the first stage to operate on
a new input sample and the remaining stages to operate on the
preceding samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor digital-
to-analog converter (DAC) and an interstage residue amplifier
(MDAC). The residue amplifier magnifies the difference between
the reconstructed DAC output and the flash input for the next
stage in the pipeline. One bit of redundancy is used in each stage
to facilitate digital correction of flash errors. The last stage
simply consists of a flash ADC.
BIAS
S
S
C
FB
C
C
S
The input stage of each channel contains a differential sampling
circuit that can be ac- or dc-coupled in differential or single-ended
modes. The output staging block aligns the data, corrects errors,
and passes the data to the output buffers. The output buffers are
powered from a separate supply, allowing adjustment of the output
drive current. During power-down, the output buffers go into a
high impedance state.
VIN+
VIN–
C
PAR1
C
C
PAR2
S
H
S
S
S
C
FB
C
PAR1
PAR2
S
BIAS
channels, making it ideal for diversity reception and digital pre-
distortion (DPD) observation paths in telecommunication systems.
Figure 35. Switched Capacitor Input
For best dynamic performance, match the source impedances
driving the VIN+ and VIN− pins.
Synchronization capability is provided to allow synchronized
timing between multiple channels or multiple devices.
An internal differential reference buffer creates positive and
negative reference voltages that define the input div of the ADC
using a 3-wire SPI-compatible serial interface.
core. The div of the ADC core is set by this buffer to 2 × V
REF
.
Input Common Mode
ANALOG INPUT CONSIDERATIONS
In ac-coupled applications, the user must provide this bias
externally. An on-board common-mode voltage reference is
included in the design and is available from the VCMx pins.
Optimum performance is achieved when the common-mode
voltage of the analog input is set by the VCMx pin voltage
(typically 0.5 ×
A
V
DD). The VCMx pins must be decoupled
to ground by a 0.1 µF capacitor.
capacitor circuit that has been designed for optimum perfor-
mance while processing a differential input signal.
The clock signal alternatively switches the input between sample
to sample mode, the signal source must be capable of charging
the sample capacitors and settling within 1/2 of a clock cycle.
Rev. A | Page 19 of 36
AD6657A
Data Sheet
Differential Input Configurations
The signal characteristics must be considered when selecting
a transformer. Most RF transformers saturate at frequencies
below a few megahertz (MHz). Excessive signal power can also
cause core saturation, which leads to distortion.
in a differential input configuration. For baseband applications,
provide excellent performance and a flexible interface to the ADC.
At input frequencies in the second Nyquist zone and above, the
noise performance of most amplifiers is not adequate to achieve
which SNR is a key parameter, differential double balun coupling
configuration, the input is ac-coupled and the CML is provided to
each input through a 33 Ω resistor. These resistors compensate
for losses in the input baluns to provide a 50 Ω impedance to
the driver.
driver can be configured in a Sallen-Key filter topology to provide
band limiting of the input signal.
15pF
200Ω
33Ω
5pF
15Ω
15Ω
90Ω
VIN–
VIN+
AVDD
ADC
VCM
76.8Ω
VIN
In the double balun and transformer configurations, the value
of the input capacitors and resistors is dependent on the input
frequency and source impedance and may need to be reduced
network. At higher input frequencies, good performance can be
achieved by using a ferrite bead in series with a resistor and
removing the capacitors. However, these values are dependent
on the input signal and should be used as a starting guide only.
ADA4938-2
0.1µF
33Ω
120Ω
15pF
200Ω
For baseband applications where SNR is a key parameter,
differential transformer coupling is the recommended input
analog input, the VCM voltage can be connected to the center
tap of the secondary winding of the transformer.
Table 10. Example RC Network
Frequency
Range
(MHz)
R1 Series
(Each)
R2 Series
C2 Shunt
C2
C1 Differential
(Each)
(Each)
R2
0 to 100
100 to 200
100 to 300
33 Ω
10 Ω
5 pF
5 pF
Remove
15 Ω
10 Ω
66 Ω
15 pF
10 pF
Remove
VIN+
R1
2V p-p
49.9Ω
C1
R1
ADC
VCM
R2
1
In this configuration, R1 is a ferrite bead with a value of 10 Ω @ 100 MHz.
VIN–
An alternative to using a transformer-coupled input at frequen-
data sheet.
