BORN-2N7002

Part #BORN-2N7002
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BORN-2N7002
2N7002  
ROHS  
MOSFET  
N-Channel Enhancement-Mode
 
MOSFET  
SOT
–
–
2
3  
Features  
60V/0.2A,  
R

DS(ON)

= 7.5
 
(MAX) @V

GS

= 10
V
.
I
d = 0.5A  
Ω

DS(ON)

= 7.5
 
(MAX) @V

GS

= 5V . Id = 0.05A  
R
Ω
Super High dense cell design for extremely low R

DS(ON) .  

Reliable and Rugged.  
SO
T
–
23 for Surface Mount Package.  
MAXIMUM RANTINGS  
Parameter  
Drain-Source
V
o
ltage  
Symbol  
V

DS  

Limit  
60  
Units  
V
V
A
Gate-Source
V
o
ltage  
V

GS  

±
20  
0.2  
Drain Current-Continuous  
Power Dissipation  
I

D  

P

D  

0.225  
556  
W
℃
/W  
T
h
ermal
R
e
sistance f rom
J
u
ncti
n
o to Ambient  
J
u
nction
T
e
mperature  
R
θ
JA  
150  
T
J
℃
T
stg  
Storage
T
e
mperature  
-50~+150  
Electrical Characteristics  
Parameter  
Off Characteristics  
Symbol  
T
e
st Conditions  
Min  
Typ.  
Max  
Units  
Drain to Source Breakdown
V
o
ltage  
Zero-Gate
V
o
ltage Drain Current  
Gate Body Leakage Current, Forward  
Gate Body Leakage Current, Reverse  
BVDSS  
IDSS  
VGS=0
V
,
I
D=250µA  
VDS=60
V
,
V
GS=0V  
VGS=20
V
,
V
DS=0V  
VGS=-20
V
,
V
DS=0V  
60  
–
–
–
–
–
–
V
1
µA  
nA  
IGSSF  
IGSSR  
–
100  
-100  
–
nA  
On Characteristics  
Gate Threshold
V
o
ltage  
Static Drain-source  
VGS(th)  
VGS= VDS, ID=250
µ
A  
VGS =10
V
,
I
D =0.5A  
VGS =5
V
,
I
D =0.05A  
1
–
–
V
Ω
Ω
7.5  
7.5  
RDS(ON)  
*
On-Resistance  
–
Drain-Source Diode Characteristics and Maximum Ratings  
Drain-Source Diode Forward
V
o
ltage  
VSD  
VGS =0
V
,
I
S=0.2A  
2.5  
V
Notes :  
*Pulse Test : Pulse Width
≤
300µs, Duty Cycle
≤
2%.  
Page 1 of 3  
Rev 8: Nov 2014  

2N7002  
ROHS  
MOSFET  
N-Channel Enhancement-Mode
 
MOSFET  
0.6  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
VGS=4
,
4.5
,
5
,
6
,
7
,
8
~
10V  
0.5  
0.4  
0.3  
0.2  
0.1  
0
VGS=3V  
Tj
=
125
℃  
Tj
=
25
℃  
VGS=2.0V  
0
1
2
VDS,Drain-to-Source Voltage(Volts)  
3
4
5
0
1
2
3
4
5
VGS,Gate-to-Source Voltage(Volts)  
Figure 1
.
Output Characteristics  
Figure 2
.
Transfer Characteristics  
1.7  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
ID=250uA  
I
D=250uA  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
0
50  
Tj.Junction Temperature(℃)  
100  
150  
200  
0
50  
Tj.Junction Temperature(℃)  
100  
150  
200  
Figure 3
.
Breakdown Voltage Variation  
Figure 4
.
Gate Threshold
V
a
riation  
with
T
e
mperature  
with
T
e
mperature  
9
10  
9
8
7
8
7
6
10V/0.5A  
6
VGS=4.5V  
5
4
5
4
VGS=10V  
4.5V/0.2A  
3
3
2
1
0
2
1
0
0
50  
100  
150  
200  
0
0.2  
0.4  
0.6  
0.8  
1
Figure 5
.
O
n

T

–

j

R

.
J

e

u

s

n

i

c

s

t

t

i

a

o
n

n
c

T
e

e

m
p

V

e
r

a

a

r

t

i

u

a

r
e

t

(

i
o

℃

n

)  

Figure 6
.
O
n

I

–

D

R

–
D

e

r

s

a

i

i

s

n

t
a

C
u

n

r

c

r
e

e

n
t

v

(

s

A

.

)

Drain Current  
with Temperature  
Page 2 of 3  
Rev 8: Nov 2014  

2N7002  
ROHS  
MOSFET  
N-Channel Enhancement-Mode
 
MOSFET  
12  
10  
8
10  
Tj
=
150
℃  
6
1
ID=0.5A  
4
Tj
=
25
℃  
ID=0.2A  
2
0
0.1  
0
2
4
6
8
10  
0
0.5  
1
1.5  
2
2.5  
VGS,Gate-to-Source Voltage(Volts)  
VSD-Source-to-Drain Voltage(V)  
Figure 7
.
On-Resistance vs. Gate-to-Source  
Figure 8
.
Source-Drain Diode Forward  
V
o
ltage  
V
o
ltage  
SO
T
–
23 PACKAGE
 
OUTLINE

Plastic surface mounted package  

SOT-23  
(UNIT)
:
mm  
Page 3 of 3  
Rev 8: Nov 2014