Analog-Devices-ADRF5040BCPZ-R7

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Analog-Devices-ADRF5040BCPZ-R7
High Isolation, Silicon SP4T,  
Nonreflective Switch, 9 kHz to 12.0 GHz  
Data Sheet  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Nonreflective 50 Ω design  
Positive control range: 0 V to 3.3 V  
Low insertion loss: 0.8 dB at 8.0 GHz  
High isolation: 34 dB at 8.0 GHz  
High power handling  
33 dBm through path  
27 dBm termination path  
GND 1  
GND 2  
RFC 3  
GND 4  
GND 5  
GND 6  
GND  
18  
ADRF5040  
17 V  
16 V  
15 V  
14 V  
DD  
1
50
Ω
 
50
Ω  
High linearity  
2
1 dB compression (P1dB): 37 dBm typical  
Input third-order intercept (IIP3): 58 dBm typical at 8.0 GHz  
ESD rating: 4 kV human body model (HBM)  
4 mm × 4 mm, 24-lead LFCSP package  
No low frequency spurious  
SS  
50
Ω  
50
Ω  
13 GND  
PACKAGE  
BASE  
RF settling time (0.05 dB margin of final RF

OUT

): 9 µs  
GND  
APPLICATIONS  
Figure 1.  
Test instrumentation  
Microwave radios and very small aperture terminals (VSATs)  
Military radios, radars, and electronic counter measures (ECMs)  
Fiber optics and broadband telecommunications  
GENERAL DESCRIPTION  
The

is a general-purpose, broadband high isolation,  
nonreflective single-pole, quad-throw (SP4T) switch in an LFCSP  
surface-mount package. Covering the 9 kHz to 12.0 GHz range,  
the switch offers high isolation and low insertion loss. The  
switch features 34 dB isolation and 0.8 dB insertion loss up to  
8.0 GHz, and a 9 µs settling time of 0.05 dB margin of the final  
radio frequency output (RF

OUT

). The switch operates using  
positive control voltage of 3.3 V and 0 V and requires +3.3 V and  
−3.3 V supplies. The

is packaged in a 4 mm × 4 mm,  
surface-mount LFCSP package.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
right
s
o
f third parties that may result fro
m
i
ts use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks an
d
r
egistere
d
t
rademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700
 
©2016–2017 Analog Devices, Inc. All rights reserved.  
 
 
 
 

ADRF5040  
Data Sheet  
TABLE OF CONTENTS  
REVISION HISTORY  
7/2017—Rev. A to Rev. B  
Changes to Figure 2, Figure 3, and Figure 4……………………………. 5  
2/2017—Rev. 0 to Rev. A  
Changes to Ordering Guide …………………………………………………. 14  
7/2016—Revision 0: Initial Version  
Rev. B | Page 2 of 14  
 

Data Sheet  
ADRF5040  
SPECIFICATIONS  
ELECTRICAL SPECIFICATIONS  
V

DD

= 3.3
V
,
V

SS

= −3.3
V
,
V

1

and V

2

= 0 V or V

DD

, T

A

= 25°C, 50 Ω system, unless otherwise noted.  
Table 1.  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
INSERTION LOSS  
9 kHz to 4.0 GHz  
9 kHz to 8.0 GHz  
9 kHz to 10.0 GHz  
9 kHz to 12.0 GHz  
0.7  
0.8  
1.1  
2
dB  
dB  
dB  
dB  
ISOLATION, RFC TO RF1 TO RF4 (WORST CASE)  
9 kHz to 4.0 GHz  
9 kHz to 8.0 GHz  
9 kHz to 10.0 GHz  
9 kHz to 12.0 GHz  
44  
34  
29.2  
20  
dB  
dB  
dB  
dB  
RETURN LOSS  
On State  
9 kHz to 4.0 GHz  
9 kHz to 8.0 GHz  
9 kHz to 10.0 GHz  
9 kHz to 12.0 GHz  
9 kHz to 4.0 GHz  
9 kHz to 8.0 GHz  
9 kHz to 10.0 GHz  
9 kHz to 12.0 GHz  
21  
19  
13.5  
8
25  
18.6  
15.5  
14.5  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
Off State  
RADIO FREQUENCY (RF) SETTLING TIME  
50% V