0.1µF
C2
Figure 37. Differential Transformer-Coupled Configuration
C2
0.1µF
0.1µF
0.1µF
R1
R2
VIN+
2V p-p
33Ω
33Ω
P
S
S
P
C1
R1
ADC
A
0.1µF
R2
VCM
VIN–
C2
Figure 38. Differential Double Balun Input Configuration
V
CC
0.1µF
0.1µF
0Ω
16
1
8, 13
11
0.1µF
0.1µF
ANALOG INPUT
R
R
VIN+
200Ω
2
C
ADC
C
D
R
R
D
G
AD8352
10
3
4
5
200Ω
VCM
VIN–
14
0.1µF
ANALOG INPUT
0Ω
0.1µF
0.1µF
Rev. A | Page 20 of 36
Data Sheet
AD6657A
ANALOG
INPUT
XFMR 1:4 Z
ETC4-1T-7
33Ω
33Ω
0.1µF
0.1µF
121Ω
121Ω
431nH
3.0kΩ
0.1µF
0.1µF
INPUT
Z = 50Ω
3.0pF
ADC
INTERNAL
INPUT Z
0.1µF
VCM
Figure 40. 1:4 Transformer Passive Configuration
1000pF 180nH
220nH
1µH
1µH
15pF
165Ω
VPOS
AD6657A
AD8376
301Ω
5.1pF
3.9pF
165Ω
VCM
1nF
3.0kΩ║3.0pF
1nF
68nH
180nH 220nH
1000pF
NOTES
1. ALL INDUCTORS ARE COILCRAFT 0603CS COMPONENTS
WITH THE EXCEPTION OF THE 1µH CHOKE INDU
C
T
ORS (0603LS).
source is converted from a single-ended signal to a differential
signal using either an RF balun or an RF transformer.
example of a 1:4 transformer passive configuration where a
differential inductor is used to resonate with the internal input
able gain amplifier (VGA). This configuration is recommended
when signal gain is required.
The RF balun configuration is recommended for clock frequencies
between 125 MHz and 625 MHz, and the RF transformer config-
uration is recommended for clock frequencies from 10 MHz to
200 MHz. The back-to-back Schottky diodes across the trans-
to approximately 0.8 V p-p differential. This limit helps to prevent
the large voltage swings of the clock from feeding through to
fall times of the signal that are critical to a low jitter performance.
CLOCK INPUT CONSIDERATIONS
inputs, CLK+ and CLK−, with a differential signal. The signal is
typically ac-coupled into the CLK+ and CLK− pins via a trans-
former or capacitors. These pins are biased internally and require
ADT1-1WT, 1:1Z
AVDD
0.1µF
0.1µF
XFMR
CLOCK
INPUT
CLK+
ADC
100Ω
50Ω
1.2V
0.1µF
CLK–
CLK+
CLK–
SCHOTTKY
DIODES:
HSMS2822
0.1µF
2pF
2pF
Figure 43. Transformer-Coupled Differential Clock (Up to 200 MHz)
Figure 42. Equivalent Clock Input Circuit
1nF
50Ω
1nF
0.1µF
0.1µF
CLOCK
INPUT
CLK+
ADC
CLK–
Clock Input Options
clock input can be a CMOS, LVDS, LVPECL, or sine wave signal.
Regardless of the type of signal being used, clock source jitter is
SCHOTTKY
DIODES:
HSMS2822
Figure 44. Balun-Coupled Differential Clock (Up to 625 MHz)
Rev. A | Page 21 of 36
AD6657A
Data Sheet
CLK+ can be driven directly from a CMOS gate. Although
If a low jitter clock source is not available, another option is to
ac couple a differential PECL signal to the sample clock input
jitter performance.
the CLK+ input circuit supply is
A
V
DD (1.8 V), this input is
designed to withstand input voltages of up to 3.6
V
,
m
aking the
V
CC
1k
Ω
1k
Ω
OPTIONAL
100
Ω
0.1µF
0.1µF
0.1µF
1
AD951x
CMOS DRIVER
CLOCK
INPUT
CLK+
ADC
CLK–
0.1µF
0.1µF
50
Ω
CLOCK
INPUT
CLK+
ADC
CLK–
AD951x
100
Ω
PECL DRIVER
0.1µF
0.1µF
CLOCK
INPUT
1
50
Ω
RESISTOR IS OPTIONAL.
240
Ω
240
Ω
50k
Ω
50k
Ω
Figure 48. Single-Ended 3.3 V CMOS Input Clock (Up to 200 MHz)
Figure 45. Differential PECL Sample Clock (Up to 625 MHz)
Input Clock Divider
divide the input clock by integer values from 1 to 8.
A third option is to ac couple a differential LVDS signal to the
drivers offer excellent jitter performance.
external SYNC input. Bit 1 of Register 0x3A enables the clock
divider to be resynchronized on every SYNC signal. A valid
SYNC causes the clock divider to reset to its initial state. This
synchronization feature allows multiple parts to have their clock
dividers aligned to guarantee simultaneous input sampling.
0.1µF
0.1µF
CLOCK
INPUT
CLK+
ADC
CLK–
AD951x
LVDS DRIVER
100
Ω
0.1µF
0.1µF
CLOCK
INPUT
Clock Duty Cycle
50k
Ω
50k
Ω
Typical high speed ADCs use both clock edges to generate
a variety of internal timing signals and, as a result, may be
sensitive to clock duty cycle. Commonly, a
5% tolerance is
required on the clock duty cycle to maintain dynamic perfor-
mance characteristics.
Figure 46. Differential LVDS Sample Clock (Up to 625 MHz)
In some applications, it may be acceptable to drive the sample
clock inputs with a single-ended CMOS signal. In such applica-
tions, drive the CLK+ pin directly from a CMOS gate, and
bypass the CLK− pin to ground with a 0.1 μF capacitor in
(falling) edge, providing an internal clock signal with a nominal
50% duty cycle. This allows the user to provide a wide range of
clock input duty cycles without affecting the performance of the
a wide range of duty cycles with the DCS enabled.
