Analog-Devices-Inc–Maxim-Integrated-MAX2205EBS

Part #	Analog-Devices-Inc–Maxim-Integrated-MAX2205EBS
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19-2015; Rev 6; 9/06

RF Power Detectors in UCSP

General Description

Features

♦

Space-Saving 2

2 UCSP Occupies Only 1mm

The MAX2205–MAX2208 wideband (800MHz to 2GHz)

power detectors are ideal for GSM/EDGE (MAX2206),

TDMA (MAX2207), and CDMA (MAX2205/MAX2208)

applications. The MAX2206/MAX2207/MAX2208 take an

RF signal from a directional coupler at the input, and out-

put a highly repeatable voltage. The output voltage

increases monotonically with increasing input power. The

output is compensated for temperature and process

shifts, reducing the worst-case variation to less than

dꢀ at full power and

.5dꢀ at the lowest power.

♦

Internal Temperature Compensation Gives ±±0.3d

Detection Accuracy

♦

No External Filter or Op Amp Require3

♦

Power-Detection Range

4±3d (MAX22±6)

253d (MAX22±5/MAX22±7/22±8)

The MAX2206 features 40dꢀ dynamic range, making

it ideally suited to GSM/EDGE applications. The

MAX2207 offers reduced current consumption for TDMA

applications. The MAX2205/MAX2208 each have an inte-

grated filter to allow for average power detection of

CDMA signals over a 25dꢀ dynamic range. The

MAX2206/MAX2207/MAX2208 offer internal 50

Ω

termina-

tion for interfacing with a directional coupler. The

MAX2205 has a high-impedance input to provide a low-

loss resistive tap in CDMA applications. All devices allow

the user to control the averaging time constant externally.

Ordering Information

PART

TEMP RANGE

-40°C to +85°C

dUMP-PACKAGE

2 UCSP*

MAX22±5

EꢀS

MAX2205EꢀS+

MAX22±6

EꢀS

MAX2206EꢀS+

MAX22±7

EꢀS

MAX22±8

EꢀS

MAX2208EꢀS+

The MAX2205–MAX2208 come in a space-saving 2

0.5mm-pitch UCSP™ and require only three external

components.

Requires solder temperature profile described in the Absolute

Maximum Ratings section.

Indicates lead-free package.

Applications

Dual-ꢀand GSM/EDGE Handsets

Dual-ꢀand CDMA/TDMA Handsets

WCDMA Handsets

2 UCSP

±.0± mm

PA Modules

UCSP is a trademark of Maxim Integrated Products, Inc.

Pin Configuration/Functional

Diagram/

pical Operating Circuit

TOP VIEW

SHDN LOGIC INPUT

10k

Ω

(MAX2205)

240

Ω

(MAX2206/MAX2207/MAX2208)

680

Ω

(MAX2205)

Ω

(MAX2206)

FROM PA

OUTPUT

(MAX2205)

Ω

(MAX2207/MAX2208)

RFIN/

SHDN

(A1)

(A2)

TEMPERATURE-

COMPENSATED

PEAK

FROM

COUPLER/TAP

47pF

27pF

DETECTOR

(MAX2206/MAX2207/MAX2208)

MAX2205

MAX2206

MAX2207

MAX2208

SHUTDOWN

LOGIC

GND

(B1)

OUT

(B2)

TO ADC

FILTER

(OPTIONAL)

UCSP

________________________________________________________________

Maxim Integrated Products

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

RF Power Detectors in UCSP

AdSOLUTE MAXIMUM RATINGS

RFIN/

SHDN

to GND………………………………-0.3V to (V

to GN

………………………………………………….-0.3V to +6.5V

+ 0.3V)

RF Input Power (800MHz)

(MAX2206/MAX2207/MAX2208) ……………………………+20dꢀm

RF Input Power (2GHz)

Operating Temperature Range ………………………-40°C to +85°C

Junction Temperatur

……………………………………………..+±50°C

Storage Temperature Rang

……………………….-65°C to +±60°C

ꢀump Temperature (soldering) (Note ±)

(MAX2206/MAX2207/MAX2208) ……………………………+±7dꢀm

RF Input Voltage (800MHz) (MAX2205

)

………………………..±.5V

RF Input Voltage (2GHz) (MAX2205

)

……………………………0.8V

Infrared (±5s) (leaded)…………………………………………+220°C

Vapor Phase (60s) (leaded)………………………………….+2±5°C

Infrared (±5s) (lead-free)………………………………………+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

