ANHI-ADW120N080G2

Part #ANHI-ADW120N080G2
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ANHI-ADW120N080G2
ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
1200V N-Channel Silicon Carbide Power MOSFET  
1. Applications  
Asymmetrical Bridge  
C
on
ve
rt
er  
I
nver  
Single  
ly
bac  
t
e
r
S
w
i
t
c
h Fo
rw
ard  
F
k
2. Features  
Low drain-source on-resistance: RDS(ON) = 80m
Ω (typ.)  
Easy to control Gate switching  
Enhancement mode: Vth = 2 to 4 V  
Table 1
 
Key Performance Parameters  
Parameter  
V

DS

@ T

j,max  

R

DS(on),max  

Q

g,typ  

Value  
1200  
100  
Unit  
V
m
Ω  
nC  
A
58  
I

D,pulse  

94  
3. Packaging and Internal Circuit  
Part Name  
Package  
Marking  
ADQ120N080G2  
ADW120N080G2  
ADG120N080G2  
TO-247-4L  
TO-247-3L  
TO-263-7L  
ADQ120N080G2  
ADW120N080G2  
ADG120N080G2  
TO-247-4L  
TO-247-3L  
TO-263-7L  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
1 Maximum
 
ratings  
at
T
j
= 25°C, unless otherwise specified  
Table 2
 
Maximum ratings  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
Max.  
35  
–
–
–
A
TC=25°C  
Continuous drain current

1)  

I

D  

–
26  
A
TC=100°C  
E

AS  

Avalanche energy, single pulse  
–
–
200  
mJ  
Tc=25
℃
,VDD=50V,L=1mH,  
RG=25Ω  
Gate source voltage (static)  
Power dissipation  
V

GS  

P

tot  

-5  
–
–
–
–
–
–
20  
V
static;  
188  
1.9  
175  
175  
W
TC=25°C  
Derating factor above 25°C  
Storage temperature  
–
W/°C  
°C  
T

stg  

T

j  

-55  
-55  
Operating junction temperature  
°C  
Soldering Temperature  
T

L  

300  
–
°C  
S
Distance of 1.6mm from case for 10s  
–
8.33  
7.14  
VDS=20V IDS=20A  
Transconductance  
GFS  
VDS=20V IDS=20A, Tj=150°C  

1)

Limited by T

j,max

. Maximum Duty Cycle D = 0.50  

2)

Pulse width t

p

limited by T

j,max  

3)

Identical low side and high side switch with identical R
G  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
2
Thermal characteristics  
Table 3
 
Thermal characteristics  
TO247  
Values  
Typ.  
0.65  
–
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Max.  
0.8  
R

thJC  

Thermal resistance, junction
 
– case  
–
–
°C/W –  
Thermal resistance, junction
 
– ambient
 
R

thJA  

40  
°C/W device
 
on PCB, minimal footprint  
TO263-7L  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
Max.  
1.0  
R

thJC  

R

thJA  

Thermal resistance, junction
 
– case  
Thermal resistance, junction
 
– ambient  
–
–
–
–
°C/W –  
62  
°C/W device
 
on PCB, minimal footprint  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
3
Electrical characteristics  
at
T
j
=25°C, unless otherwise specified  
Table 4
 
Static characteristics  
Values  
Typ.  
–
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
1200  
2.0  
–
Max.  
V

(BR)DSS  

V

(GS)th  

–
V
V
V

GS

=0V,
I

D

=1mA  
Drain-source breakdown voltage  
Gate threshold voltage  
2.8 4.0  
V

DS

=
V

GS

,
I

D

=10mA  
V

DS

=1200V,
V

GS

=0V  
–
uA  
1
I

DSS  

Zero gate voltage drain current  
Gate-source leakage current  
Gate-source leakage current  
I

GSS+  

I

GSS-  

R

DS(on)  

V

GS

=20V,
V

DS

=0V  
–
–
–
–
100  
nA  
V

GS

=-5V,
V

DS

=0V  
–
-100
nA  
100  
V

GS

=20V,
I

D

=20A,
T

j

=25°C  
80  
Drain-source on-state resistance  
m
Ω
 
V

GS

=20V,
I

D

=20A,
T

j

=150°C  
f
=1MHz, open drain  
93.1  
4.5  
Ω
R

G  

Gate resistance (Intrinsic)  
–
–
Table 5  
Dynamic characteristics  
Values  
Typ.  
1377  
62  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Max.  
C

iss  

–
–
–
–
–
–
pF  
pF  
pF  
V

GS

=0V,
V

DS

=1000V,
f
=200KHz  
V

GS

=0V,
V

DS

=1000V,
f
=200KHz  
V

GS

=0V,
V

DS

=1000V,
f
=200KHz  
Input capacitance  
Output capacitance  
C

oss  

Reverse transfer capacitance  
C

rss  

4
t

d(on)  