1

/V

2

to 0.05 dB margin of final RF

OUT  

50% V

1

/V

2

to 0.1 dB margin of final RF

OUT  

9
7
µs  
µs  
SWITCHING SPEED  
t

RISE

/t

F
A
LL  

t

ON

/t

OFF  

10% to 90% RF

OUT  

50% V

1

/V

2

to 90%/10% RF  
9 kHz to 12.0 GHz  
1.3  
3.5  
µs  
µs  
INPUT POWER  
1 dB Compression (P1dB)  
0.1 dB Compression (P0.1dB)  
INPUT THIRD-ORDER INTERCEPT (IIP3)  
37  
34  
dBm  
dBm  
Two-tone input power = 14 dBm at each tone  
1 MHz to 2.0 GHz  
1 MHz to 8.0 GHz  
62  
58  
53  
dBm  
dBm  
dBm  
1 MHz to 12.0 GHz  
RECOMMENDED OPERATING CONDITIONS  
Positive Supply Voltage (V

DD

)  
Negative Supply Voltage (V

SS

)  
Control Voltage (V

1

, V

2

) Range  
RF Input Power  
3.0  
−3.6  
0
3.6  
−3.0  
V

DD  

V
V
V
V

DD

= 3.3 V, V

SS

= −3.3 V, T

A

= 85°C, frequency = 2 GHz  
V

DD

= 3.3 V, T

A

= 85°C, frequency = 2 GHz  
Through Path  
Termination Path  
Hot Switch Power Level  
33  
27  
27  
+85  
dBm  
dBm  
dBm  
°C  
Case Temperature Range (T

CASE  

)
−40  
Rev. B | Page 3 of 14  
 
 
 

ADRF5040  
Data Sheet  
DIGITAL CONTROL VOLTAGE SPECIFICATIONS  
V

DD

= 3.3 V
 
10%, V

SS

= −3.3 V
 
10%, T

CASE

= −40°C to +85°C, unless otherwise noted.  
Table 2.  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition/Comments  
<1 µA typical  
INPUT CONTROL VOLTAGE (V

1

, V

2

)  
Low  
High  
V

IL  

V

IH  

0
1.4  
0.8  
V

DD

+ 0.3  
V
V
BIAS AND SUPPLY CURRENT SPECIFICATIONS  
T

CASE

= −40°C to +85°C, unless otherwise noted.  
Table 3.  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
SUPPLY CURRENT  
V

DD

= 3.3 V  
V

SS

= −3.3 V  
I

DD  

I

SS  

20  
20  
100  
100  
µA  
µA  
Rev. B | Page 4 of 14  
 
 
 

Data Sheet  
ADRF5040  
ABSOLUTE MAXIMUM RATINGS  
5
0
Table 4.  
Parameter  
Rating  
Positive Supply Voltage (V

DD

) Range  
Negative Supply Voltage (V

SS

) Range  
Control Voltage (V

1

, V

2

) Range  
−0.3 V to +3.7 V  
−3.7 V to +0.3 V  
−0.3 V to V

DD

+ 0.3 V  
–5  
RF Input Power

1

(V

DD

, V

1

, V

2

= 3.3 V, V

SS

=  
−3.3 V, T

A

= 85°C, Frequency = 2 GHz)  
Through Path  
Termination Path  
Hot Switch Power Level (V

DD

= 3.3 V,  
T

A

= 85°C, Frequency = 2 GHz)  
–10  
–15  
–20  
34 dBm  
28 dBm  
30 dBm  
Storage Temperature Range  
Channel Temperature  
−65°C to +150°C  
135°C  
0.01  
0.1  
1
10  
100  
1k  
10k  
FREQUENCY (MHz)  
Thermal Resistance (Channel to Package  
Bottom)  
Figure 3. Power Derating for Terminated Path  
Through Path  
Terminated Path  
MSL Rating  
83°C/W  
100°C/W  
MSL3  
5
0
ESD Sensitivity  
Human Body Model (HBM)  
Charged Device Model (CDM)  
4 kV (Class 3)  
1.25 kV  
–5  