DC ELECTRICAL CHARACTERISTICS (MAX22±5–MAX22±8)

= +2.7V to +5.0V,

SHDN

= +2.0V, no RF signal applied, T

= -40°C to +85°C. Typical values are at V

= +2.85V and

= +25°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMdOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

2.7

5.0

5.5

3.5

±0

MAX2206

3.5

Idle Supply Current

µA

IDLE

MAX2205/MAX2207/MAX2208

Shutdown Supply Current

OUT Voltage During Shutdown

SHDN

= 0V

0.5

SHDN

= 0V

0.0±

OUT

Logic-High Threshold

Logic-Low Threshold

2.0

0.6

+±0

+±

SHDN

= +2.0V

-±

SHDN

Input Current

µA

= +0.6V

SHDN

Output Current Source Capability

Output Current Sink Capability

MAX2206/MAX2207, V

= +2.5V

= 0V

400

300

µA

OUT

AC ELECTRICAL CHARACTERISTICS (MAX22±5)

(MAX2205 EV kit, V

= +2.7V to +5.0V,

SHDN

= +2.0V, f

= 800MHz to 2GHz, 50

Ω

system, T

= -40

C to +85°C. Typical values

are at V

= +2.85V and T

= +25°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMdOL

CONDITIONS

MIN

TYP

MAX

UNITS

MHz

µs

RF Input Frequency

Turn-On Time

800

2000

Response Time

(Note 3)

±5

µs

High input power

(Note 4)

0.3

±.3

= +2.85V,

= -40

C to +85

Variation Due to Temperature

dꢀ

Low input power

(Note 5)

2.5

_______________________________________________________________________________________

RF Power Detectors in UCSP

AC ELECTRICAL CHARACTERISTICS (MAX22±6/MAX22±7/MAX22±8)

(MAX2206/MAX2207/MAX2208 EV kit, V

= +2.7V to +5.0V,

SHDN

= 2.0V, f

= 800MHz to 2GHz, 50

Ω

system, T

= -40

C to

+85°C. Typical values are at V

= +2.85V and T

= +25°C, unless otherwise noted.) (Note 2)

PARAMETER

RF Input Frequency

RF Input VSWR

SYMdOL

CONDITIONS

MIN

TYP

MAX

UNITS

800

2000

MHz

VSWR

2:±

Turn-On Time

µs

MAX2206/MAX2207

MAX2208

= +2.85V,

300

±5

Response Time (Note 3)

High input power (Note 6)

= -40°C to +85°C

Low input power (Note 7)

0.3

±.3

Variation Due to Temperature

dꢀ

2.5

Note 1:

This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020 rev. C or later, paragraph 7.6, Table 3 for IR/VPR and convection

reflow. Preheating is required. Hand or wave soldering is not allowed.

Note 2:

Specifications over T

= -40°C to +85°C are guaranteed by design. Production tests are performed at T

= +25°C.

Note .:

Response time is taken from the time the RF signal is applied to 90% of the final value of V

OUT

Note 4:

At 800MHz, output voltage is held at a value that nominally results from the final value of +3±dꢀm input power. Deviation from

+3±dꢀm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dꢀm input power. Deviation

from +28dꢀm is specified.

Note 5:

At 2GHz, output voltage is held 22dꢀ lower than specified in Note 4. At 800MHz, output voltage is held 25dꢀ lower than spec-

ified in Note 4.

Note 6:

At 800MHz, output voltage is held at a value that nominally results from +±5dꢀm input power. Deviation from +±5dꢀm is

specified. At 2GHz, output voltage is held at a value that nominally results from +±3dꢀm input power. Deviation from +±3dꢀm

is specified.

Note 7:

For MAX2206, the output voltage is held at 40dꢀ lower input power than specified in Note 6; for MAX2207/MAX2208, output

voltage is held at a value that nominally results from 25dꢀ lower input power than specified in Note 6. Deviation from the

nominal input power is specified.

pical Operating Characteristics

(MAX2206/MAX2207/MAX2208 EV kit, T

= +25°C, unless otherwise noted.)

