ASDsemi-ASDM40N52E-R

Part #ASDsemi-ASDM40N52E-R
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ASDsemi-ASDM40N52E-R
ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
General Features  
Product Summary  
●
Low On-Resistance  
V

DSS  

40  
V
mΩ  
A
●
100% avalanche tested  
●
Fast Switching Speed  
4
.2  
R

DS(ON)-
Typ  

I

D  

52  
●
Excellent package for good heat dissipation  
Application  
●
DC/DC Converters  
●
On board power for server  
●
Synchronous rectification  
Pin1  
Absolute Maximum Ratings
(T

C

=25
℃
unless otherwise specified)  
Symbol  
Parameter  
Drain-Source Voltage  
Max.  
Units  
V

DSS  

V

GSS  

40  
±20  
52  
V
V
Gate-Source Voltage  
T

C

= 25
℃
 
A
I

D  

Continuous Drain Current  
Pulsed Drain Current

note1  

Single Pulsed Avalanche Energy

note2  

T

C

= 100
℃  
35  
A
I

DM  

EAS  
P

D  

220  
100  
A
mJ  
W
℃
/W  
℃
Power Dissipation  
T

C

= 25
℃  
65  
1.92  
Thermal Resistance, Junction to Case  
R

θJC  

T

J

, T

STG

Operating and Storage
T
e
mperature Range  
-55 to +150  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
1/
8
 

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
Electrical Characteristics
(T

C

=25°C Unless Otherwise Noted)  
ASDM40N
52  
Symbol  
Parameter  
Test Condition  
Unit  
Min.  
Typ.  
Max.  
Static Characteristics  
V

GS

=0V, I

DS

=250µA  
V

DS

=40V, V

GS

=0V  
BV

DSS  

Drain-Source Breakdown Voltage  
40  
45  
V
1
30  
I

DSS  

Zero Gate Voltage Drain Current  
µA  
T

J

=125°C  
V

DS

=V

GS

, I

DS

=250µA  
V

GS

=±20V, V

DS

=0V  
V

GS

=4.5V, I

DS

=20A  
V

GS

=10V, I

DS

=30A  
V

GS(th)  

I

GSS  

1.6  
Gate Threshold Voltage  
Gate Leakage Current  
1
2.5  
±100  
10  
V
nA  
6.5  
4.2  
m
Ω
 
m
Ω  
①
R

DS(ON)  

Drain-Source On-state Resistance  
5.5  
Diode Characteristics  
①
I

SD

=26A, V

GS

=0V  
Diode Forward Voltage  
1.2  
V
ns  
V

SD  

t
rr  
Reverse Recovery Time  
14  
32  
I
SD
=26A, dl
SD
/dt=100A/µs  
Q
rr  
Reverse Recovery Charge  
nC  
②
Dynamic Characteristics  
V

GS

=0V,V

DS

=0V,F=1MHz  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

t

r  

Gate Resistance  
1.2  
980  
160  
80  
6
Ω
V

GS

=0V,  
V

DS

=20V,  
Frequency=1.0MHz  
Input Capacitance  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
10  
24  
5
V

DD

=20V,I

DS

=26A,  
V

GS

=10V,R

G

=4.7
Ω  
ns  
t

d(OFF)  

t

f  

Turn-off Fall Time  
②
Gate Charge Characteristics  
Q

g  

Q

gs  

Q

gd  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
23  
18  
V

DS

=32V, V

GS

=10V,  
I

DS

=26A  
nC  
2.5  
5
Notes:  
①
Pulse test;Pulse width≤300µs, duty cycle≤2%.  
②Guaranteed by design, not subject to production testing.  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
2/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
Test Circuit  
Figure1:Gate Charge Test Circuit & Waveform  
Figure 2: Resistive Switching Test Circuit & Waveforms  
Figure 3:Unclamped Inductive Switching Test Circuit & Waveforms  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
3/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
Typical Electrical and Thermal Characteristics (Curves)  
Drain-Source On Resistance  
10  
8
4.5V  
6
4
10V  
2
0
0
20  
40  
60  
80  
100  
V

DS

– Drain-Source Voltage (V)  
I

D

– Drain Current (A)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
10  
1
V

GS

=10V  
I

DS

=26A  
T

J

=150°C  
T

J

=25°C  
T

J

=25°C  
Rds(on)=3.5m
Ω
 
0.1  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
-50  
-25  
0
25  
50  
75  
100 125 150  
V

SD

– Source-Drain Voltage (V)  
T

J

– Junction Temperature (
°
C)  
Capacitance  
Gate Charge  
2500  
2000  
1500  
1000  
500  
10  
VDS=24V  
IDS=26A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
1
10  
100  
0
10  
20  
30  
Q

G

– Gate Charge (nC)  
V

DS

– Drain-Source Voltage (V)  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
4
/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
Power Dissipation  
Drain Current  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VGS=10V  
50  
0
25  
50  
75  
100  
125  
150  
25  
75  
100  
125  
150  
T

J

– Junction Temperature (
°
C)  
T

J

– Junction Temperature (
°
C)  
Drain Current  
10  
8
Safe Operation Area  
1000  
Ids=26A  
100  
10  
1
10µs  
100µs  
1ms  
10ms  
6
DC  
4
2
T

C

=25°C  
0
0.1  
0
1
2
3
7
8
10  
0.01  
0.1  
1
10  
100  
1000  
V

GS

– Gate-Source Voltage (V)  
V

DS

– Drain-Source Voltage (V)  
Thermal Transient Impedance  
10  
1
Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse  
0.1  
0.01  
Single Pulse  
R

θ
JC

=1.92
°C/W  
0.001  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
Square Wave Pulse Duration (sec)  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
5
/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
Ordering and Marking Information  
Packing  
Quantity  
Ordering Device No.  
ASDM40N52E-R  
Package  
Marking  
40N52  
Tape&Reel  
4000/Reel  
DFN3.3×3.3  
MARKING  
PACKAGE  
DF
N-3
.
3
x
3
.
3  
4
0N52  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
6
/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
D
i
men
si
on
s(
DFN3
×
3
)  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
7
/
8  

ASDM
4
0N
52  
4
0V N-Channel
 
MOSFET  
IMPORTANT NOTICE  
Xi‘an Ascend Semiconductor
incorporated
MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS  
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR  
PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Xi‘an Ascend Semiconductor
Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections  
or other changes without further notice to this document and any product described herein.
Xi‘an Ascend Semiconductor
Incorporated does not  
assume any liability arising out of the application or use of this document or any product described herein; neither does
Xi‘an Ascend  
Semiconductor
Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this  
document or products described herein in such applications shall assume
.
 
all risks of such use and will agree to hold
Ascendsemi
Incorporated and all the companies whose products are represented on
Xi‘an  
Ascend Semiconductor
Incorporated website, harmless against all damages.  
Xi‘an Ascend Semiconductor
Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through  
unauthorized sales channel. Should Customers purchase or use
Xi‘an Ascend Semiconductor
Incorporated products for any unintended or  
unauthorized application, Customers shall indemnify and hold
Xi‘an Ascend Semiconductor
Incorporated and its representatives harmless against  
all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized application.  
www.
ascendsemi
.com  
Ascend Semicondutor Co.,Ltd  
DEC 2018 Version1.0  
8
/
8