Analog-Devices-HMC656-SX
| Part # | Analog-Devices-HMC656-SX |
Download  | Analog-Devices-HMC656-SX |
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Typical Applications
Features
Wide Bandwidth:
DC – 50 GHz
The HMC650 through HMC658 are ideal for:
• Fiber
Optics
9 Attenuator Products:
0, 2, 3, 4, 6, 10, 15, & 20 dB Fixed Levels
• Microwave
Radio
Power Handling: +25 dBm
• Military
& Space Hybrids
• Test
& Measurement
HMC651 & HMC658
Die Size: 0.57 x 0.45 x 0.1 mm
• Scientific
Instruments
HMC650, HMC652, HMC653, HMC654
HMC655, HMC656 & HMC657
• RF
/ Microwave Circuit Prototyping
Die Size: 0.42 x 0.45 x 0.1 mm
Included in the HMC-DK006 Designer’s Kit
2
Functional Diagrams
General Description
The HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657
/ 658 are a line of wideband fixed value 50 Ohm mat-
ched attenuator chips which offer relative attenuation
levels of 0, 2, 3, 4, 6, 10, 15 and 20 dB. These passive
though-lines and attenuators are ideal for microstrip,
hybrid, and multi-chip module applications where
extremely flat attenuation, and excellent VSWR vs.
frequency are required.
These wideband attenuators feature low inductance
on-chip vias, and require no additional ground
connections. The HMC650 through HMC658 are
backside metallized with gold, and are suitable for
eutectic or epoxy die attach. Each of the 9 products
can be purchased individually by their respective
part number or in a set of 10 each in the HMC-DK006
Fixed Attenuator Chip Designer’s Kit.
HMC650, HMC652, HMC653, HMC654,
HMC655, HMC656 & HMC657
HMC651, HMC658
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Application Support: Phone: 1-800-ANALOG-D
2 – 1
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Electrical Specifications,
T
A
= +25° C, 50 Ohm system
[1]
Return Loss
Attenuation Tolerance
Return Loss
Attenuation Tolerance
Units
GHz
dB
Part Number
Attenuator Value
DC – 25
0.2
25 – 50
0.8
HMC650
HMC651
HMC652
HMC653
HMC654
HMC655
HMC656
HMC657
HMC658
Thru Line (short)
Thru Line (long)
2 dB
20.3
19.0
22.0
23.0
20.5
16.5
16.9
20.0
17
.
5
12.4
12.3
15.3
22.1
22.4
17.0
18.8
19.7
16.2
0.3
0.9
dB
0.2
0.6
dB
3 dB
0.2
0.5
dB
4 dB
0.2
0.5
dB
6 dB
0.2
0.6
dB
10 dB
0.1
0.7
dB
15 dB
0.4
1.3
dB
20 dB
0.5
1.6
dB
RF Data with Wire Bond
s
[1]
Attenuation vs. Temperature
2
Attenuation vs. Temperature
HMC656, HMC65
7
,
H
MC658
HMC652, HMC653, HMC654, HMC655
0
0
HMC652
-2
-5
HMC653
HMC656
-10
-4
HMC654
HMC657
-15
-6
HMC655
HMC658
-20
-8
-10
-25
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
FREQUENCY (GHz)
FREQUENCY (GHz)
Return Loss
HMC652, HMC653, HMC654, HMC655
Return Loss
HMC656, HMC65
7
,
H
MC658
0
0
-5
-5
-10
-10
-15
HMC655
-15
HMC658
HMC656
HMC654
-20
-20
HMC657
HMC653
-25
-25
-30
HMC652
-30
0
10
20
30
40
50
0
10
20
30
40
50
FREQUENCY (GHz)
FREQUENCY (GHz)
[1] Data taken with die mounted to plate and RF probed through two 1 mil diameter wire bonds.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 2
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
RF Data with Ribbon Bond
s
[2]
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
Attenuation vs. Temperature
HMC656, HMC65
7
,
H
MC658
0
0
HMC652
-2
-5
HMC653
HMC656
-10
-4
HMC654
HMC657
-15
-6
HMC655
HMC658
-20
-8
-10
-25
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
2
FREQUENCY (GHz)
FREQUENCY (GHz)
Return Loss
HMC652, HMC653, HMC654, HMC655
Return Loss
HMC656, HMC65
7
,
H
MC658
0
0
-5
-5
-10
-15
-10
-15
HMC655
HMC657
HMC658
HMC654
-20
-20
HMC653
HMC656
-25
-25
HMC652
-30
-30
0
10
20
30
40
50
0
10
20
30
40
50
FREQUENCY (GHz)
FREQUENCY (GHz)
[2] Data taken with die mounted to plate and RF probed through two 3 x 0.5 mil ribbon bonds.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 3
