ANHI-AUP049N10

Part #ANHI-AUP049N10
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ANHI-AUP049N10
AUP049N10,AUB049N10  
MOSFET Silicon N-Channel MOS  
1. Applications  
Synchronous rectification in SMPS,  
Hard switching and High speed circuit  
DC/DC in telecoms and industrial  
2. Features  
Low drain-source on-resistance:  
TO220 RDS(ON) = 4.3
mΩ (typ.)  
TO263
RDS(ON) = 4.2mΩ (typ.)  
High speed power switching  
Enhanced body diode dv/dt capability  
Enhanced avalanche ruggedness  
Table 1
 
Key Performance Parameters  
Parameter  
V

DS

@ T

j,max  

R

DS(on),max  

Q

g,typ  

Value  
100  
4.9  
Unit  
V
m
Ω  
nC  
A
60.7  
408  
I

D,pulse  

3. Packaging
 
and Internal Circuit  
Part Name  
AUP049N10  
AUB049N10  
Package  
TO220  
Marking  
AUP049N10  
AUB049N10  
TO263  
TO263  
TO220  

AUP049N10,AUB049N10  
1
Maximum ratings  
At
T
j
= 25°C, unless otherwise specified  
Table 2
 
Maximum ratings  
Values  
Typ.  
–
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Max.  
Continuous drain current

1)  

Continuous drain current

1)  

I

D  

A
136  
101  
408  
282  
T

C

=25°C  
I

D  

T

C

=100°C  
A
Pulsed drain current

2)  

I

D,pulse  

E

AS  

–
–
A
T

C

=25°C  
Tc=25
℃
,VDD=50V,Id=33.6A,  
L=0.5Mh,
RG=25Ω  
Avalanche energy, single pulse  
–
–
mJ  
Tc=25
℃
, VDD=50V, L=0.5Mh,  
RG=25Ω  
Avalanche current, single pulse  
I

AR  

–
33.6  
A
Gate source voltage (static)  
Power dissipation (TO263,TO220)  
Storage temperature  
V

GS  

P

tot  

T

stg  

T

j  

-20  
–
–
–
–
–
20  
V
static;  
T

C

=25°C  
161  
150  
150  
W
°C  
°C  
-55  
-55  
Operating junction temperature  
Soldering Temperature  
T

L  

260  
°C  
Distance of 1.6mm from case for 10s  

1)

Limited by T

j,max

. Maximum Duty Cycle D = 0.50  

2)

Pulse width t

p

limited by T

j,max  

3)

Identical low side and high side switch with identical R
G  

AUP049N10,AUB049N10  
2
Thermal characteristics  
Table  
Thermal characteristics  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
Max.  
0.78  
62  
Thermal resistance, junction
 
– case  
R

thJC  

–
–
–
–
°C/W  
–
Thermal resistance, junction
 
– ambient
 
R

thJA  

°C/W device
 
on PCB, minimal footprint  

AUP049N10,AUB049N10  
3
Electrical characteristics  
at
T
j
=25°C, unless otherwise specified  
Table 4
 
Static characteristics  
Values  
Typ.  
–
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
100  
2.5  
–
Max.  
–
V

GS

=0V,
I

D

=250Ua  
Drain-source breakdown voltage  
Gate threshold voltage  
V

(BR)DSS  

V

(GS)th  

V
V
V

DS

=
V

GS

,
I

D

=250Ua  
4.5  
V

DS

=100V,
V

GS

=0V,
T

j

=25°C  
–
Ua  
1
Zero gate voltage drain current  
Gate-source leakage current  
I

DSS  

I

GSS  

R

DS(on)  

V

GS

=20V,
V

DS

=0V  
–
–
–
100  
4.9  
Na  
4.3  
V

GS

=10V,
I

D

=20A,
T

j

=25°C  
mΩ  
Drain-source on-state  
resistance(TO220)  
–
4.2  
4.9  
V

GS

=10V,
I

D

=20A,
T

j

=25°C  
mΩ  
Ω
R

DS(on)  