1

For the recommended operating conditions, s

Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
–10  
–15  
–20  
0.01  
0.1  
1
10  
100  
1k  
FREQUENCY (MHz)  
Figure 4. Power Derating for Hot Switching Power  
5
0
ESD CAUTION  
–5  
–10  
–15  
–20  
–25  
0.01  
0.1  
1
10  
100  
1k  
10k  
FREQUENCY (MHz)  
Figure 2. Power Derating for Through Path  
Rev. B | Page 5 of 14  
 
 

ADRF5040  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
1
2
3
18  
17  
16  
15  
14  
13  
GND  
GND  
RFC  
GND  
V
V
V
V
DD  
1
ADRF5040  
TOP VIEW  
GND 4  
2
(Not to Scale)  
5
6
GND  
GND  
SS  
GND  
PACKAGE  
BASE  
GND  
NOTES  
1. EXPOSED PAD. THE EXPOSED PAD MUST BE  
CONNECTED TO THE RF/DC GROUND OF THE  
PRINTED CIRCUIT BOARD (PCB).  
Figure 5. Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.
 
Mnemonic  
Description  
1, 2, 4 to 7, 9, 10, 12, 13,
 
GND  
18, 19, 21, 22, 24  
Ground. The package bottom has an exposed metal pad that must connect to the printed circuit  
board (PCB) RF/dc ground. S

for the GND interface schematic.  
3
RFC  
RF4  
RF3  
RF Common Port. This pin is dc-coupled and matched to 50 Ω. A dc blocking capacitor is required  
if the RF line potential is not equal to 0 V dc.  
RF4 Port. This pin is dc-coupled and matched to 50 Ω. A dc blocking capacitor is required if the RF  
line potential is not equal to 0 V dc.  
RF3 Port. This pin is dc-coupled and matched to 50 Ω. A dc blocking capacitor is required if the RF  
line potential is not equal to 0 V dc.  
8
11  
14  
15  
16  
17  
20  
V

SS  

V

2  

V

1  

V

DD  

RF2  
Negative Supply Voltage Pin.  
Control Input Pin 2. See

an

Control Input Pin 1. See

an

Positive Supply Voltage.  
RF2 Port. This pin is dc-coupled and matched to 50 Ω. A dc blocking capacitor is required if the RF  
line potential is not equal to 0 V dc.  
23  
RF1  
RF1 Port. This pin is dc-coupled and matched to 50 Ω. A dc blocking capacitor is required if the RF  
line potential is not equal to 0 V dc.  
EPAD  
Exposed Pad. The exposed pad must be connected to the RF/dc ground of the PCB.  
Table 6. Truth Table  
Digital Control Inputs  
V

1  

V

2  

Signal Path State  
RFC to RF1  
RFC to RF2  
RFC to RF3  
RFC to RF4  
Low  
High  
Low  
High  
Low  
Low  
High  
High  
Rev. B | Page 6 of 14  
 
 

Data Sheet  
ADRF5040  
INTERFACE SCHEMATICS  
V
DD  
GND  
V
1
Figure 6. GND Interface Schematic  
Figure 8. V

1

Interface Schematic  
V
DD  
V
2
Figure 7. V

2

Interface Schematic  
Rev. B | Page 7 of 14  
 
 