Turn-on delay time  
–
–
–
–
10  
–
–
–
–
ns  
ns  
ns  
ns  
uJ  
uJ  
t

r  

Rise time  
6
V

DD

=800V,
V

GS

=20V
,  
Turn-off delay time  
Fall time  
t

d(off)  

t

f  

16  
R

G

=0
Ω
;  
I

D

=20A,  
T

J

=25
℃
 
10  
Eon  
Eoff  
Turn-on Switching Energy  
Turn-off Switching Energy  
748.8  
31.2  
Table 6
 
Gate charge characteristics  
Values  
Typ.  
18  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Max.  
Q

gs  

Q

gd  

Q

g  

–
–
–
–
–
–
nC  
nC  
nC  
V

DD

=800V,
I

D

=20A,
V

GS

=20V  
V

DD

=800V,
I

D

=20A,
V

GS

=20V  
V

DD

=800V,
I

D

=20A,
V

GS

=20V  
Gate to source charge  
Gate to drain charge  
Gate charge total  
17  
58  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
Table 7
 
Reverse diode characteristics  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
–
Max.  
Continuous Source Current  
Diode forward voltage  
I

SD  

–
–
35  
–
A
V

SD  

3.8  
V
I

S

= 10A, V

GS

= 0V  
,
T

j

=25°C  
Reverse recovery time  
t

rr  

–
–
–
57  
–
–
–
ns  
V

DD
=800V
,

I

D  

V

GS
=-4V  

=+15V,-  
V

GS  

=20A, +  
Reverse recovery charge  
Peak reverse recovery current  
Q

rr  

I

rrm  

195  
6.84  
n
C  
L
Load
=500uH
,
Rg=0Ω
,
T

J

=25
℃  
A

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
4 Electrical
 
characteristics diagram  
Diagram 1: Typ. output characteristics  
Diagram 2: Typ. output characteristics  
I

D

=f(
V

DS

);
T

j

=25 °C; parameter:
V

GS  

I

D

=f(
V

DS

);
T

j

=175 °C; parameter:
V

GS  

Diagram 3: Typ. transfer characteristics  
Diagram 4: Typ. gate charge  
I

D

=f(
V

GS

);
V

DS

=20V; parameter:
T

j  

V

GS

=f(
Q

gate

);
I

D

=20A ;
V

DS

=800V; turn-on pulse  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
Diagram 5: Typical gate-source threshold voltage as a  
function of junction temperature  
Diagram 6: Typ. Capacitance as a function of drain-source  
voltage  
V

GS(th)

=f(
T

j

);
I

DS

=10mA;
V

GS

=
V

DS  

C
=f(
V

DS

);
V

GS

=0V;
f
=1MHz  
Diagram 7: Normalized on-resistance as a function of junction
 
Diagram 8: Typical body diodes forward voltage as function of  
temperature  
junction temperature  
R

DS(ON)

=f(
T

j

);
I

DS

=20A  
V

SD

=f(
T

j

);
V

GS

=0V;
I

SD

=10A  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
Diagram 9: Typical body diodes forward current as function of Diagram 10: Typical body diodes forward current as function  
V

GS
as parameter  

V

GS
as parameter  

forward voltage,  
of forward voltage,  
I

SD

=f(
V

SD

);
T

j

=25 °C  
I

SD

=f(
V

SD

);
T

j

=175 °C  
Diagram 12: Power dissipation as a function of case  
temperature limited by bond wire  
Diagram 11: Safe operating area(SOA)  
V

GS

=0/18V;
T

C

=25 °C;
T

j

<175 °C  
P

tot

= f(
T

C

)  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
Diagram 13: Maximum DC drain to source current as a  
function of case temperature limited by bond wire  
Diagram 14: Maximum source to drain current as a function of  
case temperature limited by bond wire  
I

DS

= f(
T

C

)  
I

SD

= f(
T

C

),
V

GS

=0V  
Diagram 15: Max. transient thermal resistance(MOSFET/diodes)  
Z

th(j-c,max)

= f(
t

p

),parameter D=
t

p

/
T  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
5
Test Circuits  
Table 8
 
Diode characteristics  
Table 9
 
Switching times  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
6
Package Outlines  
TO-247-4L  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
TO-247-3L  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
TO-263-7L  

ADQ
120N080G2,
ADW
120N080G2, ADG120N080G2  
Revision History  
Revision
Date  
Subjects (major changes since last revision)  
Preliminary version  
1.0  
2022-05-27