APEC-Advanced-Power-Elec-AP4451GYT-HF

Part #APEC-Advanced-Power-Elec-AP4451GYT-HF
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APEC-Advanced-Power-Elec-AP4451GYT-HF
AP4451GYT-HF  
Halogen-Free Product  
Advanced Power  
Electronics Corp.  
P-CHANNEL ENHANCEMENT MODE  
POWER MOSFET  
▼
Simple Drive Requirement  
BV

DSS  

R

DS(ON)  

I

D  

-30V  
14.5m
Ω
 
-13.1A  
D
S
▼
Small Size & Lower Profile  
▼
RoHS Compliant & Halogen-Free  
G
D
D
Description  
D
D
AP4451 series are from Advanced Power innovated design and silicon  
process technology to achieve the lowest possible on-resistance and fast  
switching performance. It provides the designer with an extreme efficient  
device for use in a wide range of power applications.  
S
The PMPAK

®

3×3 package is special for voltage conversion application  
using standard infrared reflow technique with the backside heat sink to  
achieve the good thermal performance.  
S
S
G
PMPAK

®

3×3  
Absolute Maximum Ratings@T

j

=25

o

C(unless otherwise specified)  
.
Symbol  
Parameter  
Rating  
Units  
V
V

DS  

V

GS  

Drain-Source Voltage  
-30  
Gate-Source Voltage  
+20  
V
Drain Current, V

GS

@ 10V

3  

Drain Current, V

GS

@ 10V

3  

Pulsed Drain Current

1  

I

D

@T

A

=25
℃
 
I

D

@T

A

=70
℃  
I

DM  

-13.1  
A
-10.5  
A
-50  
A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation  
3.57  
W
℃
℃
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Value  
Unit  
℃
/W  
℃
/W  
Rthj-c  
Maximum Thermal Resistance, Junction-case  
Maximum Thermal Resistance, Junction-ambient

3  

5
Rthj-a  
35  
Data and specifications subject to change without notice  
1
201501293  

AP4451GYT-HF  
Electrical Characteristics@T

j

=25

o

C(unless otherwise specified)  
Symbol  
BV

DSS  

R

DS(ON)  

Parameter  
Test Conditions  
Min. Typ. Max.
 
Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance

2

V

GS

=-10V, I

D

=-10A  
V

GS

=0V, I

D

=-250uA  
-30  
–
–
V
–
–
11.5 14.5
 
m
Ω
 
V

GS

=-4.5V, I

D

=-6A  
19  
-1.7  
17  
–
25  
m
Ω  
V
V

GS(th)  

Gate Threshold Voltage  
Forward Transconductance  
Drain-Source Leakage Current  
Gate-Source Leakage  
Total Gate Charge  
V

DS

=V

GS

, I

D

=-250uA  
V

DS

=-10V, I

D

=-10A  
V

DS

=-24V, V

GS

=0V  
V

GS

=+20V, V

DS

=0V  
I

D

=-10A  
-1  
–
-3  
g

fs  

–
S
I

DSS  

I

GSS  

uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
–
-10  
–
–
+100  
Q

g  

–
14  
5
22.4  
Q

gs  

Q

gd  

t

d(on)  

t

r  

Gate-Source Charge  
Gate-Drain (“Miller”) Charge  
Turn-on Delay Time  
Rise Time  
V

DS

=-15V  
–
–
–
–
–
–
–
V

GS

=-4.5V  
–
5
V

DS

=-15V  
–
10  
5.5  
42  
30  
I

D

=-1A  
–
t

d(off)  

t

f  

Turn-off Delay Time  
Fall Time  
R

G

=3.3
Ω  
–
V

GS

=-10V  
–
C

iss  

Input Capacitance  
V

GS

=0V  
–
1250 2000  
pF  
pF  
Ω
C

oss  

C

rss  

R

g  

Output Capacitance  
V

DS

=-15V  
–
–
–
420  
210  
–
–
.
Reverse Transfer Capacitance  
Gate Resistance  
f=1.0MHz  
f=1.0MHz  
7.2 14.4  
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max.
 