ADRF5040  
Data Sheet  
TYPICAL PERFORMANCE CHARACTERISTICS  
INSERTION LOSS, RETURN LOSS, AND ISOLATION  
V

DD

= 3.3
V
, V
 

SS

= −3.3
V
,
T

CASE

= 25°C, unless otherwise specified.  
0
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
–3.0  
–0.5  
–1.0  
RFC TO RF1  
RFC TO RF2  
RFC TO RF3  
RFC TO RF4  
–1.5  
–2.0  
–2.5  
T
T
T
T
= +105°C  
= +85°C  
= +25°C  
= –40°C  
CASE  
CASE  
CASE  
CASE  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 9. Insertion Loss vs. Frequency  
Figure 12. Insertion Loss vs. Frequency, RFC to RF1 On or RFC to RF4 On  
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
0
–20  
–40  
–60  
RFC TO RF2  
RFC TO RF3  
–80  
RFC TO RF4  
T
T
T
T
= +105°C  
= +85°C  
= +25°C  
= –40°C  
CASE  
CASE  
CASE  
CASE  
–100  
–120  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 10. Insertion Loss vs. Frequency, RFC to RF2 On or RFC to RF3 On  
Figure 13. Isolation vs. Frequency, RFC to RF1 On  
0
–20  
–40  
0
–20  
–40  
–60  
–60  
RFC TO RF1  
RFC TO RF3  
RFC TO RF4  
–80  
–80  
RFC TO RF1  
RFC TO RF2  
RFC TO RF4  
–100  
–100  
–120  
–120  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 11. Isolation vs. Frequency, RFC to RF2 On  
Figure 14. Isolation vs. Frequency, RFC to RF3 On  
Rev. B | Page 8 of 14  
 
 

Data Sheet  
ADRF5040  
V

DD

= 3.3
V
,
V

SS

= −3.3
V
,
T

CASE

= 25°C, unless otherwise specified.  
0
0
–20  
–20  
–40  
–60  
–40  
–60  
–80  
–80  
RF2 TO RF3  
RFC TO RF1  
RFC TO RF2  
RFC TO RF3  
–100  
–120  
–140  
RF2 TO RF4  
RF3 TO RF4  
RF1 TO RF2  
RF1 TO RF3  
RF1 TO RF4  
–100  
–120  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 15. Isolation vs. Frequency, RFC to RF4 On  
Figure 17. Channel to Channel Isolation vs. Frequency, RFC to RF1 On  
0
–5  
0
–5  
–10  
–15  
–20  
–25  
–10  
–15  
–20  
–25  
–30  
–35  
–40  
–30  
RFC  
CH1, CH2, CH3 AND CH4 (OFF)  
CH1, CH2, CH3 AND CH4 (ON)  
–35  
–40  
–45  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 16. Return Loss vs. Frequency, RFC to RF4 On  
Figure 18. Return Loss vs. Frequency, RFC to RF4 On  
Rev. B | Page 9 of 14  

ADRF5040  
Data Sheet  
INPUT POWER COMPRESSION AND INPUT THIRD-ORDER INTERCEPT  
V

DD

= 3.3
V
,
V

SS

= −3.3
V
,
T

CASE

= 25°C, unless otherwise specified.  
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
3.6V  
3.3V  
3V  
+85°C  
+25°C  
–40°C  
0
1
2
3
4
5
6
7
8
9
10 11 12  
0
1
2
3
4
5
6
7
8
9
10 11 12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 19. 0.1 dB Compression Point vs. Frequency over Temperature,  

DD

= 3.3 V, V

SS

= −3.3 V  
Figure 22. 0.1 dB Compression Point vs. Frequency over Voltage,  

CASE

= 25°C  
V
T
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
3.6V  
3.3V  
3V  
+85°C  
+25°C  
–40°C  
0
1
2
3
4
5
6
7
8
9
10 11 12  
0
1
2
3
4
5
6
7
8
9
10 11 12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 20. 1 dB Compression Point vs. Frequency over Temperature,  

DD

= 3.3 V, V

SS

= −3.3 V  
Figure 23. 1 dB Compression Point vs. Frequency over Voltage,  
V
T

CASE

= 25°C  
65  
60  
55  
50  
45  
65  
60  
55  
50  
45  
3.6V  
3.3V  
3V  
T
T
T
= +85°C  
= +25°C  
= –40°C  
CASE  
CASE  
CASE  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 21. Input Third-Order Intercept (IIP3) vs. Frequency over  
Temperature, V

DD

= 3.3 V, V

SS

= −3.3 V  
Figure 24. Input Third-Order Intercept (IIP3) vs. Frequency over Voltage,  

CASE

= 25°C  
T
Rev. B | Page 10 of 14  
 

Data Sheet  
ADRF5040  
INPUT POWER COMPRESSION AND INPUT THIRD-ORDER INTERCEPT, 10 kHz TO 1 GHz  
V

DD

= 3.3
V
,
V

SS

= −3.3 V at T

CASE

= 25°C.  
45  
40  
35  
30  
25  
20  
15  
10  
5
70  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
0.1dB COMPRESSION POINT  
1dB COMPRESSION POINT  
0
0.01  
0.1  
1
10  
100  
1k  
0.01  
0.1  
1
10  
100  
1k  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 25. Input Compression Point vs. Frequency  
Figure 26. Input Third-Order Intercept (IIP3) vs. Frequency  
Rev. B | Page 11 of 14  
 