V
CC
OPTIONAL
100
Ω
0.1µF
1
0.1µF
1k
Ω
1k
Ω
AD951x
CMOS DRIVER
CLOCK
INPUT
CLK+
ADC
CLK–
50
Ω
Jitter in the rising edge of the input is of paramount concern and
is not easily reduced by the internal stabilization circuit. The duty
cycle control loop does not function for clock rates at less than
40 MHz nominally. The loop has a time constant associated with
it that must be considered in applications in which the clock
rate can change dynamically. A wait time of 1.5 ꢀs to 5 ꢀs is
required after a dynamic clock frequency increase or decrease
before the DCS loop is relocked to the input signal. During the
time period that the loop is not locked, the DCS loop is bypassed,
and internal device timing is dependent on the duty cycle of the
input clock signal.
0.1µF
39k
Ω
1
50
Ω
RESISTOR IS OPTIONAL.
Figure 47. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
Rev. A | Page 22 of 36
Data Sheet
AD6657A
1.5
1.4
1.3
1.2
1.1
1.0
0.60
Jitter Considerations
0.55
High speed, high resolution ADCs are sensitive to the quality of
the clock input. The degradation in SNR from the low frequency
SNR (SNR
LF
) at a given input frequency (f
IN
) due to jitter (t
JRMS
can be calculated by
0.50
I
AVDD
0.45
0.40
)
0.9
0.8
0.7
0.6
0.5
TOTAL POWER
0.35
0.30
SNR
HF
= −10log[(2π ×
f
IN
×
t
JRMS
) +
10
(−SNR
]
2
/10)
LF
0.25
0.20
In the equation, the rms aperture jitter represents the clock
input jitter specification. IF undersampling applications are
80
0.4
0.3
0.15
I
DRVDD
0.10
0.05
0
0.2
0.1
0
0.05ps
30 40 50 60 70 80 90
10
0
1
1
0
1
2
0
1
3
0
1
4
0
1
5
0
1
6
0
1
7
0
1
8
0
1
90 200
75
SAMPLING FREQUENCY (MSPS)
Figure 50. Power and Current vs. Sampling Frequency
70
0.20ps
By asserting PDWN (either through the SPI port or by asserting
mode. In this state, the ADC typically dissipates 4.5 m
W
.
During power-down, the output drivers are placed in a high
impedance state. Asserting the PDWN pin low returns the
AD6657A
to its normal operating mode. Note that PDWN is
referenced to the digital output driver supply (DRVDD) and
should not exceed that supply voltage.
65
0.50ps
60
55
50
1.00ps
1.50ps
1
10
100
1k
INPUT FREQUENCY (MHz)
Low power dissipation in power-down mode is achieved by
shutting down the reference, reference buffer, biasing networks,
and clock. Internal capacitors are discharged when entering
power-down mode and must be recharged when returning to
normal operation. As a result, wake-up time is related to the
time spent in power-down mode; shorter power-down cycles
result in proportionally shorter wake-up times.
Figure 49. SNR vs. Input Frequency and Jitter
In cases where aperture jitter may affect the dynamic range of
power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal controlled oscillators make
the best clock sources. If the clock is generated from another type
of source (by gating, dividing, or another method), it should be
tion about jitter performance as it relates to ADCs (available at
When using the SPI port interface, the user can place the ADC
in power-down mode or standby mode. Standby mode allows
the user to keep the internal reference circuitry powered when
Descriptions
section for more details.
CHANNEL/CHIP SYNCHRONIZATION
POWER DISSIPATION AND STANDBY MODE
synchronization options for synchronizing the clock divider. The
clock divider sync feature is useful for guaranteeing synchronized
sample clocks across multiple ADCs.
significantly because it is determined primarily by the DRVDD
supply and the bias current of the LVDS drivers.
The SYNC input is internally synchronized to the sample clock;
however, to ensure that there is no timing uncertainty between
multiple parts, externally synchronize the SYNC input signal to
the input clock signal, meeting the setup and hold times shown
type signal.
Reducing the capacitive load presented to the output drivers can
obtained using the same operating conditions as those used in
load on each output driver.
Rev. A | Page 23 of 36
AD6657A
Data Sheet
Minimize the length of the output data lines and minimize the
because these transients can degrade converter dynamic per-
formance.
DIGITAL OUTPUTS
LVDS outputs using a DRVDD supply voltage of 1.8
V
.
T
he
that require the ADC to drive large capacitive loads or large
fanouts may require external buffers or latches.
At clock rates below 40 MSPS, dynamic performance can degrade.
Data Clock Output (DCO)
High Speed ADCs via SPI
, the data format can be selected for
offset binary or twos complement when using the SPI control.
intended for capturing the data in an external register. The
output data for Channel A and Channel C is valid when DCO
is high; the output data for Channel B and Channel D is valid
TIMING
nine clock cycles. Data outputs are available one propagation
delay (t
PD
) after the rising edge of the clock signal.