MAX2206

OUTPUT VOLTAGE vs. INPUT POWER

MAX2206

OUTPUT VOLTAGE vs. INPUT POWER

MAX2206

RESPONSE TIME vs. TEMPERATURE

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

320

315

310

305

300

295

290

285

280

275

270

265

= 900MHz

= +15dBm

= +2.7V to +3.5V

= 800MHz

= -40

C TO +85

= +2.7V to +3.5V

= 2GHz

= -40

C TO +85

= +2.7V

= +3.5V

= +85

= +2.7V

= -40

= +2.7V

= -40

= +3.5V

= +3.0V

-25 -20 -15 -10

-5

10 15

-25 -20 -15 -10

-5

10 15

-40

-15

POWER (dBm)

TEMPERATURE (

_______________________________________________________________________________________

RF Power Detectors in UCSP

pical Operating Characteristics (continued)

(MAX2206/MAX2207/MAX2208 EV kit, T

= +25°C, unless otherwise noted.)

MAX2207/MAX2208

OUTPUT VOLTAGE vs. INPUT POWER

MAX2207

RESPONSE TIME vs. TEMPERATURE

MAX2207/MAX2208

OUTPUT VOLTAGE vs. INPUT POWER

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

310

305

300

295

290

285

280

275

2.5

2.0

1.5

1.0

0.5

= +2.7V to +3.5V

= 800MHz

= -40

C TO +85

= 900MHz

P =

+15dBm

= +2.7V to +3.5V

= 2GHz

= -40

C TO +85

= +2.7V

= +3.0V

= +3.5V

= +85

= +3.5V

= +2.7V

= -40

= +2.7V

= -40

-10

-5

-40

-15

-10

-5

POWER (dBm)

TEMPERATURE (

POWER (dBm)

MAX2205

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/MAX2208

RESPONSE TIME vs. TEMPERATURE

0.8

0.7

0.6

2.5

= +2.7V to +3.5V

= 1880MHz

= -40

C to +85

= +2.7V to +3.5V

= 836MHz

= -40

C to +85

= 900MHz

= +15dBm (MAX2208)

= +31dBm (MAX2205)

2.0

1.5

1.0

0.5

MAX2205 EV KIT

= +2.7V

0.5

0.4

0.3

= +3.5V

= +85

= +3.0V

= +3.5V

= +85

= +3.5V

0.2

0.1

= +2.7V

= -40

= +2.7V

= -40

-40

-15

INPUT POWER (dBm)

TEMPERATURE (

INPUT POWER (dBm)

Pin Description

A±

NAME

FUNCTION

RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic

input through a resistor. Drive low to turn the part off, drive high, or connect to V

to turn the part on.

RFIN/

SHDN

Power-Supply Pin. ꢀypass to GND with a capacitor as close to the bump as possible.

Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to

connect the ground pin to the ground plane. Connect to PC board ground plane with as low

inductance as possible.

ꢀ±

ꢀ2

GND

OUT

Detector Output

_______________________________________________________________________________________

RF Power Detectors in UCSP

Applications Information

UCSP Reliability

The MAX2205–MAX2208 have internal termination

resistors for use with directional couplers. The applica-

tion circuit is shown in Figure ±. The output of the

detector goes to an op amp in an analog GSM power-

control scheme, or to an ADC in other systems such as

TDMA or discrete-time GSM power control.

The UCSP is a unique package that greatly reduces

board space compared to other packages. UCSP relia-

bility is integrally linked to the user’s assembly methods,

circuit board material, and usage environment. The user

should closely review these areas when considering

using a UCSP. This form factor might not perform equally

to a packaged product through traditional mechanical

reliability tests. Performance through operating life test

and moisture resistance remains uncompromised, as it

is determined primarily by the wafer-fabrication process.

The MAX2205 has high-input impedance for use with

high-value resistive tapping from a CDMA power ampli-

fier. This coupling method is the lowest cost and lowest

loss when used with an isolator. The application circuit

is shown in Figure 2. Connect C

from the

Mechanical stress performance is a greater considera-

tion for a UCSP. UCSP solder-joint contact integrity must

be considered because the package is attached through

direct solder contact to the user’s PC board. Testing

done to characterize the UCSP reliability performance

shows that it is capable of performing reliably through

environmental stresses. Results of environmental stress

tests and additional usage data and recommendations

are detailed in the UCSP application note, which can be

found on Maxim’s website, www.maxim-ic.com.

FILTER

MAX2205 output to GND to reduce residual amplitude

ripple. For IS98A reverse channel signal with peak-to-

avg ratio of 3.9dꢀ, a ±.5nF capacitor gives 43mV

rip-

P-P

ple at 28dꢀm PA output and 390µs response time.

For

CDMA2000 (pilot + DCCH) with peak-to-avg ratio of

5.4dꢀ, the ripple is about 65mV

at 26dꢀm PA output.

P-P

The MAX2205 input impedance is listed in Table ±.

