ANHI-ASW60R150E
| Part # | ANHI-ASW60R150E |
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ASA60R150E
, ASW60R150E
MOSFET Silicon N-Channel MOS
1. Applications
Boost PFC switch,single-
ended flyback or
two-transistor forward,
Half bridge or Asymmetric
half bridge
or Series resonance half bridge topologies.
PC power,
Adaptor,LCD & PDP TV,
LED Lighting,Server power,
Telecom power,and UPS Application.
2. Features
Low drain-source on-
resistance: RDS(ON)
= 0.120Ω (typ.)
Easy to control Gate switching
Enhancement mode: Vth = 2.8 to 4.2 V
Table 1
Key Performance Parameters
Parameter
V
DS
@ T
j,max
R
DS(on),max
Q
g,typ
Value
Unit
650
V
150
m
Ω
47.59
84
nC
A
I
D,pulse
3. Packaging and Internal Circuit
Part Name
ASA60R150E
ASW60R150E
Package
TO220F
TO247
Marking
ASA60R150E
ASW60R150E
TO220F
T
47
ASA60R150E, ASW60R150E
1
Maximum ratings
at
T
j
= 25°C, unless otherwise specified
Table 2
Maximum ratings
Values
Typ.
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Max.
Continuous drain current
1)
Pulsed drain current
2)
I
D
A
–
–
28
T
C
=25°C
T
C
=25°C
I
D,pulse
E
AS
dv/dt
V
GS
V
GS
P
tot
–
84
A
Avalanche energy, single pulse
MOSFET dv/dt ruggedness
Gate source voltage (static)
Gate source voltage (dynamic)
Power dissipation (TO220F)
Power dissipation (TO247)
Storage temperature
–
–
–
–
–
–
–
–
–
898
130
20
mJ
–
V/ns
V
DS
=0…400V
-20
-30
–
V
static;
30
V
AC (f>1 Hz)
T
C
=25°C
T
C
=25°C
34
W
W
°C
°C
P
tot
–
195
150
150
T
stg
T
j
-55
-55
Operating junction temperature
V
DS
=0…400V,
I
SD
<=48A,
T
j
=25°C
see table 8
Reverse diode dv/dt
3)
dv/dt
–
–
15
V/ns
1)
Limited by T
j,max
. Maximum Duty Cycle D = 0.50
2)
Pulse width t
p
limited by T
j,max
3)
Identical low side and high side switch with identical R
G
ASA60R150E, ASW60R150E
2
Thermal characteristics
Table 3
Thermal characteristics (TO220F)
Values
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Typ.
Max.
3.65
80
Thermal resistance, junction
– case
R
thJC
–
–
–
–
°C/W –
Thermal resistance, junction
– ambient
R
thJA
°C/W device
on PCB, minimal footprint
Thermal characteristics (TO247)
Values
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Typ.
Max.
0.64
62
Thermal resistance, junction
– case
R
thJC
–
–
–
–
°C/W –
Thermal resistance, junction
– ambient
R
thJA
°C/W device
on PCB, minimal footprint
ASA60R150E, ASW60R150E
3
Electrical characteristics
at
T
j
=25°C, unless otherwise specified
Table 4
Static characteristics
Values
Typ.
–
Parameter
Symbol
Unit Note
/ Test Condition
Min.
605
2.8
–
Max.
–
V
GS
=0V,
I
D
=10mA
Drain-source breakdown voltage
Gate threshold voltage
V
(BR)DSS
V
(GS)th
V
V
V
DS
=
V
GS
,
I
D
=250uA
4.2
–
V
DS
=600V,
V
GS
=0V,
T
j
=25°C
nA
nA
100
100
0.15
Zero gate voltage drain current
Gate-source leakage current
I
DSS
I
GSS
V
GS
=30V,
V
DS
=0V
–
–
–
0.12
V
GS
=10V,
I
D
=10A,
T
j
=25°C
Ω
Ω
R
DS(on)
R
G
Drain-source on-state resistance
Gate resistance (Intrinsic)
–
5.8
–
f
=1MHz, open drain
Table 5
Dynamic characteristics
Values
Typ.
2389
218
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Max.