Table 11. Output Data Format
Input (V)
Condition (V)
< −V
REF
− 0.5 LSB
= −V
REF
Offset Binary Output Mode
Twos Complement Mode
100 0000 0000
100 0000 0000
000 0000 0000
011 1111 1111
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
000 0000 0000
000 0000 0000
100 0000 0000
111 1111 1111
111 1111 1111
= 0
= +V
REF
− 1.0 LSB
> +V
REF
− 0.5 LSB
011 1111 1111
Rev. A | Page 24 of 36
Data Sheet
AD6657A
NOISE SHAPING REQUANTIZER
higher than an 11-bit SNR to be maintained in a subset of the
Nyquist band. The harmonic performance of the receiver is
unaffected by the NSR feature.
different tuning words.
0
185MSPS
140.3MHz @ –1dBFS
When enabled, the NSR contributes an additional 0.6 dB of
loss to the input signal, such that a 0 dBFS input is reduced to
−0.6 dBFS at the output pins.
NSR 22% BW MODE, TW = 13
SNR = 73.4dB (75.0dBFS)
SFDR = 91dBc
–20
–40
–60
The NSR feature can be independently controlled per channel
via the SPI or via the MODE pin.
THIRD HARMONIC
–80
–100
–120
Two different bandwidth modes are provided; the mode can be
selected from the SPI port. In each of the two modes, the center
frequency of the band can be tuned such that IFs can be placed
anywhere in the Nyquist band.
22% BW MODE (>40 MHz at 184.32 MSPS)
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
The first bandwidth mode offers excellent noise performance
over 22% of the ADC sample rate (44% of the Nyquist band)
and can be centered by setting the NSR mode bits in the NSR
control register (Address 0x3C) to 000. In this mode, the useful
frequency range can be set using the 6-bit tuning word in the
NSR tuning word register (Address 0x3E).
Figure 51. 22% BW Mode, Tuning Word = 13
0
–20
–40
–60
185MSPS
140.3MHz @ –1dBFS
NSR 22% BW MODE, TW = 28
SNR = 73.4dB (75.0dBFS)
SFDR = 91dBc
There are 57 possible tuning words (TW); each step is 0.5% of
the ADC sample rate. The following three equations describe
the left band edge (f
0
), the channel center (f
CENTER
), and the right
band edge (f
1
), respectively.
THIRD HARMONIC
–80
–100
–120
f
0
=
f
ADC
× .005 ×
TW
f
CENTER
=
f
0
+ 0.11 ×
f
ADC
f
1
=
f
0
+ 0.22 ×
f
ADC
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 52. 22% BW Mode, Tuning Word = 28 (f
S
/4 Tuning)
0
185MSPS
140.3MHz @ –1dBFS
NSR 22% BW MODE, TW = 41
SNR = 73.4dB (75.0dBFS)
SFDR = 91dBc
–20
–40
–60
THIRD HARMONIC
–80
–100
–120
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 53. 22% BW Mode, Tuning Word = 41
Rev. A | Page 25 of 36
AD6657A
Data Sheet
0
–20
–40
–60
33% BW MODE (>60 MHz AT 184.32 MSPS)
185MSPS
140.3MHz @ –1dBFS
NSR 33% BW MODE, TW = 17
SNR = 70.9dB (72.5dBFS)
SFDR = 91dBc
The second bandwidth mode offers excellent noise performance
over 33% of the ADC sample rate (66% of the Nyquist band)
and can be centered by setting the NSR mode bits in the NSR
control register (Address 0x3C) to 001. In this mode, the useful
frequency range can be set using the 6-bit tuning word in the
NSR tuning word register (Address 0x3E).
THIRD HARMONIC
–80
–100
–120
There are 34 possible tuning words (TW); each step is 0.5% of
the ADC sample rate. The following three equations describe
the left band edge (f
0
), the channel center (f
CENTER
), and the right
band edge (f
1
), respectively.
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
f
0
=
f
ADC
× .005 ×
TW
f
CENTER
=
f
0
+ 0.165 ×
f
ADC
Figure 56. 33% BW Mode, Tuning Word = 17
f
1
=
f
0
+ 0.33 ×
f
ADC
different tuning words.
0
185MSPS
140.3MHz @ –1dBFS
NSR 33% BW MODE, TW = 5
SNR = 70.9dB (72.5dBFS)
SFDR = 91dBc
–20
–40
–60
THIRD HARMONIC
–80
–100
–120
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 54. 33% BW Mode, Tuning Word = 5
0
–20
–40
–60
185MSPS
140.3MHz @ –1dBFS
NSR 33% BW MODE, TW = 17
SNR = 71.1dB (72.7dBFS)
SFDR = 91dBc
THIRD HARMONIC
–80
–100
–120
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 55. 33% BW Mode, Tuning Word = 17 (f
S
/4 Tuning)
Rev. A | Page 26 of 36
Data Sheet
AD6657A
0
–20
–40
–60
36% BW MODE (>65 MHz AT 184.32 MSPS)
185MSPS
140.3MHz @ –1dBFS
NSR 36% BW MODE, TW = 28
SNR = 70.4dB (72.0dBFS)
SFDR = 91dBc
The third bandwidth mode offers excellent noise performance
over 36% of the ADC sample rate (72% of the Nyquist band)
and can be centered by setting the NSR mode bits in the NSR
control register (Address 0x3C) to 010. In this mode, the useful
frequency range can be set using the 6-bit tuning word in the
NSR tuning register (Address 0x3E).
