APEC-Advanced-Power-Elec-AP4920GM

Part #APEC-Advanced-Power-Elec-AP4920GM
Download 
APEC-Advanced-Power-Elec-AP4920GM
AP4920GM-HF  
Halogen-Free Product  
Advanced Power  
Electronics Corp.  
DUAL N-CHANNEL ENHANCEMENT  
MODE POWER MOSFET  
▼
Simple Drive Requirement  
BV

DSS  

R

DS(ON)  

I

D  

25V  
25m
Ω
 
7A  
D2  
D2  
D1  
▼
Low On-resistance  
D1  
▼
Fast Switching  
G2  
S2  
▼
RoHS Compliant & Halogen-Free  
G1  
SO-8  
S1  
Description  
AP4920 series are from Advanced Power innovated design  
and silicon process technology to achieve the lowest possible  
on-resistance and fast switching performance. It provides the  
designer with an extreme efficient device for use in a wide  
range of power applications.  
D2  
S2  
D1  
S1  
G2  
G1  
The SO-8 package is widely preferred for all commercial-  
industrial surface mount applications using infrared reflow  
technique and suited for voltage conversion or switch  
applications.  
Absolute Maximum Ratings@T

j

=25

o

C(unless otherwise specified)  
Symbol  
Parameter  
Rating  
Units  
V
V

DS  

V

GS  

Drain-Source Voltage  
Gate-Source Voltage  
Drain Current, V

GS

@ 10V

3  

Drain Current, V

GS

@ 10V

3  

Pulsed Drain Current

1  

25  
+20  
V
I

D

@T

A

=25
℃
 
I

D

@T

A

=70
℃  
I

DM  

7
5.7  
A
A
20  
A
P

D

@T

A

=25
℃  
Total Power Dissipation  
2
W
Linear Derating Factor  
0.016  
-55 to 150  
-55 to 150  
W/
℃  
℃
℃
T

STG  

T

J  

Storage Temperature Range  
Operating Junction Temperature Range  
Thermal Data  
Symbol  
Parameter  
Value  
62.5  
Unit  
Rthj-amb  
Maximum Thermal Resistance, Junction-ambient

3  

℃
/W  
Data and specifications subject to change without notice  
1
201501093  

AP4920GM-HF  
Electrical Characteristics@T

j

=25

o

C(unless otherwise specified)  
Symbol  
BV

DSS  

Parameter  
Test Conditions  
V

GS

=0V, I

D

=250uA  
Min. Typ. Max.
 
Units  
Drain-Source Breakdown Voltage  
25  
–
–
0.037  
–
–
–
V
Δ
BV

DSS

/
Δ
T

j  

Breakdown Voltage Temperature Coefficient
 
Reference to 25
℃
, I

D

=1mA  
V/
℃  
V

GS

=10V, I

D

=7A  
Static Drain-Source On-Resistance

2  

V

GS

=4.5V, I

D

=5.2A  
–
25 m
Ω
 
35 m
Ω  
R

DS(ON)  

–
1
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
V

GS(th)  

g

fs  

Gate Threshold Voltage  
V

DS

=V

GS

, I

D

=250uA  
V

DS

=10V, I

D

=7A  
3
V
Forward Transconductance  
14  
–
–
S
I

DSS  

Drain-Source Leakage Current  
Drain-Source Leakage Current (T

j

=70

o

C)
V

DS

=20V, V

GS

=0V  
uA  
uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
V

DS

=25V, V

GS

=0V  
1
–
25  
I

GSS  

Q

g  

Gate-Source Leakage  
Total Gate Charge

2  

Gate-Source Charge  
Gate-Drain (“Miller”) Charge  
Turn-on Delay Time

2  

Rise Time  
V

GS

=+20V, V

DS

=0V  
I

D

=7A  
–
+100  
10.5  
1.9  
7.5  
8
–
–
–
–
–
–
–
–
–
–
Q

gs  

Q

gd  

t

d(on)  

t

r  

V

DS

=15V  
V

GS

=4.5V  
V

DS

=15V  
I

D

=1A  
9.5  
25  
13.5  
395  
260  
105  
t

d(off)  

t

f  

Turn-off Delay Time  
Fall Time  
R

G

=6
Ω
,V

GS

=10V  
R

D

=15
Ω  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
V

GS

=0V  
V

DS

=25V  
f=1.0MHz  
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
V

D

=V

G

=0V , V

S

=1.2V  
Min. Typ. Max.
 