Drain-source on-state  
resistance(TO263)  
R

G  

Gate resistance (Intrinsic)  
–
–
1.5  
53  
–
–
f
=1MHz, open drain  
VDS=5V IDS=20A  
Transconductance  
GFS  
S
Table 5
 
Dynamic characteristics(by calculating)  
Values  
Typ.  
3864  
379  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Max.  
C

iss  

C

oss  

C

rss  

–
–
–
–
–
–
Pf  
Pf  
Pf  
V

GS

=0V,
V

DS

=50V,
f
=1MHz  
V

GS

=0V,
V

DS

=50V,
f
=1MHz  
V

GS

=0V,
V

DS

=50V,
f
=1MHz  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
15.3  
V

GS

=10V,  
V

GS

=10V,  
V

GS

=10V,  
V

GS

=10V,  
V

DD

=50V,  
R

G

=10
Ω
 
I

D

=20A,  
I

D

=20A,  
I

D

=20A,  
I

D

=20A,  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-on delay time  
Rise time  
–
–
–
–
30.5  
57  
–
–
–
–
ns  
ns  
ns  
ns  
V

DD

=50V,  
R

G

=10
Ω  
V

DD

=50V,  
R

G

=10
Ω  
V

DD

=50V,  
R

G

=10
Ω  
Turn-off delay time  
Fall time  
72  
45  
Table 6
 
Gate charge characteristics(by calculating)  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
16.2  
18.5  
63.7  
Max.  
Q

gs  

Q

gd  

Q

g  

–
–
–
–
–
–
Nc  
Nc  
Nc  
V

DD

=50V,
I

D

=20A,
V

GS

=0 to 10V  
V

DD

=50V,
I

D

=20A,
V

GS

=0 to 10V  
V

DD

=50V,
I

D

=20A,
V

GS

=0 to 10V  
Gate to source charge  
Gate to drain charge  
Gate charge total  

AUP049N10,AUB049N10  
Table 7
 
Reverse diode characteristics (by calculating)  
Values  
Parameter  
Symbol  
Unit Note
 
/ Test Condition  
Min.  
Typ.  
Max.  
V

SD  

t

rr  

–
0.7  
–
V
V

GS

=0V,
I

F

=1A,
T

j

=25°C  
Diode forward voltage  
Reverse recovery time  
V

R

=30V,
I

F

=20A, d
i

F

/d
t
=300A/µs  
–
–
–
47  
–
–
–
ns  
V

R

=30V,
I

F

=20A, d
i

F

/d
t
=300A/µs  
V

R

=30V,
I

F

=20A, d
i

F

/d
t
=300A/µs  
Q

rr  

I

rrm  

Reverse recovery charge  
221  
8.8  
N
A
c
Peak reverse recovery current  

AUP049N10,AUB049N10  
4
Electrical characteristics diagram  
Diagram 1: Typ. Output characteristics  
Diagram 2: Typ. Transfer characteristics  
Diagram 3: Typ. Rdson vs. Drain Current  
Diagram 4: Typ. Rdson
–
Junction Temperature  
Diagram 5: Typ. Body-Diode Characteristics  
Diagram 6: Typ. Capacitance vs. Vds  

AUP049N10,AUB049N10  
Diagram 7: Typ. Power Dissipation  
Diagram 8: Typ. Drain
 
Current De-rating  
Diagram 9: Typ. Gate charge  
Diagram 10: Typ. Maximum Safe Operating Area  

AUP049N10,AUB049N10  
5
Test Circuits  
Table 8
 
Diode characteristics  
Table 9
 
Switching times  
Table 10
 
Unclamped inductive load  

AUP049N10,AUB049N10  
6
Package Outlines  
Figure-1
:
Outline
PG‐TO220(CD
&HT)  

AUP049N10,AUB049N10  
Figure-2
:
Outline
PG‐TO263(CD)  

AUP049N10,AUB049N10  
Revision History  
Revision
Date  
Subjects (major changes since last revision)  
1.0  
1.1  
Preliminary version  
2022-10-20  
2022-11-21  
Added TO263 package