THIRD HARMONIC
–80
–100
–120
There are 28 possible tuning words (TW); each step is 0.5% of
the ADC sample rate. The following three equations describe
the left band edge (f
0
), the channel center (f
CENTER
), and the right
band edge (f
1
), respectively.
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
f
0
=
f
ADC
× .005 ×
TW
f
CENTER
=
f
0
+ 0.18 ×
f
ADC
Figure 59. 36% BW Mode, Tuning Word = 28
f
1
=
f
0
+ 0.36 ×
f
ADC
MODE PIN
different tuning words.
The MODE pin input allows convenient control of the NSR
feature. A logic low enables NSR mode and a logic high sets the
receiver to a straight 11-bit mode with NSR disabled. By default,
the MODE pin is pulled high internally to disable the NSR.
0
185MSPS
140.3MHz @ –1dBFS
NSR 36% BW MODE, TW = 0
SNR = 70.4dB (72.0dBFS)
SFDR = 91dBc
–20
–40
–60
Each channel can be individually configured to ignore the
MODE pin state by writing to Bit 4 of the NSR control register
at Address 0x3C. Use of the NSR control register in conjunction
with the MODE pin allows for very flexible control of the NSR
feature on a per channel basis.
THIRD HARMONIC
–80
–100
–120
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 57. 36% BW Mode, Tuning Word = 0
0
–20
–40
–60
185MSPS
140.3MHz @ –1dBFS
NSR 36% BW MODE, TW = 14
SNR = 70.4dB (72.0dBFS)
SFDR = 91dBc
THIRD HARMONIC
–80
–100
–120
–140
0
9.25 18.50
27.75 37.00 46.25 55.50 64.75 74.00 83.25 92.50
FREQUENCY (MHz)
Figure 58. 36% BW Mode, Tuning Word = 14 (f
S
/4 Tuning)
Rev. A | Page 27 of 36
AD6657A
Data Sheet
BUILT-IN SELF TEST (BIST) AND OUTPUT TEST
the integrity of each channel and to facilitate board-level debug-
ging. A built-in self test (BIST) feature is included that verifies
output test options are also provided to place predictable values
The outputs are not disconnected during this test, so the PN
sequence can be observed as it runs. The PN sequence can be
continued from its last value or reset from the beginning, based
on the value programmed in Register 0x0E, Bit 2. The BIST
signature result varies based on the channel configuration.
OUTPUT TEST MODES
BIST
test mode is enabled, the analog section of the receiver is dis-
connected from the digital back-end blocks, and the test pattern
is run through the output formatting block. Some of the test
patterns are subject to output formatting. The seed value for the
PN sequence tests can be forced if the PN reset bits are used to
hold the generator in reset mode by setting Bit 4 or Bit 5 of
Register 0x0D. These tests can be performed with or without an
analog signal (if present, the analog signal is ignored), but they
The BIST is a thorough test of the digital portion of the selected
AD6657A
signal path. When enabled, the test runs from an
internal pseudorandom noise (PN) source through the digital
datapath starting at the ADC block output. The BIST sequence
runs for 512 cycles and stops. The BIST signature value for the
selected channel is written to Register 0x24 and Register 0x25.
If more than one channel is BIST enabled, the channel that
is first according to alphabetical order is written to the BIST
signature registers. For example, if Channel B and Channel C
are BIST enabled, the results from Channel B are written to the
BIST signature registers.
Rev. A | Page 28 of 36
Data Sheet
AD6657A
SERIAL PORT INTERFACE (SPI)
figure the receiver for specific functions or operations through a
structured internal register space. The SPI provides added flexibility
and customization, depending on the application. Addresses are
accessed via the serial port and can be written to or read from
via the port. Memory is organized into bytes that can be further
During an instruction phase, a 16-bit instruction is transmitted.
The first bit of the first byte in a serial data transfer frame indicates
whether a read command or a write command is issued. Data
follows the instruction phase, and its length is determined by
the W0 and W1 bits. All data is composed of 8-bit words.
The instruction phase determines whether the serial frame is a
read or write operation, allowing the serial port to be used both
to program the chip and to read the contents of the on-chip
memory. If the instruction is a read operation, the serial data
input/output (SDIO) pin changes direction from an input to an
output at the appropriate point in the serial frame.
CONFIGURATION USING THE SPI
SDIO (serial data input/output) is a bidirectional pin that allows
data to be sent to and read from the internal memory map
registers. CSB (chip select bar) is an active low control that
enables or disables the read and write cycles.
Data can be sent in MSB first mode or in LSB first mode. MSB
first is the default mode on power-up and can be changed via
the SPI port configuration register. For more information about
facing to High Speed ADCs via SPI
.