Layout

As with any RF circuit, the layout of the MAX2205–

MAX2208 circuits affects performance. Use a short

Ω

line at the input with multiple ground vias along the

length of the line. The input capacitor and resistor

should be placed as close to the IC as possible. The

Chip Information

TRANSISTOR COUNT: 344

input should be bypassed as close as possible to

the IC with multiple vias connecting the capacitor to

ground. Refer to the MAX2205–MAX2208 EV kit data

sheet for a sample layout and details.

ISOLATOR/

CIRCULATOR

COUPLER

TO ANT

Ω

TO ANT

680

Ω

47pF

TO ADC

OR OP AMP

TO ADC

MAX2206

MAX2207

MAX2208

MAX2205

PEAK

FILTER

PEAK

DETECTOR

Figure 1. MAX2206/MAX2207/MAX2208 Typical Application

Circuit

Figure 2. MAX2205 Typical Application Circuit

_______________________________________________________________________________________

RF Power Detectors in UCSP

Table 10 MAX22±5 Input Impe3ance (R || jX, PC doar3 De-Embe33e3)

= -.±3dm

= +53dm

FREQUENCY (GHz)

REAL

±89.9

±77.3

±65.8

±55.2

±46.4

±38.8

±3±.5

±23.3

±±5.0

±07.2

±±0.7

±05.3

94.7

IMAG

-5±.7

-47.4

-43.6

-40.3

-37.6

-35.0

-32.9

-30.7

-29.±

-27.5

-26.7

-25.2

-23.6

REAL

±99.4

±85.5

±75.2

±67.0

±58.8

±50.9

±44.0

±39.4

±3±.6

±32.0

±26.6

±20.3

±±±.4

IMAG

-54.0

-49.4

-45.7

-42.5

-39.8

-37.3

-35.±

-33.3

-3±.8

-30.9

-29.3

-27.9

-26.7

0.8

0.9

±.0

±.±

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

2.0

Table 20 MAX22±5–MAX22±8 Device

Marking Co3es

DEVICE

CODE

MAX2205EꢀS

MAX2206EꢀS

MAX2207EꢀS

MAX2208EꢀS

AFR

AFO

AFP

AFQ

_______________________________________________________________________________________

RF Power Detectors in UCSP

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,

go to

www0maxim-ic0com/packages

PACKAGE OUTLINE, 2×2 UCSP

21-0117

Revision History

Pages changed at Rev 6: ±, 2, 3, 7

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA

94086 408-737-7600

_____________________

Maxim Integrated Products

is a registered trademark of Maxim Integrated Products, Inc.

EN GL ISH

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P art Num

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F r ee

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R oHS/L ead- Fr ee?

Ma t e ri a l s A n a ly s is

P a c ka g e :

TY PE P

INS S

IZE

D R A WI N G C

O D E / V A R

M AX 220 5 EBS +

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k gc o d e/ v a r ia t i o n : B 4 + 4

0 C

t o

+ 7

0 C

Ro H S / Le a d -F re e:

Yes

Ma t e ri a l s A n a ly s is

M A X2 2 0 5 EB S

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k g c o d e/ v a r i at i o n : B 4- 4

– 4

0 C

t o

+ 8

5 C

Ro H S / Le a d -F re e:

N o

Ma t e ri a l s A n a ly s is

MA X220 5EB S + T10

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k gc o d e/ v a r ia t i o n : B 4 + 4

0 C

t o

+ 7

0 C

Ro H S / Le a d -F re e:

Yes

Ma t e ri a l s A n a ly s is

MA X 22 05EBS – T

MA X 2205 EBS- T10

MAX 220 5EBS + T

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k g c o d e/ v a r i at i o n : B 4- 4

– 4

0 C

t o

+ 8

5 C

Ro H S / Le a d -F re e:

N o

Ma t e ri a l s A n a ly s is

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k g c o d e/ v a r i at i o n : B 4- 4

– 4

0 C

t o

+ 8

5 C

Ro H S / Le a d -F re e:

N o

Ma t e ri a l s A n a ly s is

UC S P; 4 pi

Dwg :

2 1

– 0

1 1 7

(P D F )

U s e p

k gc o d e/ v a r ia t i o n : B 4 + 4

– 4

0 C

t o

+ 8

5 C

Ro H S / Le a d -F re e:

Yes

Ma t e ri a l s A n a ly s is

Did n’ t F

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CO NT ACT U

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Analog-Devices-Inc–Maxim-Integrated-MAX2205EBS

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