ADRF5040  
Data Sheet  
THEORY OF OPERATION  
The

requires a positive supply voltage applied to the  
RF1 through RF4 pins are dc-coupled, and dc blocking capacitors  
are required on the RF paths. The design is bidirectional; the  
input and outputs are interchangeable.  
V

DD

pin and a negative voltage supply applied to the V

SS

pin.  
Bypassing capacitors are recommended on the supply lines to  
minimize RF coupling.  
The

does not need any special power-up sequencing,  
and the relative order to power up the V

DD

and V

SS

supplies is not  
important. The V

1

and V

2

control signals can be applied only  
after V

DD

is powered up; this sequence avoids forward biasing  
and causing damage to the internal ESD protection circuits.  
T
u
rn on the RF signal after the device supply settles to a steady  
state.  
The

is controlled via two digital control voltages  
applied to the V

1

pin and the V

2

pin. A small value bypassing  
capacitor is recommended on these digital signal lines to  
improve the RF signal isolation.  
The

is internally matched to 50 Ω at the RF input  
port (RFC) and the RF output ports (RF1, RF2, RF3, and RF4);  
therefore, no external matching components are required. The  
Rev. B | Page 12 of 14  
 

Data Sheet  
ADRF5040  
APPLICATIONS INFORMATION  
leads and backside ground slug must be connected directly to  
the ground plane. The evaluation board is available from Analog  
Devices, Inc. upon request.  
EVALUATION BOARD  
The

evaluation board shown in

is  
designed using proper RF circuit design techniques. Signal lines  
at the RF port have 50 Ω impedance, and the package ground  
J4  
J5  
VDD  
V1  
RF1  
RF2  
J1  
U1  
GND  
V2  
RFC  
RF4  
RF3  
VSS  
J2  
J3  
Figure 27. Evaluation PCB  
Table 7. Bill of Materials for the

Evaluation Board  
Item  
Description  
J1 to J5  
TP1 to TP5  
C1, C6  
U1  
PC mount SMA RF connectors  
Through hole mount test points  
100 pF capacitors, 0402 package  

ADRF5040

SP4T switch  
PCB  
600-00598-00-3 evaluation PCB, Rogers 4350 circuit board material  
Rev. B | Page 13 of 14  
 
 
 

ADRF5040  
Data Sheet  
OUTLINE DIMENSIONS  
DETAIL A  
(JEDEC 95)  
4.10  
4.00 SQ  
3.90  
0.30  
0.25  
0.18  
PIN 1  
INDICATOR  
PIN 1  
INDIC ATOR
 
AREA OPTIONS  
(SEE DETAIL A)  
24  
19  
18  
1
0.50  
BSC  
2.85  
2.70 SQ  
2.55  
EXPOSED  
PAD  
13  
12  
6
7
0.50  
0.40  
0.30  
0.20 MIN  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.90  
0.85  
0.80  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGD-8.  
Figure 28. 24-Lead Lead Frame Chip Scale Package [LFCSP]  
4 mm × 4 mm Body and 0.85 mm Package Height  
(CP-24-16)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Package  
Option  
Model

1  

Temperature Range  
MSL Rating

2

Package Description  
Branding

3  

ADRF  
ADRF5040BCPZ  
−40°C to +85°C  
MSL3  
24-Lead Lead Frame Chip Scale Package [LFCSP]  
CP-24-16  
5040  
#
X
XXXX  
ADRF  
ADRF5040BCPZ-R7 −40°C
 
to +85°C  
ADRF5040-EVALZ  
MSL3  
24-Lead Lead Frame Chip Scale Package [LFCSP]  
Evaluation Board  
CP-24-16  
5040  
#
X
XXXX  

1

These models are RoHS Compliant Parts.  

2

See th

section.  

3

XXXXX is the 5-digit lot number.  
©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D14290-0-7/17(B)  
Rev. B | Page 14 of 14