HARDWARE INTERFACE
Table 12. Serial Port Interface Pins
between the user
’
s programming device and the serial port of
inputs when using the SPI interface. The SDIO pin is
bidirectional, functioning as an input during the write phase
and as an output during readback.
Pin
Function
SCLK
Serial clock. Serial shift clock input. SCLK is used to
synchronize serial interface reads and writes.
SDIO
CSB
Serial data input/output. Bidirectional pin that serves
as an input or an output, depending on the instruction
being sent and the relative position in the timing frame.
Chip select bar (active low). This control gates the read
and write cycles.
The SPI interface is flexible enough to be controlled by either
FPGAs or microcontrollers. One method for SPI configuration
controller-Based Serial Port Interface (SPI) Boot Circuit
.
The falling edge of the CSB pin, in conjunction with the rising
edge of the SCLK pin, determines the start of the framing. An
The SPI port should not be active during periods when the full
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
for other devices, it may be necessary to provide buffers between
tioning at the receiver inputs during critical sampling periods.
CSB can be held low indefinitely, which permanently enables
the device; this is called streaming. CSB can stall high between
bytes to allow for additional external timing. When CSB is tied
high, SPI functions are placed in high impedance mode.
t
H
t
DS
t
HIGH
t
CLK
t
S
t
DH
t
LOW
CSB
SCLK
SDIO
DON’T
CARE
DON’T CARE
DON’T
CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DON’T CARE
Figure 60. Serial Port Interface Timing Diagram
Rev. A | Page 29 of 36
AD6657A
Data Sheet
MEMORY MAP
Logic Levels
An explanation of logic level terminology follows:
READING THE MEMORY MAP REGISTER TABLE
Each row in the memory map register table has eight bit loca-
four sections: the chip configuration registers (Address 0x00
and Address 0x01); the channel index and transfer registers
(Address 0x05 and Address 0xFF); the ADC function registers,
including setup, control, and test (Address 0x08 to Address 0x25);
and the digital feature control registers (Address 0x3A to
Address 0x3E).
•
“Bit is set” is synonymous with “bit is set to Logic 1” or
“writing Logic 1 for the bit
.
”
•
“Clear a bit” is synonymous with “bit is set to Logic 0” or
“writing Logic 0 for the bit
.
”
Transfer Register Map
Address 0x08 to Address 0x3E are shadowed. Writes to these
addresses do not affect part operation until a transfer command
is issued by writing 0x01 to Address 0xF
F
,
t
hereby setting the
transfer bit. This allows these registers to be updated internally
and simultaneously when the transfer bit is set. The transfer bit
is autoclearing.
default hexadecimal value for each hexadecimal address shown.
The column with the heading (MSB) Bit 7 is the start of the
Interfacing to High Speed ADCs via SPI
, documents the functions
controlled by Register 0x00 to Register 0xF
F
.
T
he remaining
registers, Register 0x3A to Register 0x3E, are documented in
Channel Specific Registers
Some channel setup functions, such as the NSR control func-
tion, can be programmed differently for each channel. In these
cases, channel address locations are internally duplicated for
as local. Local registers and bits can be accessed by setting the
appropriate channel bits in Register 0x05.
Open Locations
not currently supported for this device. Unused bits of a valid
address location should be written with 0s. Writing to these
locations is required only when part of an address location is
open (for example, Address 0x18). If the entire address location
is open (for example, Address 0x13), this address location should
not be written.
If multiple channel bits are set, the subsequent write affects the
registers of all selected channels. In a read cycle, select a single
channel only to read one of the registers. If multiple channels are
selected during a SPI read cycle, the device returns the value for
affect the entire device or the channel features for which there are
no independent per channel settings. The settings in Register 0x05
do not affect the global registers and bits.
Default Values
default values. The default values for the registers are given in
Rev. A | Page 30 of 36
Data Sheet
AD6657A
MEMORY MAP REGISTER TABLE
All address and bit locations that are not included in
Table 13
are not currently supported for this device.
Table 13. Memory Map Registers
Default
Value
(Hex)
Addr. Register
(Hex) Name
(MSB)
Bit 7
(LSB)
Bit 0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Comments
Chip Configuration Registers
0x00
SPI port
configuration
(global)
Open
LSB first
Soft reset
1
Soft reset
LSB first
Open
0x18
Nibbles are
mirrored so
that LSB first
or MSB first
mode is set
correctly,
1
regardless of
shift mode.
To control
this register,
all channel
index bits in
Register 0x05
must be set.
0x01
Chip ID
(global)
8-bit chip ID, Bits[7:0]
AD6657A
= 0x7B (default)
0x7B
Read only.
Channel Index and Transfer Registers
0x05
Channel
index
Enable
output
port for
Enable
output
port for
Open
Open
Channel D
Channel C
Channel B
Channel A
0xCF
Bits are set to
determine
which
enable
enable
enable
enable
Channel C
Channel A
and and
Channel D
Channel B
channel on
the chip
receives the
next write
command;
applies to
local
registers.