Units  
A
V
I

S  

Continuous Source Current ( Body Diode )  
–
–
–
–
1.67  
1.2  
V

SD  

Forward On Voltage

2  

T

j

=25
℃
, I

S

=2.1A, V

GS

=0V  
Notes:  
1.Pulse width limited by Max. junction temperature.  
2.Pulse test  
3.Surface mounted on 1 in

2

copper pad of FR4 board, t <10sec ; 135
℃
/W when mounted on Min. copper pad.  
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.  
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.  
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED  
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
 
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN.  
2

AP4920GM-HF  
20  
15  
10  
5
20  
15  
10  
5
T

A

=150

o  

C
10V  
8.0V  
6.0V  
5.0V  
10V  
8.0V  
6.0V  
5.0V  

GS

= 4 .0V  
T

A

=25

o  

C
V

GS

= 4 .0V  
V
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
V

DS

, Drain-to-Source Voltage (V)  
V

DS

, Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1.8  
50  
40  
30  
20  
10  
I

D

=7A  
I

D

=7A  
1.6  
V

GS

=10  
T

A

=25
℃
 
V
1.4  
1.2  
1.0  
0.8  
0.6  
3
4
5
6
7
8
9
10  
11  
-50  
0
50  
100  
150  
T

j

, Junction Temperature (

o

C)  
V

GS

(V)  
Fig 3. On-Resistance
 
v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
3

AP4920GM-HF  
8
7
6
5
4
3
2
1
0
3
2
1
0
0
50  
100  
150  
25  
50  
75  
100  
125  
150  
T

c

,Case Temperature (

o

C)  
T

c

, Case Temperature (

o

C)  
Fig 5. Maximum Drain Current v.s.  
Case Temperature  
Fig 6. Typical Power Dissipation  
1
100  
Duty Factor = 0.5  
0.2  
10  
0.1  
1ms  
10ms  
100ms  
1s  
0.1  
0.05  
1
0.02  
0.01  
P

DM  

0.01  
t
T
0.1  
Single Pulse  
10s  
Duty Factor = t/T  
T

A

=25

o  

Single Pulse  
C
Peak T

j

= P

DM

x R

thja

+ T

a  

R

thja

=135

o

C/W  
DC  
0.01  
0.001  
0.0001  
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
1000  
V

DS

(V)  
t , Pulse Width (s)  
Fig 7. Maximum Safe Operating Area  
Fig 8. Effective Transient Thermal Impedance  
4

AP4920GM-HF  
f=1.0MHz  
12  
10  
8
10000  
1000  
100  
I

D

=7A  
V

DS

=15V  
Ciss  
6
Coss  
4
Crss  
2
10  
0
1
5
9
13  
17  
21  
25  
29  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
V

DS

(V)  
Q

G

, Total Gate Charge (nC)  
Fig 9. Gate Charge Characteristics  
Fig 10. Typical Capacitance Characteristics  
3
2.5  
2
100.00  
10.00  
1.00  
0.10  
0.01  
T

j

=150

o  

C
T

j

=25

o  

C
1.5  
1
0.5  
0
0.1  
0.3  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
-50  
0
50  
100  
150  
T

j

,Junction Temperature (
 

o

C)  
V

SD

(V)  
Fig 11. Forward Characteristic of  
Reverse Diode  
Fig 12. Gate Threshold Voltage v.s.  
Junction Temperature  
5

AP4920GM-HF  
V

DS  

R

D  

90%  
V

DS  

TO THE  
OSCILLOSCOPE  
D
0.6x RATED V

DS  

R

G  

G
10%  
V

GS  

+
–
S
V

GS  

10V  
t

d(on)

t

r  

t

d(off)

t

f  

Fig 13. Switching Time Circuit  
Fig 14. Switching Time Waveform  
V

G  

V

DS  

Q

G  

TO THE  
OSCILLOSCOPE  
D
S
4.5V  
0.6 x RATED V

DS  

Q

GD  

Q

GS  

G
V

GS  

+
1~ 3 mA  
–
I
I
D
G
Q
Charge  
Fig 15. Gate Charge Circuit  
Fig 16. Gate Charge Waveform  
6

AP4920GM-HF  
MARKING INFORMATION  
Part Number  
meet Rohs requirement  
for low voltage MOSFET only  
4920GM  
Package Code  
YWWSSS  
Date Code (YWWSSS)  
Y
:
Last Digit Of
 
The Year  
WW
:
Week  
SSS
:
Sequence  
7

ADVANCED POWER ELECTRONICS CORP.  
Package Outline : SO-8  
D
Millimeters  
SYMBOLS  
MIN  
1.35  
0.05  
0.30  
4.80  
5.79  
3.70  
NOM  
MAX  
A
A1  
B
1.55  
1.75  
0.25  
0.51  
5.30  
6.20  
4.10  
8
1
7
6
3
5
4
0.15  
0.41  
E
E1  
D
E
5.05  
6.00  
E1  
e
3.90  
2
1.27 TYP  
0.21  
G
F
0.17  
0.38  
0°  
0.25  
1.27  
8°  
0.83  
e
α
4°  
B
A
1.All Dimension Are In Millimeters.  
A1  
2.Dimension Does Not Include Mold Protrusions.  
.
α
G
F
Draw No.
 
M1-M8-G-v03  

SO-8  
SO-8 FOOTPRINT
:
 
1.27mm  
4.1mm  
6.2mm  
2.1mm  
0.7mm  
.
ADVANCED POWER ELECTRONICS COR
P
.  
Draw No. M1-M8-G-v03