Units  
V

SD  

t

rr  

Forward On Voltage

2  

I

S

=-2.9A, V

GS

=0V  
–
–
–
–
-1.2  
V
Reverse Recovery Time  
I

S

=-10A,  
V

GS

=0  
V
,  
28  
20  
–
–
ns  
nC  
Q

rr  

Reverse Recovery Charge  
dI/dt=100A/µs  
Notes:  
1.Pulse width limited by Max. junction temperature.  
2.Pulse test  
3.Surface mounted on 1 in

2

copper pad of FR4 board, t <10sec, 85

o

C/W at steady state.  
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.  
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.  
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED  
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
 
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN.  
2

AP4451GYT-HF  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
T

A

=25

o  

C
T

A

= 150

o  

C
-10V  
-7.0V  
-6.0V  
-10V  
-7.0V  
-6.0V  
-5.0V  
-5.0V  
V

G

= -4.0V  
V

G

= -4.0V  
0
1
2
3
4
5
6
0
1
2
3
4
5
-V

DS

, Drain-to-Source Voltage (V)  
-V

DS

, Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
24  
20  
16  
12  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I

D

=-10A  
V

G

=-10V  
I

D

= -6 A  
T

A

=25
℃
 
.
2
4
6
8
10  
-50  
0
50  
100  
150  
T

j

, Junction Temperature (

o

C)  
-V

GS

, Gate-to-Source Voltage (V)  
Fig 3. On-Resistance
 
v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
10  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
I

D

=-250uA  
8
6
T

j

=150

o  

C
T

j

=25

o  

C
4
2
0
-50  
0
50  
100  
150  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
T

j

, Junction Temperature (

o

C)  
-V

SD

, Source-to-Drain Voltage (V)  
Fig 5. Forward Characteristic of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
3

AP4451GYT-HF  
f=1.0MHz  
2000  
1600  
1200  
800  
400  
0
10  
I

D

= -10 A  
V

DS

= -15 V  
8
C

iss  

6
4
2
0
C

oss  

C

rss  

0
10  
20  
30  
1
5
9
13  
17  
21  
25  
29  
Q

G

, Total Gate Charge (nC)  
-V

DS

, Drain-to-Source Voltage (V)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
1
100  
Duty factor=0.5  
100us  
Operation in this area  
limited by R

DS(ON)  

0.2  
10  
1ms  
0.1  
0.1  
0.05  
0.02  
10ms  
1
.
0.01  
P

DM  

100ms  
1s  
0.01  
t
T
Single Pulse  
0.1  
Duty factor = t/T  
T

A

=25

o  

C
Peak T

j

= P

DM

x R

thja

+ T

a  

DC  
R

thia

=85
℃
/W  
Single Pulse  
0.001  
0.01  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
t , Pulse Width (s)  
-V

DS

, Drain-to-Source Voltage (V)  
Fig 9. Maximum Safe Operating Area  
Fig 10. Effective Transient Thermal Impedance  
V

G  

V

DS  

90%  
Q

G  

-4.5V  
Q

GS  

Q

GD  

10%  
V

GS  

t
t

d(on)

t

r  

d(off)

t

f  

Charge  
Q
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
4

AP4451GYT-HF  
MARKING INFORMATION  
Part Number  
meet Rohs requirement  
for low voltage MOSFET only  
4451GYT  
YWWSSS  
Package Code : YT  
Date Code (YWWSSS)  
Y
:
Last Digit Of
 
The Year  
WW
:
Week  
SSS
:
Sequence  
.
5

ADVANCED POWER ELECTRONICS CORP.  
Package Outline : PMPAK
 
3×3  
e
b2  
SYMBOLS  
Millimeters  
1
c 1  
MIN  
2.90  
2.20  
0.60  
0.20  
2.90  
0.10  
1.20  
0.10  
0.65  
0.00  
0.10  
2.900  
2.900  
NOM  
MAX  
A
B
3.10  
3.40  
2.80  
0.70  
0.40  
3.40  
0.50  
2.20  
0.65  
1.05  
0.20  
0.25  
3.600  
3.600  
g
2.45  
e
0.65  
c 4  
C
b2  
C
0.30  
c 2  
3.10  
c1  
c2  
c3  
D
0.30  
1.70  
c 3  
0.38  
B
0.80  
A
d1  
E
0.10  
A1  
0.18  
BOTTOM VIEW  
A1  
c4  
g
3.30  
3.30  
0.20 (ref)  
d1  
D
.
E
1.All Dimension Are In Millimeters.  
2.Dimension Does Not Include Mold Protrusions.  
3. Thermal PAD and Pin contour is for reference, it may has little difference by option.  
Draw No.
 
M1-YT8-G-v06  

PMPAK 3X3  
PMPAK3X3 FOOTPRINT
:
 
3.6mm  
1.9mm  
1.725mm  
2.3mm  
3.45mm  
.
0.55mm  
0.6mm  
Pin1  
0.4mm  
0.25mm  
0.65mm  
2.35mm  
ADVANCED POWER ELECTRONICS COR
P
.  
Draw No. M1-YT8-G-v06  
1