V
GS
=0V,
V
DS
=50V,
f
=10kHz
V
GS
=0V,
V
DS
=50V,
f
=10kHz
V
GS
=0V,
V
DS
=50V,
f
=10kHz
Input capacitance
C
iss
C
oss
C
rss
–
–
–
–
–
–
pF
pF
pF
Output capacitance
Reverse transfer capacitance
5.07
V
GS
=13V,
V
DD
=400V,
R
G
=1.7
Ω
;
see table 9
V
GS
=13V,
I
D
=11.3A,
I
D
=11.3A,
I
D
=11.3A,
I
D
=11.3A,
Turn-on delay time
Rise time
t
d(on)
t
r
t
d(off)
t
f
–
–
–
–
12.4
21.6
50
–
–
–
–
ns
ns
ns
ns
V
DD
=400V,
R
G
=1.7
Ω
;
see table 9
V
GS
=13V,
V
DD
=400V,
R
G
=1.7
Ω
;
see table 9
V
GS
=13V,
Turn-off delay time
Fall time
V
DD
=400V,
R
G
=1.7
Ω
;
see table 9
18.4
Table 6
Gate charge characteristics
Values
Typ.
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Max.
V
DD
=400V,
I
D
=11.3A,
V
GS
=0 to 10V
V
DD
=400V,
I
D
=11.3A,
V
GS
=0 to 10V
V
DD
=400V,
I
D
=11.3A,
V
GS
=0 to 10V
V
DD
=400V,
I
D
=11.3A,
V
GS
=0 to 10V
Gate to source charge
Gate to drain charge
Gate charge total
Q
gs
–
–
–
8.522
8.297
47.59
5.4
–
–
–
–
nC
nC
nC
V
Q
gd
Q
g
Gate plateau voltage
V
plateau
ASA60R150E, ASW60R150E
Table 7
Reverse diode characteristics
Values
Typ.
0.7
Parameter
Symbol
Unit Note
/ Test Condition
Min.
Max.
Diode forward voltage
Reverse recovery time
V
SD
t
rr
–
–
V
V
GS
=0V,
I
F
=1A,
T
j
=25°C
V
R
=400V,
I
F
=11.3 A,d
i
F
/d
t
=100A/µs;
see table 8
–
–
–
288
4.3
–
–
–
ns
V
R
=400V,
I
F
=11.3 A,d
i
F
/d
t
=100A/µs;
see table 8
Reverse recovery charge
Q
rr
I
rrm
uC
A
V
R
=400V,
I
F
=11.3 A,d
i
F
/d
t
=100A/µs;
see table 8
Peak reverse recovery current
26.2
ASA60R150E, ASW60R150E
4 Electrical
characteristics diagram
Diagram 1: Typ. output characteristics
Diagram 2: Typ. Coss stored energy
I
D
=f(
V
DS
);
T
j
=25 °C; parameter:
V
GS
Eoss=f(VDS)
Diagram 3: Typ. transfer characteristics
Diagram 4: Typ. gate charge
I
D
=f(
V
GS
); parameter:
T
j
V
GS
=f(
Q
gate
);
I
D
=11.3 A pulsed; parameter:
V
DD
ASA60R150E, ASW60R150E
Diagram 5: Drain-source breakdown voltage
Diagram 6: Typ. capacitances
V
BR(DSS)
=f(
T
j
);
I
D
=10 mA
C
=f(
V
DS
);
V
GS
=0 V;
f
=10 kHz
ASA60R150E, ASW60R150E
5
Test Circuits
Table 8
Diode characteristics
Table 9
Switching times
Table10
Unclamped inductive load
ASA60R150E, ASW60R150E
6
Package Outlines
Figure1
:
Outline PG‐TO220F
ASA60R150E
, ASW60R150E
Figure2
:
Outline PG‐TO247
ASA60R150E, ASW60R150E
Revision History
Revision
Date
Subjects (major changes since last revision)
0.1
1.0
2.0
Preliminary version
2019-04-16
2019-11-07
2020-03-19
Fine tune outline and add Crss test data.etc
Add part name”ASW60R150E” and Add Electrical characteristics Curve