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
RF Data Die Onl
y
[3]
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
Attenuation vs. Temperature
HMC656, HMC65
7
,
H
MC658
0
0
HMC652
-2
-5
HMC653
HMC656
-10
-4
HMC654
HMC657
-15
-6
HMC655
HMC658
-20
-8
-10
-25
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
2
FREQUENCY (GHz)
FREQUENCY (GHz)
Return Loss
HMC652, HMC653, HMC654, HMC655
Return Loss
HMC656, HMC65
7
,
H
MC658
0
0
-5
-5
-10
-10
HMC656
-15
HMC655
-15
HMC658
HMC654
-20
HMC657
-20
-25
-30
HMC653
-25
HMC652
-30
0
10
20
30
40
50
0
10
20
30
40
50
FREQUENCY (GHz)
FREQUENCY (GHz)
Absolute Maximum Ratings
Part Number
HMC650
HMC651
HMC652
HMC653
26
HMC654
25
HMC655
26
HMC656
HMC657
25
HMC658
25
Units
dBm
V
RF Input Power (CW)
DC Voltage Terminated
DC Voltage Open
N/A
N/A
27
5.6
5.6
25
4.9
5.3
N/A
N/A
5.2
4.9
5.2
4.4
4.8
N/A
N/A
5.1
4.6
6.0
4.6
4.9
V
Storage Temperature
Operating Temperature
-65 to
+
150
-55 to +85
°C
°C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
[3] Data taken with die mounted to a plate and RF probed directly on die.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 4
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Outline Drawing
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657
NOTES:
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2
2. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
3. BACKSIDE METALIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PAD METALIZATION: GOLD
6. DO NOT BOND ON TOP OF GROUND VIAS
7. OVERALL DIE SIZE
0.002”
Die Packaging Information
[1]
Standard
Alternate
GP-5 (Gel Pack)
[2]
Outline Drawing
HMC651 & HMC658
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Analog
Devices Inc..
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 5
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Pad Descriptions
Pad Number
Function
RF1, RF2
Description
Interface Schematic
This pad is DC coupled and matched to 50 Ohms.
Use DC Blocking capacitors if the input / output signals
have non-zero DC potential
1, 2
GND
Die bottom must be connected to RF ground.
2
Assembly Diagram
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 6
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
0.102mm (0.004”) Thick GaAs MMIC
50 Ohm Microstrip transmission lines on 0
.
127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0
.
150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate.
One way to accom-
plish this is to attach the 0
.
102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length.
Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
2
0.102mm (0.004”) Thick GaAs MMIC
Storage:
All bare die are placed in either Waffle or Gel based ESD protec-
tive containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Wire Bond
0.076mm
(0.003”)
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
RF Ground Plane
Static Sensitivity:
Follow ESD precautions to protect against ESD
strikes.
0.150mm (0.005”) Thick
Moly Tab
Transients:
Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pick-
up.
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach:
A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C.
When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds.
No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom-
mended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate.
All bonds should be as short as possible <0.31mm (12 mils).
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 7
Application Support: Phone: 1-800-ANALOG-D
HMC650
to
HMC658
v02.0218
WIDEBAND FIXED ATTENUATOR FAMILY, DC – 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Notes:
2
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
2 – 8
Application Support: Phone: 1-800-ANALOG-D