0xFF
Transfer
Open
Open
Open
Open
Open
Open
Open
Open
Open
Open
Open
SW
0x00
0x00
Synchro-
nously
transfers
data from
the master
shift register
to the slave.
transfer
1 = on
0 = off
(default)
ADC Function Registers
External
power-
down pin
function
(global)
0 = full
power-
down
Internal power-down
mode (local)
00 = normal operation
(default)
Determines
generic
modes of
chip opera-
tion.
0x08
Power modes
Open
01 = full power-down
10 = standby
1 =
standby
0x0B
0x0C
Clock divide
(global)
Open
Open
Open
Open
Clock divide phase
Clock divide ratio
0x00
0x01
000 = 0 input clock cycles delayed
001 = 1 input clock cycle delayed
010 = 2 input clock cycles delayed
000 = divide by 1
001 = divide by 2
010 = divide by 3
011 = divide by 4
100 = divide by 5
101 = divide by 6
110 = divide by 7
111 = divide by 8
Shuffle mode
(local)
Open
Open
Open
Open
Shuffle mode enable
00 = shuffle disabled
Enables or
disables
shuffle
01 = shuffle enabled
mode.
Rev. A | Page 31 of 36
AD6657A
Data Sheet
Default
Addr. Register
(Hex) Name
(MSB)
Bit 7
(LSB)
Bit 0
Value
(Hex)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Comments
Output test mode
000 = off (normal operation)
0x00
When set,
the test data
is placed on
the output
pins in place
of normal
data.
0x0D
Test mode
(local)
Open
Open
Reset
long PN
generator generator
0 = on
1 = off
(default)
Reset
short PN
Open
001 = midscale short
010 = positive FS
011 = negative FS
0 = on
1 = off
(default)
100 = alternating checkerboard
101 = PN sequence long
110 = PN sequence short
111 = 1/0 word toggle
0x0E
0x10
BIST enable
(local)
Open
Open
Open
Open
Open
Open
Open
BIST reset
0 = on
1 = off
Open
BIST
0x00
0x00
When Bit 0
is set, the
built-in self
test function
is initiated.
enable
1 = on
0 = off
(default)
(default)
Offset adjust
(local)
Offset adjustment in LSBs from +127 to −128
(twos complement format)
011111 = +31 LSB
011110 = +30 LSB
011101 = +29 LSB
…
Device offset
trim.
000010 = +2 LSB
000001 = +1 LSB
000000 = 0 LSB
…
111111 = −1 LSB
111110 = −2 LSB
111101 = −3 LSB
…
100001 = −31 LSB
100000 = −32 LSB
Output mode
Open
(local)
Open
Open
Open
Open
Output
enable
bar
(local)
1 = off
0 = on
Open
Output
invert
(local)
1 = on
0 = off
Output format (local)
00 = offset binary
01 = twos
0x00
0x01
Configures
the outputs
and the
format of
the data.
0x14
0x15
complement
Output
adjust
(local)
Open
Open
Output port LVDS drive current
0000 = 3.72 mA
Output
current
adjustments.
0001 = 3.5 mA (default)
0010 = 3.3 mA
0011 = 2.96 mA
0100 = 2.82 mA
0101 = 2.57 mA
0110 = 2.27 mA
0111 = 2.0 mA
1000 = 2.0 mA
0x16
0x17
Clock phase
control
(local)
Invert
DCO clock
0 = off
1 = on
Open
Open
Open
Open
Open
Open
Open
Open
Open
0x00
0x00
When Bit 7
is set, clock
polarity is
reversed.
DCO output
delay
(local)
DCO
Output port DCO clock delay
Enable DCO
delay and set
the delay
time.
delay
enable
0 = off
1 = on
00000 = 100 ps additional delay on the DCO pin
00001 = 200 ps additional delay on the DCO pin
00010 = 300 ps additional delay on the DCO pin
…
11101 = 3.0 ns additional delay on the DCO pin
11110 = 3.1 ns additional delay on the DCO pin
11111 = 3.2 ns additional delay on the DCO pin
0x18
V
REF
select
Open
Open
Open
Internal V
REF
full-scale adjustment
Main reference full-scale V
REF
adjustment
01111: internal 2.087 V p-p
…
0x00
Select
adjustments
for V
REF
(global)
.
00001: internal 1.772 V p-p
00000: internal 1.75 V p-p
…
11111: internal 1.727 V p-p
…
10000: internal 1.383 V p-p
Rev. A | Page 32 of 36
Data Sheet
AD6657A
Default
Value
(Hex)
Addr. Register
(Hex) Name
(MSB)
Bit 7
(LSB)
Bit 0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Comments
0x24
BIST
BIST Signature[7:0]
0x00
Read only.
signature LSB
(local)
0x25
BIST signa-
ture MSB
(local)
BIST Signature[15:8]
0x00
Read only.
Digital Feature Control Registers
Master
sync
enable
0 = off
1 = on
0x00
0x00
Control
0x3A
0x3C
Sync control
(global)
Open
Open
Open
Open
Open
Open
Clock divider
sync mode
0 = conti-
Clock
divider
sync
enable
0 = off
1 = on
register to
synchronize
the clock
divider.
nuous
1 = next sync
mode, next
rising edge of
sync resets
clock divider
NSR control
(local)
Open
Open
MODE
pin
disable
0 =
MODE
pin used
1 =
MODE
pin dis-
abled
NSR mode
NSR
Noise
000 = 22% BW mode
001 = 33% BW mode
010 = 36% BW mode
enable
0 = off
1 = on
(used only
if
Bit 4 = 1;
otherwise
ignored)
shaping
requantizer
(NSR)
controls.
0x3E
NSR tuning
word
(local)
Open
Open
NSR tuning word
Equations for the tuning word are dependent on the NSR mode.
0x1C
NSR
frequency
tuning word.
NSR Control (Register 0x3C)
MEMORY MAP REGISTER DESCRIPTIONS
Bits[7:5]—Reserved
For additional information about functions controlled
Bit 4—MODE Pin Disable
Bit 4 specifies whether the selected channels are to be controlled
by the MODE pin. Local registers act on the channels that are
selected by the channel index register (Address 0x05).
Sync Control (Register 0x3A)
Bits[7:3]—Reserved
Bit 2—Clock Divider Sync Mode
Bits[3:1]—NSR Mode
Bit 2 selects the mode of the clock divider sync function. When
Bit 2 is low, continuous sync mode is enabled. When Bit 2 is
high, the clock divider is reset on the next rising edge of the
sync signal. Subsequent rising edges of the sync signal are
ignored.
Bits[3:1] determine the bandwidth (BW) mode of the NSR.
When Bits[3:1] are set to 000, the NSR is configured for a 22%
BW mode that provides enhanced SNR performance over 22%
of the sample rate. When Bits[3:1] are set to 001, the NSR is
configured for a 33% BW mode that provides enhanced SNR
performance over 33% of the sample rate. When Bits[3:1] are
set to 010, the NSR is configured for a 36% BW mode that pro-
vides enhanced SNR performance over 36% of the sample rate.
Bit 1—Clock Divider Sync Enable
Bit 1 gates the sync pulse to the clock divider. The sync signal is
enabled when Bit 1 is high and Bit 0 is high. This is continuous
sync mode.
Bit 0—NSR Enable
The NSR is enabled when Bit 0 is high and disabled when Bit 0
is low. Bit 0 is ignored unless the MODE pin disable bit (Bit 4)
is set.
Bit 0—Master Sync Enable
Bit 0 must be high to enable any of the sync functions. If
the sync capability is not used, this bit should remain low
to conserve power.
Rev. A | Page 33 of 36
AD6657A
Data Sheet
NSR Tuning Word (Register 0x3E)
Bits[7:6]—Reserved
there are 28 possible tuning words. For either mode, each step
represents 0.5% of the ADC sample rate. For the equations used
to calculate the tuning word based on the BW mode of
Bits[5:0]—NSR
T
u
ning
W
o
rd
The NSR tuning word sets the band edges of the NSR band. In
22% BW mode, there are 57 possible tuning words; in 33% BW
mode, there are 34 possible tuning words; in 36% BW mode,
Rev. A | Page 34 of 36
Data Sheet
AD6657A
APPLICATIONS INFORMATION
VCMx Pins
DESIGN GUIDELINES
The VCMx pins are provided to set the common-mode level
of the analog inputs. Decouple the VCMx pins to ground with a
system, it is recommended that the designer become familiar
with these guidelines, which discuss the special circuit
connections and layout requirements needed for certain pins.
SPI Port
Power and Ground Recommendations
The SPI port should not be active during periods when the full
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
for other devices, it may be necessary to provide buffers between
tioning at the receiver inputs during critical sampling periods.
that two separate 1.8 V supplies be used. Use one supply for
analog (
A
V
DD); use a separate supply for the digital outputs
(DRVDD). The AVDD and DRVDD supplies should be isolated
with separate decoupling capacitors. Several different decoupling
capacitors can be used to cover both high and low frequencies.
Locate these capacitors close to the point of entry at the PCB
level and close to the pins of the part, with minimal trace length.
With proper decoupling and smart partitioning of the PCB
analog, digital, and clock sections, optimum performance is
easily achieved.
Rev. A | Page 35 of 36
AD6657A
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
10.10
A1 BALL
CORNER
10.00 SQ
9.90
A1 BALL
CORNER
12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
8.80
BSC SQ
G
H
J
0.80
K
L
M
0.60
REF
TOP VIEW
DETAIL A
BOTTOM VIEW
*
1.40 MAX
0.65 MIN
DETAIL A
0.25 MIN
0.50
0.45
0.40
COPLANARITY
0.20
SEATING
PLANE
BALL DIAMETER
*
COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1
WITH EXCEPTION TO PACKAGE HEIGHT.
Figure 61. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
BC-144-1
BC-144-1
AD6657ABBCZ
AD6657ABBCZRL
AD6657AEBZ
−40°C to +85°C
−40°C to +85°C
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
1
Z = RoHS Compliant Part.
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09684-0-2/14(A)
Rev. A | Page 36 of 36
